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The three major challenges in the power electronics in hybrid and electric vehicles are: System cost, power density and reliability. High temperature power device and packaging technologies increases the power density and reliability while reducing system cost. Advanced Silicon devices with synthesized high-temperature packaging technologies can achieve junction temperature as high as 200C (compared to the present limitation of 150C) eliminating the need for a low-temperature radiator and therefore these devices reduces the system cost. The silicon area needed for a power inverter with high junction temperature capability can be reduced by more than 50 - 75% thereby significantly reducing the packaging space and power device and package cost. Smaller packaging space is highly desired since multiple vehicle platforms can share the same design and therefore reducing the cost further due to economies of scale.

The OBD approval process can be a frustrating time for both manufacturer and ARB staff. For manufacturers, a long approval process can sometimes mean accepting deficiencies prematurely in exchange for an approval. For ARB staff, they are inundated with highly technical information which they must review, garner understanding of and then apply their experience to evaluate it for compliance. OBD approval anxiety can be minimized, if not avoided, when manufacturers understand ARB�s expectations. This presentation will take you through some unwritten rules and common pitfalls which can impede the approval process, thus providing a guideline to a less painful and more efficient certification document review and approval. Presenter Mark Frank, Winterpark Engineering Llc