This specification covers an electrically-conductive adhesive supplied as two components; a paste of silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
This specification covers class L, low dielectric constant (12 or under), ceramic, electrical, insulating compounds, for use in electronic, communications, and allied electrical equipments, and the grading thereof (see 6.1).
This specification covers class L, low dielectric constant (12 or under), ceramic, electrical, insulating compounds, for use in electronic, communications, and allied electrical equipments, and the grading thereof (see 6.1).
This specification covers several grades of virgin polytetrafluoroethylene (PTFE) resin which may be compounded with pigment and fillers in the form of extruded or molded rods or tubes which are sintered after molding or, in the case of extrusions, sintered during the extrusion process.
This specification covers alumina-silica, glass, and other ceramic fiber thermal insulation in the form of felt and fabric flat sheets, rolls, or molded non-pliable blocks. Nominal thickness is 0.1 to 2.0 inches (3 to 51 mm) and nominal density is 2 to 24 pounds mass per cubic foot (32 to 384 kg/m3).
This specification covers alumina-silica, glass, and other ceramic fiber thermal insulation in the form of felt and fabric flat sheets, rolls, or molded non-pliable blocks. Nominal thickness is 0.1 to 2.0 inches (3 to 51 mm) and nominal density is 2 to 24 pounds mass per cubic foot (32 to 384 kg/m3).
This specification covers alumina-silica, glass, and other ceramic fiber thermal insulation in the form of felt and fabric flat sheets, rolls, or molded non-pliable blocks. Nominal thickness is 0.1 to 2.0 inches (3 to 51 mm) and nominal density is 2 to 24 pounds mass per cubic foot (32 to 384 kg/m3).