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The development of future automotive electronic systems requires new concepts in the software architecture, development methodology and information exchange. At Bosch an XML and MSR based technology is applied to achieve a consistent information handling throughout the entire software development process. This approach enables the tool independent exchange of information and documentation between the involved development partners. This paper presents the software architecture, the specification of software components in XML, the process steps, an example and an exchange scenario with an external development partner.

The official Indian accident statistics show that the number of road accidents and fatalities are one of the highest worldwide. These official statistics provide important facts about the current accident situation. It is suspected that for various reasons not all accidents are reported to the official statistic. This study estimates the degree of underreporting of traffic accidents with casualties in India. In order to get a national overview of the traffic accident situation it is necessary to improve the knowledge about underreported accidents. Therefore, the in-depth accident database of “Road Accident Sampling System India” (RASSI) was analyzed [1]. This project is organized by a consortium that has collected traffic accidents scientifically in four different regions since 2011 on the spot which have been reported either by police or by local hospitals and own patrol by RASSI engineers.

A single-chip integrated barometric pressure sensor using bulk silicon micromachining will be presented in this paper. The sensor chip incorporates the complete signal evaluation and trimming of the temperature coefficients and manufacturing tolerances. Sensor chips are mounted onto 6″ × 4″ thick film substrates for batch processing during assembly and trimming. The separated, individual devices can be used for surface mounting (SMD) on a printed circuit board (PCB). Specifications for the sensor functions, as well as the assembly and packaging concept, will be discussed. Assembly, trimming and packaging are the most expensive production steps in the manufacture of sensors. In order to reduce the costs for sensors, we are introducing a standardization of sensor assembly and trimming with batch processing capability: after dicing, the integrated sensor chip is attached to a 6″ × 4″ thick film ceramic substrate with standard die-attaching glue.