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This specification covers one type of glass cloth impregnated with a heat-reactive, thermosetting, solution-addition-type PMR-15 polyimide resin system, supplied in the form of continuous rolls of full width cloth or slit tape.

This specification covers one type of glass cloth impregnated with a heat-reactive, thermosetting, solution-addition-type PMR-15 polyimide resin system, supplied in the form of continuous rolls of full width cloth or slit tape.

This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.

This recommended practice describes the physical and chemical characterization techniques for identification of epoxy adhesive and prepreg resin systems in order to verify the chemical formulation, resin B-staging (See 8.1), cure reaction rates, adhesive moisture content, and resin component mix ratios, as necessary to achieve manufacturing and quality producibility and engineering performance.