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VGCF/Carbon composites have been shown to demonstrate high thermal conductivity, comparable to that of CVD diamond, implying utility in high performance electronic packaging. VGCF/carbon composites are unlike diamond in that, typical of most fiber reinforced composites, designed physical properties are incorporated into the composite through fiber architecture. Thermal performance for die cooling is frequently determined by the thermal impedance of the package, measured from the junction to ambient, ϕja, or jucntion to case, ϕjc. This paper reports the results of this test on VGCF/carbon composites with a 1D architecture.

Metal matrix composites (MMCs) reinforced with vapor-grown carbon fiber (VGCF) may offer thermal conductivity superior to materials currently used for thermal management while also providing an adjustable coefficient of thermal expansion (CTE) and low density. Extrapolating from results on aluminum MMC with lower loadings of VGCF suggest that aluminum and copper MMCs can attain a best-direction conductivity in excess of 1000 W/m-K. Alternatively, isotropic in-plane conductivity may reach up to 800 W/m-K, while matching the CTE of important semiconducting materials.