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Technical Paper

A Novel Dissipative Acoustic Material

2021-08-31
2021-01-1128
Due to modern trends in the automotive industry, such as vehicle electrification, light-weighting, reduced NVH (Noise, Vibration and Harshness) packaging space, etc., it is desirable to have a low profile and light-weight acoustic material with multi-functionality. If one single layer of a thin acoustic material can provide comparable absorption and transmission loss to a multilayer treatment, it will benefit the industry by saving weight, packaging space and system cost. Acoustic absorption and sound transmission loss performance of a new dissipative material at reduced weight and thickness is introduced in this paper. The acoustic performance of the material was evaluated by using random incidence absorption and transmission loss as well as in-vehicle experiment. Further potential applications for this material have been identified using the Statistical Energy Analysis (SEA) method with panel leakage considered.
Technical Paper

Wafer Applied Underfill – Delivering Flip Chip to the Mainstream

2002-03-04
2002-01-1050
Flip Chip packaging has found limited use for a technology that was introduced decades ago. Its application widened with the use of underfill, a necessary constituent to minimizing CTE mismatch between the component and substrate. Its reliability has been established on laminate substrates for automotive applications, an important development in light of the continuous increase in vehicle electronic content and function. Unfortunately, the assembly process incorporating underfill is cumbersome and batch-like. Also, the adhesive strength of the underfill depends critically on the cleanliness of the die after reflow, necessitating costly cleaning equipment and complex process monitoring protocols. Hence, the process of manufacturing is not SMT-friendly. A new technology, Wafer Applied Underfill (WAU), addresses the shortcomings of the traditional underfill process.
Technical Paper

Container Deformation Procedure for Ceramic Monolith Catalytic Converters

2000-03-06
2000-01-0217
A typical automotive catalytic converter is constructed with a ceramic substrate and a steel shell. Due to a mismatch in coefficients of thermal expansion, the steel shell will expand away from the ceramic substrate at high temperatures. The gap between the substrate and shell is usually filled with a fiber composite material referred to as “mat.” Mat materials are compressed during assembly and must maintain an adequate pressure around the substrate under extreme temperature conditions. The container deformation measurement procedure is used to determine catalytic converter shell expansion during and after a period of hot catalytic converter operation. This procedure is useful in determining the potential physical durability of a catalytic converter system, and involves measuring converter shell expansion as a function of inlet temperature. A post-test dimensional measurement is used to determine permanent container deformation.
Technical Paper

Investigation of Shortcomings/Limitations of Industrial Standard 278 of the Verband der Automobilindustrie for Measuring Volatile Organic Compounds

2023-06-26
2023-01-5038
The Verband der Automobilindustrie (VDA) 278 is an industry method widely used to measure volatile organic compounds (VOCs). It is most commonly used in the automobile industry to measure and regulate VOC and FOG levels in automotive parts as a safety regulation. The current VDA 278 method has issues from poor accuracy, precision, and reproducibility. There is variability in data due to differences in sample type and handling as well as instrument model. There is little understanding on the reproducibility of measurements of different sample types analyzed on different makes of instruments using VDA 278 analysis. In this work, a round-robin study is performed on diverse sample types, using different makes of instruments in laboratories across the world. It uses improved method conditions developed internally, for better reproducibility, that reduce sources of error.
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