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Journal Article

Sideglass Turbulence and Wind Noise Sources Measured with a High Resolution Surface Pressure Array

2015-06-15
2015-01-2325
The authors report on the design and application of a high resolution micro-electro-mechanical (MEMS) microphone array for automotive wind noise engineering. The array integrates both sensors and random access memory (RAM) chips on a flexible circuit board that eliminates high channel count wiring and allows the array to be deployed on automobile surfaces in a convenient “stick-on/peel-off” configuration. These arrays have potential application to the quantitative evaluation of interior wind noise from measurements on a clay model in the wind tunnel, when used in conjunction with a body vibro-acoustic model. The array also provides a high resolution turbulence measurement tool, suitable for validation of computation fluid dynamics (CFD) simulations for wind noise. The authors' report on the wavenumber-frequency structure of flow turbulence measured in different flow regions on a side glass and the corresponding contributions to interior wind noise.
Technical Paper

Effect of Screens and Pinhole Size on Measured Fluctuating Surface Pressures Using a Micro-Electro-Mechanical Microphone Array

2017-06-05
2017-01-1783
Surface pressure measurements using microphone arrays are still challenging, especially in an automotive context with cruising speeds around Mach 0.1. The separated turbulent boundary layer excitation and the side mirror wake flow generate both acoustic and aerodynamic components, which have wavenumbers that differ by a factor of approximately 10. This calls for high spatial resolution measurements to fully resolve the wavenumber-frequency spectrum. In a previous publication [1], the authors reported a micro-electro-mechanical (MEMS) surface microphone array that successfully used wavenumber analysis to quantify acoustic versus turbulence loading. It was shown that the measured surface pressure at each microphone could be strongly influenced by self-noise induced by the microphone “packaging”, which can be attenuated with a suitable windscreen.
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