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ChemCam is one of the 10 instrument suites on the Mars Science Laboratory, a martian rover being built by Jet Propulsion Laboratory, for the next NASA mission to Mars (MSL 2009). ChemCam is an instrument package consisting of two remote sensing instruments: a Laser-Induced Breakdown Spectrometer (LIBS) and a Remote Micro-Imager (RMI). LIBS provides elemental compositions of rocks and soils, while the RMI places the LIBS analyses in their geomorphologic context. Both instruments rely on an autofocus capability to precisely focus on the chosen target, located at distances from the rover comprised between 1 and 9 m for LIBS, and 2 m and infinity for RMI. ChemCam will help determine which samples, within the vicinity of the MSL rover, are of sufficient interest to use the contact and in-situ instruments for further characterization.

1 This paper describes the conception and development status of a mini pump for two phases cooling loops. This pump is able to transport heat until 500 watts with a very low mass, low power consumption, and for a long lifetime (up to15 years)

DASSAULT and COMEX have developed a “wet” suit prototype, under a one year CNES contract, for the simulation of the Soviet EVA flight suit during underwater trainings. This concept, full of water and requiring a breathing system, allows to perfectly balance the astronaut in a neutrally buoyant suit like in 0-g environment. The modelling of real pressurized joints has been overcome by means of adjustable mechanical articulations the principle of which is fully described. The prototype performances and representativity have been evaluated and validated through underwater donning/doffing and the replay of an actual EVA already performed in space by Soviet-French astronauts. This suit prototype is available today, for the European space system designers to evaluate the future EVA operations to refine the procedures and hardware requirements. The suit concept capabilities, linked to its high modularity and low development duration, are finally discussed.

In the short term, traditional thermal control techniques, currently reaching their potential limit, will no longer meet the challenge imposed by the natural evolution in electronic packaging, characterized by an ever-increasing level of integration and power. In this context, new architectures must be developed, with thermal control based on high performance heat transfer devices. The Integration of Miniature Heat Pipe (MHP) seems to be one of the most effective and promising solutions for the future. This paper summarizes the work, performed within the frame of a partnership with the CNES, aiming at contributing to develop and evaluate this technology. Beyond theoretical and technological studies, we have manufactured or supplied several miniature heat pipe devices (MHPD) to constitute the elementary thermal control blocks, corresponding to the main packaging hierarchical levels (components, boards, equipment) of future generation of space vocation electronic units.

Up to now, the reliability achieved by COTS components was largely sufficient for avionics, in terms of failure rate as well as time to failure. With the implementation of new and more integrated technologies (90 nm node, 65 nm and below), the question has arisen of the impact of the new technologies on reliability. It has been stated that the lifetime of these new technologies might decrease. The drift is expected to be technology dependent: integration, technology node, materials, elementary structure choices and process pay a key role. Figures have been published, which gives smaller lifetime than the 30 years generally required for avionics. This would of course impact not only the reliability, but also the maintenance of COTS-based avionics. Hence a new policy should be defined for the whole COTS supply chain. Faced with these impending risks, different methodologies have been developed [1], [2].