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The three major challenges in the power electronics in hybrid and electric vehicles are: System cost, power density and reliability. High temperature power device and packaging technologies increases the power density and reliability while reducing system cost. Advanced Silicon devices with synthesized high-temperature packaging technologies can achieve junction temperature as high as 200C (compared to the present limitation of 150C) eliminating the need for a low-temperature radiator and therefore these devices reduces the system cost. The silicon area needed for a power inverter with high junction temperature capability can be reduced by more than 50 - 75% thereby significantly reducing the packaging space and power device and package cost. Smaller packaging space is highly desired since multiple vehicle platforms can share the same design and therefore reducing the cost further due to economies of scale.

Trans Tech recently debuted the all-electric eTrans school bus providing a total zero emission school bus. The presentation will demonstrate Smith Electric Vehicles and their history with electric vehicles. The presentation will help ensure that everybody has an idea of what the electric school bus will do and to dispel any rumors about the vehicle. Presenter Brian S. Barrington, Trans Tech. Bus

The newly released Distributed System Interface 3 (DSI3) Bus Standard specification defines three modulation levels form which 16 valid symbols are coded. This complex structure is best decoded with symbol pattern recognition. This paper proposes a simplification of the correlation score calculation that sharply reduces the required number of operations. Additionally, the paper describes how the pattern recognition is achieved using correlation scores and a decoding algorithm. The performance of this method is demonstrated by mean of simulations with different load models between the master and the sensors and varying noise injection on the channel. We prove than the pattern recognition can decode symbols without any error for up to 24dBm.

In this paper, we propose a hardware and a software design method considering functional safety for an electro-mechanical brake (EMB) control system which is used as a brake actuator in a brake-by-wire (BBW) system. A BBW system is usually composed of electro-mechanical calipers, a pedal simulator, and a control system. This simple by-wire structure eliminates the majority of bulky hydraulic brake devices such as boosters and master cylinders. The other benefit of a BBW system is its direct and independent response; this leads to enhanced controllability, thus resulting in not only improved basic braking performance but also considerably easier cooperative regenerative braking in hybrid, fuel-cell, and electric cars. The importance of a functional safety based approach to EMB electronic control unit (ECU) design has been emphasized because of its safety critical functions, which are executed with the aid of many electric actuators, sensors, and application software.

In-vehicle communication faces increasing bandwidth demands, which can no longer be met by today's MOST150, FlexRay or CAN networks. In recent years, Fast Ethernet has gained a lot of momentum in the automotive world, because it promises to bridge the bandwidth gap. A first step in this direction is the introduction of Ethernet as an On Board Diagnostic (OBD) interface for production vehicles. The next potential use cases include the use of Ethernet in Driver Assistance Systems and in the infotainment domain. However, for many of these use cases, the Fast Ethernet solution is too slow to move the huge amount of data between the Domain Controllers, ADAS Systems, Safety Computer and Chassis Controller in an adequate way. The result is the urgent need for a network technology beyond the Fast Ethernet solution. The question is: which innovation will provide enough bandwidth for domain controllers, fast flashing routines, video data, MOST-replacement and internal ECU buses?

Recently, vehicle networks have increased complexity due to the demand for autonomous driving or connected devices. This increasing complexity requires high bandwidth. As a result, vehicle manufacturers have begun using Ethernet-based communication for high-speed links. In order to deal with the heterogeneity of such networks where legacy automotive buses have to coexist with high-speed Ethernet links vehicle manufacturers introduced a vehicle gateway system. The system uses Ethernet as a backbone between domain controllers and CAN buses for communication between internal controllers. As a central point in the vehicle, the gateway is constantly exchanging vehicle data in a heterogeneous communication environment between the existing CAN and Ethernet networks. In an in-vehicle network context where the communications are strictly time-constrained, it is necessary to measure the delay for such routing task.

A main challenge when developing next generation architectures for automated driving ECUs is to guarantee reliable functionality. Today’s fail safe systems will not be able to handle electronic failures due to the missing “mechanical” fallback or the intervening driver. This means, fail operational based on redundancy is an essential part for improving the functional safety, especially in safety-related braking and steering systems. The 2-out-of-2 Diagnostic Fail Safe (2oo2DFS) system is a promising approach to realize redundancy with manageable costs. In this contribution, we evaluate the reliability of this concept for a symmetric and an asymmetric Electronic Power Steering (EPS) ECU. For this, we use a Markov chain model as a typical method for analyzing the reliability and Mean Time To Failure (MTTF) in majority redundancy approaches. As a basis, the failure rates of the used components and the microcontroller are considered.

With the introduction of the ISO26262 automotive safety standard there is a burden of proof to show that the processing elements in embedded microcontroller hardware are capable of supporting a certain diagnostic coverage level, depending on the required Automotive Safety Integrity Level (ASIL). The current mechanisms used to provide actual metrics of the Built-in Self Tests (BIST) and Lock Step comparators use Register Transfer Level (RTL) simulations of the internal processing elements which force faults into individual nodes of the design and collect diagnostic coverage results. Although this mechanism is robust, it can only be performed by semiconductor suppliers and is costly. This paper describes a new solution whereby the microcontroller is synthesized into a large Field Programmable Gate Array (FPGA) with a test controller on the outside.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers with incredible levels of peripheral integration. As a result, performance can no longer be measured in MIPS (Millions of Instructions Per Second). A microcontroller's effectiveness is based on coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, the designer needs benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment.

Today the majority of power electronics is developed based on the requirements set by the main fields of application e.g. power generation, power supply, industrial drive and traction. With introduction to automotive applications new requirements have to be taken into account. This paper discusses how interconnection technologies for power semiconductors can be improved to meet the demand for higher temperature capability in HEV applications.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers whose performance can no longer be measured in MIPS. Instead, their effectiveness is based on a coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, what the designer needs are benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment. This presentation will explore the role of new benchmarks in the development of complex automotive applications.

The increasingly stringent requirements in relation to emission reduction and onboard diagnostics are pushing the Chinese automotive industry toward more innovative solutions and a rapid increase in electronic control performance. To manage the system complexity the architecture will require being well structure on hardware and software level. The paper introduces GEMS-K1 (Gasoline Engine Management System - Kit 1). GEMS-K1 is a platform being compliant with Euro IV emission regulation for gasoline engines. The application software is developed using modeling language, the code is automatically generated from the model. The driver software has a well defined structure including microcontroller abstraction layer and ECU abstraction layer. The hardware is following design rules to be robust, 100% testable and easy to manufacture. The electronic components use the latest innovation in terms of architecture and technologies.

This paper considers the verification of non-standard CAN network topologies of the physical layer at high speed transmission rate (500.0Kbps and 1.0Mbps). These network topologies including single star, multiple stars, and hybrid topologies (multiple stars in combination with linear bus or with ring topology) are simulated by using behavior modeling language (VHDL-AMS) in comparison to measurement. Throughout the verification process, CAN transceiver behavioral model together with other CAN physical layer simulation components have been proved to be very accurate. The modeling of measurement environment of the CAN network is discussed, showing how to get the measurement and simulation results well matched. This demonstrates that the simulation solution is reliable, which is highly desired and very important for the verification requirement in CAN physical layer design.

As the automotive industry quickly moves towards hybridized and electrified vehicles, the optimal integration of power electronics in these vehicles will have a significant impact not only on the cost, performance, reliability, and durability; but ultimately on customer acceptance and market success of these technologies. If properly executed with the right cost, performance, reliability and durability, then both the industry and the consumer will benefit. It is because of these interdependencies that the pace and scale of success, will hinge on effective collaboration. This collaboration will be built around the convergence of automotive and industrial technology. Where real time embedded controls mixes with high power and voltage levels. The industry has already seen several successful collaborations adapting power electronics to the automotive space in target vehicles.

Infineon's latest high-end automotive microcontrollers like TC1796 are complex Systems On Chip (SoC) with two processor cores and up to two internal multi-master buses. The complex interaction between cores, peripherals and environment provides a big challenge for debugging. For mission critical control like engine management the debugging approach must not be intrusive. The provided solution are dedicated Emulation Devices which are able to deal with several 10 Gbit/s of raw internal trace data with nearly no cost adder for mass production and system design. Calibration, which is used later in the development cycle, has different requirements, but is covered by the Emulation Devices as well. The architecture of TC1796ED comprises the unchanged TC1796 silicon layout, extended by a full In-Circuit Emulator (ICE) and calibration overlay memory on the same die. In most cases, the only debug/calibration tool hardware needed is a USB cable.

Driven by factors like consumption, power output per liter, comfort and more stringent exhaust gas standards the powertain control area, has developed rapidly in the last decades. This trend has also brought with it many innovations in the ignition application. Today we can see a trend to Pencil-coil or Plug-top-coil ignition systems. The next step in system partitioning is to remove the power driver from the ECU and place it directly in/on the coil body. The advantages of the new partitioning - e.g. no high voltage wires, reduced power dissipation on the ECU - are paid with different, mainly tougher requirements for the electronic components. By using specialized technologies for the different functions - IGBT for switching the power, SPT for protection, supply and diagnostics - in chip-on-chip technology all required functions for a decentralized ignition system can be realized in a TO220/ TO263 package.

More and more passenger cars are equipped with passive side protection systems such as thorax airbags for front and rear passengers. In the past, side airbag protection systems used sensors based on acceleration measurements [1]. In the meantime different sensor principles have been tested in order to increase the performance of this application. The intention has been to achieve faster firing decisions and to decrease the misuse risk for a floor or chassis impact. This paper presents the partitioning of an advanced chipset for pressure and acceleration based airbag systems. It shows the communication link between the sensors, the receiver-IC and other blocks in the application.

As the demand for enhanced comfort, safety and differentiation with new features continues to grow and as electronics and software enable most of these, the number of electronic units or components within automobiles will continue to increase. This will increase the overall system complexity, specifically with respect to the number of controller actuators such as e-motors. However, hard constraints on cost and on physical boundaries such as maximum power dissipation per unit and pin-count per unit/connector require new solutions to alternative system partitioning. Vehicle manufacturers, as well as system and semiconductor suppliers are striving for increased scalability and modularity to allow for most cost optimal high volume configurations while featuring platform reuse and feature differentiation. This paper presents new semiconductor based approaches with respect to technologies, technology mapping and assembly technologies.

Electronic throttle systems are becoming more and more important in today's motor vehicles. These systems consist of: a throttle valve with an electrical actuator and a transmission a position feedback an electronic acceleration pedal an electronic control unit (ECU) a semiconductor h-bridge for driving the motor. The electronic acceleration pedal gives a set point to the ECU. A control signal is generated and moves the motor of the throttle valve with a semiconductor h-bridge to the requested position. The voltage drop of a potentiometer is used here as control feedback signal. The potentiometer in the throttle valve is moved very often and has a rough environment like high temperature and vibrations. Therefore this system has a lot of problems with mechanical attrition and reliability during the whole system lifetime. The accuracy of the position control decreases over time.

Modern semiconductor devices enable highly efficient conversion of electrical power. Together with the microcontroller, they are the key elements for generation of the alternating currents from the car's DC supply that are necessary to drive high-performance units such as starter-alternators. These allow the combustion engine to crank up in several 100 ms and deliver up to 15 kW of electrical power. Smart driver ICs such as the TLE6280 enable the fast development of the interface between the microcontroller and the power switches. Currents of some 100A can be handled with the new OptiMOS FETs. Their rugged and ultra-low ohmic technology and their innovative packaging concepts, such as Power Modules and Power-Bonded MOSFETs, allow the building of compact and efficient control units.