This method of gaging alignment of nut slots allows equal variations for location of the cotter pin hole in the bolt and location of slots in the nut. To inspect the nut, the slotted gage is inserted through the nut hole from the bearing surface of the nut. Alignment of slots is considered satisfactory if the gage pin can be slipped into the gage and nut slots without interference.
Round head bolts are made in two body styles: (a) A full size body, with a maximum diameter somewhat greater than the nominal diameter (not an SAE Standard except for ribbed neck bolts, Table 3); and (b) an undersize body, with a minimum diameter approximating the pitch diameter of the thread and a maximum diameter never exceeding nominal (SAE standard for all types except ribbed neck bolts). The body diameter of either style may be exceeded by a reasonable swelling or fin under the head, or under corners of the square necks, to the extent that serviceability is not affected.
The purpose of this standard is to provide a method for packaging aircraft software parts for distribution using contemporary media or by electronic distribution. This project intends to standardize and provide guidance for the storage of floppy based software, currently packaged in media set parts. This standard format can be then stored or distributed on a single physical media member (CD-ROM), or by electronic crate. The obsolescence of floppy disks drive an urgent need for this guidance.
The 12 papers in this techncial paper collection represent research in the areas of welding, riveting, joining, and fastening for automotive applications. Papers focus on the recent advances in the process optimization, analytical solution, numerical modeling, response evaluation as well as static and dynamic testing of traditional resistance spot welds, gas metal arc welds, friction stir spot welds, laser welds, rivets, mounts, adhesives, and fasteners.
The three major challenges in the power electronics in hybrid and electric vehicles are: System cost, power density and reliability. High temperature power device and packaging technologies increases the power density and reliability while reducing system cost. Advanced Silicon devices with synthesized high-temperature packaging technologies can achieve junction temperature as high as 200C (compared to the present limitation of 150C) eliminating the need for a low-temperature radiator and therefore these devices reduces the system cost. The silicon area needed for a power inverter with high junction temperature capability can be reduced by more than 50 - 75% thereby significantly reducing the packaging space and power device and package cost. Smaller packaging space is highly desired since multiple vehicle platforms can share the same design and therefore reducing the cost further due to economies of scale.
Low Voltage Electric Drives are becoming very attractive for various applications in the Turf, Construction and Agricultural products being engineered today. Determining what the Customer Support Requirements are for Maintenance and Repair for the Life Cycle of the products is critical to the initial design process. Presenter Russell Christ
Up to now, the reliability achieved by COTS components was largely sufficient for avionics, in terms of failure rate as well as time to failure. With the implementation of new and more integrated technologies (90 nm node, 65 nm and below), the question has arisen of the impact of the new technologies on reliability. It has been stated that the lifetime of these new technologies might decrease. The drift is expected to be technology dependent: integration, technology node, materials, elementary structure choices and process pay a key role. Figures have been published, which gives smaller lifetime than the 30 years generally required for avionics. This would of course impact not only the reliability, but also the maintenance of COTS-based avionics. Hence a new policy should be defined for the whole COTS supply chain. Faced with these impending risks, different methodologies have been developed.
This article characterizes the special features of drilling of CFRP/Titanium and -Aluminium stacks. Simplified theoretic models will show how CFRP/Titanium stacks should be machined without scratches and burn marks contacting carbon. Low axial forces and smart chip removal technology are the main characteristics of the drilling tool technology, optimized to reach H8 quality in one shot operation. Presenter Peter Mueller-Hummel, Cutting Tools Inc.