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The thermal design requirements at transient state condition are becoming progressively more common in automotive electronic products specifications. For studying the characteristics of heatsink design and CFD thermal analysis in transient state environment, the theories about heat transfer at transient state condition are researched. Some key factors heavily affecting the thermal performance of heatsink are discussed, such as the thickness of heatsink base, the processes of heatsink surfaces and the intervals definitions of whole computation duration in transient state thermal simulation. Then some conclusions of those factors are summarized. Lastly, for an automotive amplifier heatsink design as example, those conclusions are studied and described further based on the correlation of test and analysis results.