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The reliability of electronic components is of increasing importance for further progress towards automated driving. Thermal aging processes such as electromigration is one factor that can negatively affect the reliability of electronics. The resulting failures depend on the thermal load of the components within the vehicle lifetime - called temperature collective - which is described by the temperature frequency distribution of the components. At present, endurance testing data are used to examine the temperature collective for electronic components in the late development stage. The use of numerical simulation tools within Vehicle Thermal Management (VTM) enables lifetime thermal prediction in the early development stage, but also represents challenges for the current VTM processes [1, 2]. Due to the changing focus from the underhood to numerous electronic compartments in vehicles, the number of simulation models has steadily increased.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers with incredible levels of peripheral integration. As a result, performance can no longer be measured in MIPS (Millions of Instructions Per Second). A microcontroller's effectiveness is based on coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, the designer needs benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment.

As for passenger cars, the overall noise and vibration comfort in commercial trucks and busses becomes an increasingly important sales argument. In order to effectively reduce the noise and vibration levels it is required to identify possible NVH issues at an early stage in the vehicle development process. For this reason a so-called “Virtual Transfer Path Analysis” (VTPA) method has been implemented which combines the results obtained from the conventional multi-body simulation and finite element method approaches. The resulting VTPA tool enables Daimler Trucks to systematically investigate and predict the complex interaction between powertrain excitation and the resulting vehicle response well before hardware prototypes become available. An overview of the theory is presented as well as the practical application and outcome of the technique applied in a past product development.

The increasing legal requirements for safety, emission reduction, fuel economy and onboard diagnosis systems push the market for more innovative solutions with rapidly increasing complexity. Hence, the embedded systems that will have to control the automobiles have been developed at such an extent that they are now equivalent in scale and complexity to the most sophisticated avionics systems. This paper will demonstrate the key elements to provide a powerful, scalable and configurable solution that offers a migration pass to evolution and even revolution of automotive Sensors and Sensor interfaces. The document will explore different architectures and partitioning. Sensor technologies such as magnetic field sensors based on the hall effect as well as bulk and surface silicon micro machined sensors will be mapped to automotive applications by examples. Functions such as self-test, self-calibration and self-repair will be developed.

Safety-critical embedded software has to satisfy stringent quality requirements. All contemporary safety standards require evidence that no data races and no critical run-time errors occur, such as invalid pointer accesses, buffer overflows, or arithmetic overflows. Such errors can cause software crashes, invalidate separation mechanisms in mixed-criticality software, and are a frequent cause of errors in concurrent and multi-core applications. The static analyzer Astrée has been extended to soundly and automatically analyze concurrent software. This novel extension employs a scalable abstraction which covers all possible thread interleavings, and reports all potential run-time errors, data races, deadlocks, and lock/unlock problems. When the analyzer does not report any alarm, the program is proven free from those classes of errors. Dedicated support for ARINC 653 and OSEK/AUTOSAR enables a fully automatic OS-aware analysis.

Driven by the growing internet and remote connectivity of automobiles, combined with the emerging trend to automated driving, the importance of security for automotive systems is massively increasing. Although cyber security is a common part of daily routines in the traditional IT domain, necessary security mechanisms are not yet widely applied in the vehicles. At first glance, this may not appear to be a problem as there are lots of solutions from other domains, which potentially could be re-used. But substantial differences compared to an automotive environment have to be taken into account, drastically reducing the possibilities for simple reuse. Our contribution is to address automotive electronics engineers who are confronted with security requirements. Therefore, it will firstly provide some basic knowledge about IT security and subsequently present a selection of automotive specific security use cases.

This paper will give an overview of multicore in automotive applications, covering the trends, benefits, challenges, and implementation scenarios. The automotive silicon industry has been building multicore and multiprocessor systems for a long time. The reasons for this choice have been: increased performance, safety redundancy, increased I/O & peripheral, access to multiple architectures (performance type e.g. DSP) and technologies. In the past, multiprocessors have been mainly considered as multi-die, multi-package with simple interconnection such as serial or parallel busses with possible shared memories. The new challenge is to implement a multicore, micro-processor that combines two or more independent processors into a single package, often a single integrated circuit (IC). The multicores allow a computing device to exhibit some form of thread-level parallelism (TLP).

Since 2013 the new Daimler Aeroacoustic Wind Tunnel (AAWT) is in operation at the Mercedes-Benz Technology Center in Sindelfingen, Germany. This construction was the second stage of a wind tunnel center project, which was launched in 2007 and started with the climatic wind tunnels including workshop and office areas. The AAWT features a test facility for full-scale cars and vans with a nozzle exit area of 28 m2, a five-belt system, and underfloor balance to measure forces with best possible road simulation. With a remarkable low background noise level of the wind tunnel, vehicle acoustics can be investigated under excellent conditions using high-performance measurement systems. An overview is given about the building and the design features of the wind tunnel layout. The aerodynamic and aeroacoustic properties are summarized. During the first years of operation, further improvements regarding the wind tunnel background noise and vehicle handling were made.