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Development of a new Industry Standard related to GIDEP Reporting.

This document describes a process for use by ADHP integrators of EEE parts and sub-assemblies (items) that have been targeted for other applications. This document does not describe specific tests to be conducted, sample sizes to be used, nor results to be obtained; instead, it describes a process to define and accomplish application-specific qualification; that provides confidence to both the ADHP integrators, and the integrators’ customers, that the item will performs its function(s) reliably in the ADHP application.

This document defines the requirements for developing an Electronic Components Management Plan (ECMP), hereinafter also called the Plan, to assure customers and regulatory agencies that all of the electronic components in the equipment of the Plan owner are selected and applied in controlled processes compatible with the end application; and that the Technical Requirements detailed in clause 5.0 are accomplished. In general the owners of a complete Electronic Components Management Plan are avionics equipment manufacturers.

This document applies to the development of Plans for integrating and managing electronic components in equipment for the military and commercial aerospace markets; as well as other ADHP markets that wish to use this document. Examples of electronic components, as described in this document, include resistors, capacitors, diodes, integrated circuits, hybrids, application specific integrated circuits, wound components, and relays. It is critical for the Plan owner to review and understand the design, materials, configuration control, and qualification methods of all “as-received” electronic components, and their capabilities with respect to the application; identify risks, and where necessary, take additional action to mitigate the risks. The technical requirements are in Clause 3 of this standard, and the administrative requirements are in Clause 4.

This document applies to the development of Plans for integrating and managing electronic components in equipment for the military and commercial aerospace markets; as well as other ADHP markets that wish to use this document. Examples of electronic components, as described in this document, include resistors, capacitors, diodes, integrated circuits, hybrids, application specific integrated circuits, wound components, and relays. It is critical for the Plan owner to review and understand the design, materials, configuration control, and qualification methods of all “as-received” electronic components, and their capabilities with respect to the application; identify risks, and where necessary, take additional action to mitigate the risks. The technical requirements are in Clause 3 of this standard, and the administrative requirements are in Clause 4.

This document applies to the development of Plans for integrating and managing electronic components in equipment for the military and commercial aerospace markets; as well as other ADHP markets that wish to use this document. Examples of electronic components, as described in this document, include resistors, capacitors, diodes, integrated circuits, hybrids, application specific integrated circuits, wound components, and relays. It is critical for the Plan owner to review and understand the design, materials, configuration control, and qualification methods of all “as-received” electronic components, and their capabilities with respect to the application; identify risks, and where necessary, take additional action to mitigate the risks. The technical requirements are in Clause 3 of this standard, and the administrative requirements are in Clause 4.

This ARP is not a certification document; it contains no certification requirements beyond those already contained in existing certification documents. The purpose of this ARP is to provide more detailed descriptions of the 12 hardware-related COTS issues listed in Appendix B, and to provide recommendations on existing practices, processes, and methods to address them. This ARP also describes artifacts that may be used as evidence that the issues have been addressed. The recommended practices and artifacts may be used to facilitate communication between, for example, the provider and the user of the avionics systems into which COTS components are integrated, or between the applicant for certification and the certification body. This ARP does not claim that the recommended practices and artifacts described in this ARP are the only acceptable ones.

This document applies to the development of Plans for integrating and managing COTS assemblies in electronic equipment and Systems for the commercial, military, and space markets; as well as other ADHP markets that wish to use this document.

This document applies to the development of Plans for integrating and managing COTS assemblies in electronic equipment and Systems for the commercial, military, and space markets; as well as other ADHP markets that wish to use this document. For purposes of this document, COTS assemblies are viewed as electronic assemblies such as printed wiring assemblies, relays, disk drives, LCD matrices, VME circuit cards, servers, printers, laptop computers, etc. There are many ways to categorize COTS assemblies1, including the following spectrum: At one end of the spectrum are COTS assemblies whose design, internal parts2, materials, configuration control, traceability, reliability, and qualification methods are at least partially controlled, or influenced, by ADHP customers (either individually or collectively). An example at this end of the spectrum is a VME circuit card assembly.

This standard defines the requirements used by the Plan owner to develop a DMSMS Management Plan, hereinafter referred to as the Plan. The requirement to develop a DMSMS Management Plan could come from a number of different sources, such as a contractual or customer requirement or a desire by the Plan owner to document their standard process. The process described in the Plan is intended to mitigate DMSMS risks and resolve DMSMS issues on ADHP equipment provided by the Plan owner.

This document defines the requirements for developing a DMSMS Management Plan, hereinafter also called the Plan, to assure customers that the Plan owner is using a proactive DMSMS process for minimizing the cost and impact that part and material obsolescence will have on equipment delivered by the Plan owner. The technical requirements detailed in clause 5 ensure that the Plan owner can meet the requirement of having a process to address obsolescence as required by Industry Standards such as EIA-4899 “Standard for Preparing an Electronic Components Management Plan” and DoD Programs as required by MIL-STD-3018 “Parts Management”. Owners of DMSMS Management Plans include System Integrators, Original Equipment Manufacturers (OEM), and logistics support providers.