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Induction machines (IM) are considered work horse for industrial applications due to their rugged, reliable and inexpensive nature; however, their low power density restricts their use in volume and weight limited environments such as an aerospace, traction and propulsion applications. Given recent advancements in additive manufacturing technologies, this paper presents opportunity to improve power density of induction machines by taking advantage of higher slot fill factor (SFF) (defined as ratio of bare copper area to slot area) is explored. Increase in SFF is achieved by deposition of copper in much more compact way than conventional manufacturing methods of winding in electrical machines. Thus a design tradeoff study for an induction motor with improved SFF is essential to identify and highlight the potentials of IM for high power density applications and is elaborated in this paper.

Honda R&D Technical Review is a periodical containing research papers related to Honda R&D Center activities worldwide that cover automobile, motorcycle, power products, aircraft engine, and other fundamental technologies. Honda Motor offers a book for the April 2021 issue with 104 pages containing 12 papers focusing on the following latest topics: Technology for Prediction of Contactor Noise for Electric-powered Vehicle Batteries Reduction of Internal Resistance in High Capacity Lithium-ion Batteries with 3D Lattice-structured Electrode Predictive Technique for Seat Belt Submarining Injury by Triaxial Iliac Load Cell

This specification covers all-metal, self-locking nuts, plate nuts, and gang channel nuts made of a carbon or low-alloy steel.

This specification covers all-metal, self-locking, prevailing-torque nuts, plate nuts, and gang channel nuts made of a carbon or low-alloy steel.

This document describes the technical requirements, architectural options, and recommended interface standards to support an Autonomous Distress Tracking (ADT) System intended to meet global regulatory requirements for locating aircraft in distress situations and after an accident. This document is prepared in response to International Civil Aviation Organization (ICAO) and individual Civil Aviation Authorities (CAAs) initiatives.

This Digital Annex (DA) contains the current, full-PDF version of ARP5149B, Training Program Guidelines for Deicing/Anti-Icing of Aircraft on Ground, as well as .jpeg format files of Appendix D, Application Guidelines Configuration, Critical Component, and Spray Area Diagrams for Aircraft. The .jpeg diagram files may be used by purchasers in accordance with the terms of the included license agreement.

The 12 papers in this techncial paper collection represent research in the areas of welding, riveting, joining, and fastening for automotive applications. Papers focus on the recent advances in the process optimization, analytical solution, numerical modeling, response evaluation as well as static and dynamic testing of traditional resistance spot welds, gas metal arc welds, friction stir spot welds, laser welds, rivets, mounts, adhesives, and fasteners.

The 16 papers in this technical paper colection present advancement of auto safety-related technologies that deal with roof crush testing, pedestrian safety, front, side and rear impact, simulation of interior head impact, FE study of factors on risk of KTH injuries in frontal impact, CAE methods and testing, and field modeling and assessment techniques.

This technical paper collection contains 20 papers presenting new technologies and research in the area of vehicle rear-end collision, rollover collision and lateral impacts. Papers may be related to analysis of crash compatibility, statistical data analysis, design of vehicle systems, biomechanics and dummy development. To see a listing of papers included in this special publication, click on the papers link below.

This technical paper collection includes 8 papers from OEMs, suppliers, and academia detailing current brake engineering issues and technology. Topics covered include: NVH, controls, modeling, testing, brake drag, and hardware-in-the-loop evaluations.