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Technical Paper

Temperature Control Analysis for the U.S. Lab, Node 1, and Elements Attached to Node 1

1997-07-14
972564
The International Space Station (ISS) Temperature and Humidity Control (THC) system has been designed with the intent of supplying the air cooling needs of various elements from the U.S. Lab heat exchanger assembly. Elements without independent air cooling capability are known as “parasitic” elements; these are Node 1, the Cupola, and the Mini Pressurized Logistics Module (MPLM). Analysis results are presented which show expected temperatures in the MPLM, and Node 1, as various heat loads are present in the respective elements. Analyses within this paper are coordinated with the results obtained from the Development Test of the complex USL/Node 1 integrated ducting system. This test was conducted in the summer of 1995, at the McDonnell Douglas test facility in Huntington Beach, California.
Technical Paper

Space Station THC/IMV Development Test/Analysis Correlations and Flight Predictions

1997-07-14
972565
The International Space Station (ISS) Temperature and Humidity Control/Intermodule Ventilation (THC/IMV) system for the U.S. Lab provides required cooling air for the U.S. Lab and also provides “parasitic” cooling air for Node 1 and its attached elements. This scheme provides cooled air from the Lab THC directly to Node 1 and also to elements attached to Node 1, at different stages of Space Station assembly. A development test of the U.S. Lab and Node 1/attached elements' integrated THC/IMV ducting system was performed in the summer of 1995. This test included the U.S. Lab's development level Common Cabin Air Assembly (CCAA), which removes sensible and latent heat from the circulated and ducted cabin air. A referenced 1996 ICES Paper contains the initial correlation results. An analytical model has been developed, which has been used to predict flow and pressure drop performance of the system for several potential and actual changes from the Development Test configuration.
Technical Paper

Application of Temperature Sensitive Paint Technology to Boundary Layer Analysis

1997-10-01
975536
Temperature Sensitive Paint (TSP) technology coupled with the Reynolds number capability of modern wind tunnel test facilities produces data required for continuing development of turbulence models, stability codes, and high performance aerodynamic design. Data in this report include: the variation in transition location with Reynolds number in the boundary layer of a two-dimensional high speed natural laminar flow airfoil (HSNLF) model; additional bypass mechanisms present, such as surface roughness elements; and, shock-boundary layer interaction. Because of the early onset of turbulent flow due to surface roughness elements present in testing, it was found that elements from all these data were necessary for a complete analysis of the boundary layer for the HSNLF model.
Technical Paper

Incipient Failure Detection - The Detection of Certain Contaminating Processes

1967-02-01
670633
Three separate and distinct electrolytic and one galvanic process were identified by visual inspection, metallographic, electron microprobe, and x-ray diffraction analysis in a clocked, flip-flop integrated circuit flat pack and/or the associated printed circuit test jig (two on flat pack and two on circuit board). These four processes were all found to be detectable by the use of noise measurements in microvolts per root cycle at 1000 Hz (cycles per second). The direct current applied for noise measurement to the integrated circuit devices was 100 micro-amperes, as compared to the 6-8 milliamperes required for normal operation. After initial experimentation, the devices were caused to fail in a laboratory ambient environment, followed by an acceleration of the rate of electrolytic reaction through the use of essentially 100 percent relative humidity, versus the upper specification limit of 80 to 98% relative humidity.
Technical Paper

Problems of Maintaining Equipment Containing Integrated Circuits

1967-02-01
670639
This paper discusses some of the problems of developing and maintaining equipment containing integrated circuits. The problems discussed fall into three categories: (1)Processing, (2) Fault Isolation, and (3) Human Error. Quantitative study of these problems shows the highest number were experienced during preliminary-manufacturing and testing (screening and burn-in), with a decrease during final manufacturing checkout (board assembly and final testing) and a minimum during the system operational period. The paper concludes that maintainability is still the necessity it was even with the advent of reliable integrated circuits. This is substantiated by the many failures and defects encountered during manufacturing and development phases. Manufacturing economics force the consideration of maintainability in integrated circuit design.
Technical Paper

Radar Detection of Turbulence in the Upper Troposphere

1966-02-01
660187
Encounters of jet aircraft with high altitude turbulence prompted the investigation of various techniques to probe and locate turbulence in areas lacking particles (rain drops, hailstones). A promising technique is to measure the radio refractive eddies and gradients by radar backscatter. Radio refractive index eddies can, in principle, be found where an atmosphere characterized by a nonadiabatic lapse rate of refractive index is stirred up by turbulence. A sequence of VHF backscatter experiments which will hopefully lead up to an airborne CAT detector are presented in this paper.
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