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Video

High Temperature Power Device and Packaging - The Technology Leap to Achieve Cost, Power Density and Reliability Target

2011-11-07
The three major challenges in the power electronics in hybrid and electric vehicles are: System cost, power density and reliability. High temperature power device and packaging technologies increases the power density and reliability while reducing system cost. Advanced Silicon devices with synthesized high-temperature packaging technologies can achieve junction temperature as high as 200C (compared to the present limitation of 150C) eliminating the need for a low-temperature radiator and therefore these devices reduces the system cost. The silicon area needed for a power inverter with high junction temperature capability can be reduced by more than 50 - 75% thereby significantly reducing the packaging space and power device and package cost. Smaller packaging space is highly desired since multiple vehicle platforms can share the same design and therefore reducing the cost further due to economies of scale.
Video

Plug-In Charging Systems Monitoring

2012-02-01
Low Voltage Electric Drives are becoming very attractive for various applications in the Turf, Construction and Agricultural products being engineered today. Determining what the Customer Support Requirements are for Maintenance and Repair for the Life Cycle of the products is critical to the initial design process. Presenter Russell Christ
Video

High Volume Production of Fiber Reinforced Thermoplastic Parts

2012-03-23
Presented by: Dan Ott Web Industries Director, Business Development, Advanced Composites Market With the growth of Fiber Placement technology as a preferred automation technology in aerospace manufacturing and the rapid growth of new production line installations, it is crucial to provide material in a form which meets all necessary specifications and supports the optimum productivity available from this major capital investment made by the producer of the parts. Achieving these goals happnes when the part designer, AFP machine builder, and the slit tape producer design the best process and format which provides smooth, efficient and rapid delivery of the prepreg slit tape to the Fiber Placement laydown head. Tape size (width), slit width tolerance, spool shape and size, density of prepreg on the spool, spool change-over and handling processes all play a factor in productivity, and creating (or inhibiting) the best ROI on a full-scale AFP production line.
Video

Prepreg Slit Tape and Fiber Placement: Developing High Performance Material Delivery Systems for High-Output AFP Lines

2012-03-23
There are worldwide activities in developing guidelines and standards for fiber optic sensors. Fiber optic sensors (FOS) are increasingly demanded for structural health monitoring purposes and for measurement of physical and chemical quantities because of their specific features. However, they are not yet widely established for practical use due to a lack of guidelines and confirmed standards. Therefore, there are few groups worldwide which are very active in developing standards for use of FOS in different fields, particularly driven from aircraft industry, oil industry or the necessity to provide sensor systems for health monitoring of structures with a certain level of risk. The benefits of guidelines and/or standards on the way to well-validated and well-specified sensor systems will be presented by means of related examples. The presentation will also give an overview on the state-of-the-art and most relevant activities. Results achieved are discussed.
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