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Technical Paper

Thermal Behavior of an Electronics Compartment with Respect to Real Driving Conditions

2020-04-14
2020-01-1299
The reliability of electronic components is of increasing importance for further progress towards automated driving. Thermal aging processes such as electromigration is one factor that can negatively affect the reliability of electronics. The resulting failures depend on the thermal load of the components within the vehicle lifetime - called temperature collective - which is described by the temperature frequency distribution of the components. At present, endurance testing data are used to examine the temperature collective for electronic components in the late development stage. The use of numerical simulation tools within Vehicle Thermal Management (VTM) enables lifetime thermal prediction in the early development stage, but also represents challenges for the current VTM processes [1, 2]. Due to the changing focus from the underhood to numerous electronic compartments in vehicles, the number of simulation models has steadily increased.
Technical Paper

Reduced Model of a Vehicle Cabin for Transient Thermal Simulation

2018-05-30
2018-37-0022
In the proposed work the transient thermal modeling of a vehicle cabin has been performed. Therefore, a reduced model has been developed based on a one-node discretization of the cabin air. The conduction in the solid parts is accounted for by a one-dimensional heat transfer approach, the radiation exchange between the surfaces is based on view factors adopted from a 3D reference and the convective heat transfer from the cabin surfaces to the cabin air is conducted with the help of heat transfer coefficients calculated in a 3D reference simulation. The cabin surface is discretized by planar wall elements, including the outer shell of the cabin and inner elements such as seats. Each wall element is composed of several homogeneous material layers with individual thicknesses. Investigations have been conducted on the temporal and spatial resolution of the layer structure of these wall elements, for the 3D model as well as for the reduced one.
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