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Surface Treatment of Polytetrafluoroethylene (PTFE), Preparation for Bonding

1974-12-01
HISTORICAL
AMS2491B
This specification covers the engineering requirements for preparing surfaces of polytetrafluoroethylene (PTFE) for bonding and the properties resulting from the treatment. This process has been used typically for rendering surfaces of parts capable of supporting a high strength adhesive bond. The bonding preparation can affect the electrical properties of the PTFE and this should be considered before using it for treatment of electronic components.
Standard

Surface Treatment of Polytetrafluoroethylene (PTFE), Preparation for Bonding

1981-10-01
HISTORICAL
AMS2491C
This specification covers the engineering requirements for preparing surfaces of polytetrafluoroethylene (PTFE) for bonding and the properties resulting from the treatment. This process has been used typically for rendering surfaces of parts capable of supporting a high strength adhesive bond. The bonding preparation can affect the electrical properties of the PTFE and this should be considered before using it for treatment of electronic components.
Standard

Surface Treatment of Polytetrafluoroethylene (PTFE), Preparation for Bonding

1961-01-01
HISTORICAL
AMS2491
This specification covers the engineering requirements for preparing surfaces of polytetrafluoroethylene (PTFE) for bonding and the properties resulting from the treatment. This process has been used typically for rendering surfaces of parts capable of supporting a high strength adhesive bond. The bonding preparation can affect the electrical properties of the PTFE and this should be considered before using it for treatment of electronic components.
Standard

Surface Treatment of Polytetrafluoroethylene (PTFE), Preparation for Bonding

1967-04-01
HISTORICAL
AMS2491A
This specification covers the engineering requirements for preparing surfaces of polytetrafluoroethylene (PTFE) for bonding and the properties resulting from the treatment. This process has been used typically for rendering surfaces of parts capable of supporting a high strength adhesive bond. The bonding preparation can affect the electrical properties of the PTFE and this should be considered before using it for treatment of electronic components.
Standard

Molded Rigid Plastic Parts

1997-12-01
HISTORICAL
AIR1269B
This SAE Aerospace Information Report (AIR) provides recommendations for the best practices to be followed in the molding of rigid thermoplastic and thermosetting molding compounds. The molding processes covered in this document are injection, transfer and compression molding. Recommendations are made on the design details of the part such as draft angles and processing considerations such as gate location in order to yield an easily producible, high quality, functional part.
Standard

Molded Rigid Plastic Parts

2011-08-24
CURRENT
AIR1269C
This SAE Aerospace Information Report (AIR) provides recommendations for the best practices to be followed in the molding of rigid thermoplastic and thermosetting molding compounds. The molding processes covered in this document are injection, transfer and compression molding. Recommendations are made on the design details of the part such as draft angles and processing considerations such as gate location in order to yield an easily producible, high quality, functional part.
Standard

Molded Rigid Plastic Parts

2011-02-10
HISTORICAL
AIR1269
This SAE Aerospace Information Report (AIR) provides recommendations for the best practices to be followed in the molding of rigid thermoplastic and thermosetting molding compounds. The molding processes covered in this document are injection, transfer and compression molding. Recommendations are made on the design details of the part such as draft angles and processing considerations such as gate location in order to yield an easily producible, high wuality, functinoal part.
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