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Honda R&D Technical Review April 2021

2021-04-01
Honda R&D Technical Review is a periodical containing research papers related to Honda R&D Center activities worldwide that cover automobile, motorcycle, power products, aircraft engine, and other fundamental technologies. Honda Motor offers a book for the April 2021 issue with 104 pages containing 12 papers focusing on the following latest topics: Technology for Prediction of Contactor Noise for Electric-powered Vehicle Batteries Reduction of Internal Resistance in High Capacity Lithium-ion Batteries with 3D Lattice-structured Electrode Predictive Technique for Seat Belt Submarining Injury by Triaxial Iliac Load Cell
Standard

J1349 Certified Power Engine Data for Ford Expedition / Lincoln Navigator - Level 2

2008-04-10
CURRENT
CPFD2_09EXPNAV
This product includes information on the manufacturer, engine, applications, testing location, certified maximum horsepower, certified maximum torque along with the certified curves of horsepower and torque over a wide range of engine RPM speeds. In addition, this product contains complete engine information such as displacement, cylinder configuration, valve train, combustion cycle, pressure charging, charge air cooling, bore, stroke, cylinder numbering convention, firing order, compression ratio, fuel system, fuel system pressure, ignition system, knock control, intake manifold, exhaust manifold, cooling system, coolant liquid, thermostat, cooling fan, lubricating oil, fuel, fuel shut off speed, etc. Also included are all measured test parameters outlined in J2723.
Standard

J1349 Certified Power Engine Data for GM LLT as used in 2010 Cadillac CTS Wagon - Level 2

2008-12-10
CURRENT
CPGM2_10CADWAG
This product includes information on the manufacturer, engine, applications, testing location, certified maximum horsepower, certified maximum torque along with the certified curves of horsepower and torque over a wide range of engine RPM speeds. In addition, this product contains complete engine information such as displacement, cylinder configuration, valve train, combustion cycle, pressure charging, charge air cooling, bore, stroke, cylinder numbering convention, firing order, compression ratio, fuel system, fuel system pressure, ignition system, knock control, intake manifold, exhaust manifold, cooling system, coolant liquid, thermostat, cooling fan, lubricating oil, fuel, fuel shut off speed, etc. Also included are all measured test parameters outlined in J2723.
Collection

Kinetically Controlled CI Combustion and Controls, 2010

2010-06-01
The 35 papers in this technical paper collection features CI combustion technologies distinguished by mixing processes that influence combustion and combustion phasing closely coupled to the timing of fuel injection. Topics covered include fuel injection effects, alternative fuel, diesel fuels and combustion, and optimization and modeling.
Collection

SI Combustion and Direct Injection SI Engine Technology, 2010

2010-06-01
The 37 papers in this technical paper collection focus on SI combustion technologies that employ direct, in-cylinder fuel injection. Topics of particular interest include in-cylinder fuel injection and spray studies, flow/spray interaction and in-cylinder mixture formation studies, and combustion chamber shape optimization. Papers also focus on combustion technologies in 4-stroke and 2-stroke engines, including premixed, port injected, and DI engine.
Collection

Mixing-Controlled CD Combustion, 2010

2010-06-01
The 35 papers in this technical paper collection features CI combustion technologies distinguished by mixing processes that influence combustion and combustion phasing closely coupled to the timing of fuel injection. Topics covered include fuel injection effects, alternative fuel, diesel fuels and combustion, and optimization and modeling.
Video

High Temperature Power Device and Packaging - The Technology Leap to Achieve Cost, Power Density and Reliability Target

2011-11-07
The three major challenges in the power electronics in hybrid and electric vehicles are: System cost, power density and reliability. High temperature power device and packaging technologies increases the power density and reliability while reducing system cost. Advanced Silicon devices with synthesized high-temperature packaging technologies can achieve junction temperature as high as 200C (compared to the present limitation of 150C) eliminating the need for a low-temperature radiator and therefore these devices reduces the system cost. The silicon area needed for a power inverter with high junction temperature capability can be reduced by more than 50 - 75% thereby significantly reducing the packaging space and power device and package cost. Smaller packaging space is highly desired since multiple vehicle platforms can share the same design and therefore reducing the cost further due to economies of scale.
Video

What If We Let Consumers Design PHEVs?

2011-11-04
Auto manufacturers have known and surveys confirm that consumers require short payback periods (2-4 years) for investments in fuel economy. Using societal discount rates, engineering-economic generally find substantial potential to increase fuel economy, cost-effectively. This phenomenon, often referred to as the ?energy paradox?, has been observed in nearly all consumers? choices of energy-using durable goods. Loss aversion, perhaps the most well established theory of behavioral economics, provides a compelling explanation. Engineering economic analyses generally overlook the fact that consumers? investments in fuel economy are not sure things but rather risky bets. Future energy prices, real world on-road fuel economy, and many other factors are uncertain. Loss aversion describes a fundamental human tendency to exaggerate the potential for loss relative to gain when faced with a risky bet. It provides a sufficient explanation for consumers?
Video

Introduction of New Concept U*sum for Evaluation of Weight-Efficient Structure

2011-11-01
A new index for evaluating load path dispersion is proposed, using a structural load path analysis method based on the concept of U* , which expresses the connection strength between a load point and an arbitrary point within the structure enables the evaluation of the load path dispersion within the structure by statistical means such as histograms and standard deviations. Presenter Tadashi Naito, Honda R&D Co., Ltd.
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