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Technical Paper

Zero Resistance Technology (ZRT)

2005-11-22
2005-01-4109
Delphi's Zero Resistance Technology (ZRT) is a revolutionary new product/process that enables the reduction of mass and volume from a traditional wiring assembly. ZRT is defined as a minimal (zero) resistance change over time. The ZRT product is an electrical/electronic connection system which provides a viable solution for high density and limited space wiring applications. The ZRT process is a semi-automated wiring harness manufacturing system with flexibility to produce harnesses to the customer demand.
Technical Paper

Using the Six Sigma Methodology for Process Variation Reduction

2007-11-28
2007-01-2872
This paper is about the use of the Six Sigma Methodology, to solve variation problems in the manufacture area, at one of the Delphi Automotive Systems unit that manufacturer electrical harness. The DMAIC framework was followed, the improvements were done, eliminating the rots causes, and the use of Six Sigma methodology, was showed very efficient in solve problems. The methodology power, is in using a structured frame work, the DMAIC (Define-Measure-Analyze-Improve-Control), completing by quality quality tools (Pareto Chart, Five Why's, Cause and Effect Diagram) and statistical analyses, for example: variance analyses, hypotheses tests and Design of Experiments.
Technical Paper

Two Dimensional Modeling of a Rotary Power Steering Valve

1999-03-01
1999-01-0396
The power steering valve plays a key role in the steering performance of a vehicle. It is desirable, therefore, to have a means of predicting valve performance for the development of the steering system. This paper describes a method of applying the orifice equation to a steering valve, along with the procedure for experimentally determining the flow coefficients for this equation. Data is provided which demonstrates the nature of change of the flow coefficients through the operating range of the valve. A method for accounting for these changes is provided, along with correlation results for measured and predicted valve performance.
Technical Paper

Thermally-Induced Microstructural Changes in a Three-Way Automotive Catalyst

1997-10-01
972905
The use of advanced electron microscopy techniques to characterize both the bulk and near-atomic level microstructural evolution of catalyst materials during different dynamometer/vehicle aging cycles is an integral part of understanding catalyst deactivation. The study described here was undertaken to evaluate thermally-induced microstructural changes which caused the progressive loss of catalyst performance in a three-way automotive catalyst. Several different catalyst processing variables, for example changing the washcoat ceria content, were also evaluated as a function of aging cycle and thermal history. A number of thermally-induced microstructural changes were identified using high resolution electron microscopy techniques that contributed to the deactivation of the catalyst, including sintering of all washcoat constituents, γ-alumina transforming to α-, β-, and δ-alumina, precious metal redistribution, and constituent encapsulation.
Technical Paper

Thermal Electric Analysis of Bond Wires Used in Automotive Electronic Modules

2015-04-14
2015-01-0195
Bond wires are used in automotive electronic modules to carry current from external harness to components where flexibility under thermal cyclic loading is very essential between PCB (Printed Circuit Board) and connectors. They are very thin wires (few μm) made up of gold, aluminum or copper and have to undergo mechanical reliability to withstand extreme mechanical and thermal loads during different vehicle operation scenarios. Thermal reliability of bond wire is to make sure that it can withstand prescribed electric current under given boundary conditions without fusing thereby retaining electronic module's functionality. While carrying current, bond wire by virtue of its nature resists electric current flow and generates heat also called as joule heating. Joule heating is proportional to current flow and electrical resistance and if not handled properly can lead to thermal run away conditions.
Technical Paper

System Modeling of A Damper Module

2000-03-06
2000-01-0727
A recent trend within the automotive industry has been an emphasis on the development of modular assemblies for future vehicle applications. This trend has created a need for the development of methods to predict the performance of modules within the vehicle environment. In particular, the development of system models that account for the interactions between components within a modular assembly is necessary to insure that a module is properly designed. This paper describes a finite element system model of a damper module as installed in a McPherson strut front suspension. The modeling techniques used to construct the components within the modular assembly are discussed. The results of a study of the structural behavior of a damper module model subjected to quasi-static loading conditions are presented. Additionally, the effects of changes in individual component specifications on the overall system response are considered and the results are displayed.
Journal Article

Solder Void Modeling and Its Influence on Thermal Characteristics of MOSFETs in Automotive Electronics Module

2017-03-28
2017-01-0011
Current generation automobiles are controlled by electronic modules for performing various functions. These electronic modules have numerous semiconductor devices mounted on printed circuit boards. Solders are generally used as thermal interface material between surface mount devices and printed circuit boards (PCB) for efficient heat transfer. In the manufacturing stage, voids are formed in solders during reflow process due to outgassing phenomenon. The presence of these voids in solder for power packages with exposed pads impedes heat flow and can increase the device temperature. Therefore it is imperative to understand the effect of solder voids on thermal characteristics of semiconductor devices. But the solder void pattern will vary drastically during mass manufacturing. Replicating the exact solder void pattern and doing detail simulation to predict the device temperature for each manufactured module is not practical.
Technical Paper

Six Sigma: Behind The Scenes

2002-11-19
2002-01-3510
Although the Six Sigma [1] concept has become very popular in industrial sectors, very little is said about how to start a successful implementation in a Corporation, or when it should be initiated, and the most important, who should be addressed to lead this task. Its methodologies are widely observed by different sectors of the automotive market, typically focusing in projects with a potential financial impact, following the DMAIC sequence. More than just financial return, this sophisticated tool, has a direct impact on Quality in different levels for both non-productive process and manufacturing process, that eventually would also affect some organizational structures that ultimately can be understood as reengineering.
Technical Paper

Resistance Welding for Automotive Wiring Harness Connection - Small Gauge Cables

2012-10-02
2012-36-0153
Miniaturization is an important trend in many technology segments, once it can enable innovative applications generating new markets. This trend was begun in electronics industry after World War II and has spawned changes into automotive sector also. For Automotive Wiring Harness, miniaturization is clearly presented in most of the components, mainly because of its benefits like the potential of mass reduction, cost reduction and efficiency improvement. Furthermore the main voice of customer points to cable gauge reduction that represents a considerable challenge for connection manufacturing process due to quality control limitations presented by conventional crimp process for 0,35 [mm₂] cables and smaller. According to that, the scope of this article is to present, in details, a manufacturing process optimization for an alternative and more robust technology of joining copper stranded cables to tin brass terminals used on automotive wiring harness, Resistance Welding.
Technical Paper

Rapid Algorithm Development Tools Applied to Engine Management Systems

1998-02-23
980799
Intense competition in the automotive industry requires continuous reduction in innovation cycle time, even as corporations are downsizing and system complexity is increasing. Subsequently, the application of recently introduced Rapid Algorithm Development (RAD) tools has facilitated significant advances in the development of embedded control systems. The RAD steps include system modeling, control algorithm design, simulation analysis, automated calibration design, and vehicle implementation through automatic code generation. The application of RAD tools and the associated benefits are described, specifically in the context of Engine Management Systems (EMS). Such benefits include significant reductions in development cycle time, open architecture, automated calibration, and information reuse.
Technical Paper

Non-Linear Dynamic Analysis of a SuperPlug™ Door Module Response to a Door Slam Event

1999-03-01
1999-01-0406
The SuperPlug™ door module is a new Delphi innovation. It is a one-piece composite structure, which integrates several door components into one assembly. This reduces the total part count, simplifies the vehicle level assembly process, and reduces labor cost (see the Appendix). The door slam durability test is an important factor in door module design. As more hardware is integrated into the SuperPlug, this subsystem performance in a door slam test becomes important. Therefore, the correct placement of components and the supporting structure is critical. Currently, the evaluation of door slam durability for the SuperPlug is a process of build then test. This is time consuming and costly due to a long testing lead-time and the expense of tooling a new mold. It was realized that a numerical process for assessing the effect of door slam would be required. This process would compute the dynamic response using finite element analysis (FEA).
Technical Paper

Laser Welding: An Exploratory Study towards Continuous Improvement on Stainless Steel Welding Joints

2009-10-06
2009-36-0330
The utilization of Laser welding process has increased during last years in several areas of industry, due to many benefits that can be achieved with this technology, such as: flexibility, productivity and quality. Thus, the optimization of Laser welding processes has been considered as a “green field” to be explored by Laser manufacturers, automation companies and process/project engineers. Nowadays there are few researches that provide a roadmap for Laser welding processes improvement that approaches both the aspects and characteristics applied to evaluate the Laser weld application performance. Therefore, this paper has per its main purpose through an exploratory study to provide parameters toward continuous improvement of Laser welding process considering both types of Lasers: Laser spot weld and Laser seam weld of stainless steel joints, thus this work may be considered as theoretical and practical reference to be applied by people involved with Laser welding applications.
Technical Paper

LIN Bus and its Potential for Use in Distributed Multiplex Applications

2001-03-05
2001-01-0072
The increasing features and complexity of today's automotive architectures are becoming increasingly difficult to manage. Each new innovation typically requires additional mechanical actuators and associated electrical controllers. The sheer number of black boxes and wiring are being limited not by features or cost but by the inability to physically assemble them into a vehicle. A new architecture is required which will support the ability to add new features but also enable the Vehicle Assembly Plants to easily assemble and test each subsystem. One such architecture is a distributed multiplex arrangement that reduces the number of wires while enabling flexibility and expandability. Previous versions have had to deal with issues such as noise immunity at high switching currents. The LIN Bus with its low cost and rail-to-rail capability may be the key enabling technology to make the multiplexed architecture a reality.
Technical Paper

Instrument Panel Skin Manufactured with 100% Recycled TPO Material

2002-03-04
2002-01-1262
Desiring to push thermoplastic poly-olefin (TPO) technology to its fullest limits and to confirm our position as the leader in the manufacturing of environmentally friendly TPO instrument panels, we have designed a process to manufacture 100% recycled instrument panel skins. This closed-loop process begins with extruding 100% recycled TPO flake into sheet stock to be painted and vacuum formed. The painted sheet is vacuum formed and the offal is ground into regrind flake, ready to be extruded again, thus completing the closed-loop process. This paper will describe a 100% closed loop recycling process for TPO instrument panels, discuss the intense validation process for recycled material and prove the robustness and durability of this interior solution.
Technical Paper

Implications of 3-D Internal Flow Simulation on the Design of Inward-Opening Pressure-Swirl Injectors

2002-10-21
2002-01-2698
A parametric study on the effects of critical injector design parameters of inwardly-opening pressure-swirl injectors was carried out using 3-D internal flow simulations. The pressure variation and the integrated momentum flux across the injector, as well as the flow distributions and turbulence structure at the nozzle exit were analyzed. The critical flow effects on the injector design identified are the swirler efficiency, discharge coefficient, and turbulence breakup effects on the spray structure. The study shows that as a unique class of injectors, pressure-swirl injectors is complicated in fluid mechanics and not sufficiently characterized or optimized. The swirler efficiency is characterized in terms of the trade-off relationship between the swirl-to-axial momentum-flux ratio and pressure drop across the swirler. The results show that swirl number is inversely proportional to discharge coefficient, and that hole diameter and swirler height is the most dominant parameters.
Technical Paper

Implementation of Lead-Free Solder for Automotive Electronics

2000-03-06
2000-01-0017
Lead-free solders for electronics have been actively pursued since the early 1990's here and abroad for environmental, legislative, and competitive reasons. The National Center for Manufacturing Sciences (NCMS-US)1, the International Tin Research Institute (ITRI-UK)2, Swedish Institute of Production Engineering Research (IVF-Sweden)3, Japan Institute of Electronics Packaging (JIEP Japan)4, Improved Design Life and Environmentally Aware Manufacture of Electronics Assemblies by Lead-free Soldering (IDEALS-Europe)5, and, more recently, the National Electronics Manufacturing Initiative (NEMI-US)6 have been aggressively seeking lead-free solutions The automotive industry has some unique requirements that demand extensive testing of new materials and processes prior to implementation. The specific steps taken at Delphi Automotive Systems with lead-free solder will be described along with the lessons learned along the way.
Technical Paper

High Frequency Effects on Localization and Sound Perception in a Small Acoustic Space

2002-03-04
2002-01-0117
As compared to home audio, the automobile has a different spatial and spectral distribution of sound. This can cause stereo images to blur or shift due to conflicting localization cues. The impact of interaural time and level differences is discussed, along with frequency-selective pinna and head cues. Review of the literature shows that our poorest localization is for mid frequencies (∼2kHz). Yet in an automobile, low frequencies are severely relocated with a minimum effect on fidelity. It is suggested this is because middle frequencies dominate the perception and localization of sound. Therefore, some high frequency information might also be relocated.
Journal Article

HCCI Load Expansion Opportunities Using a Fully Variable HVA Research Engine to Guide Development of a Production Intent Cam-Based VVA Engine: The Low Load Limit

2012-04-16
2012-01-1134
While the potential emissions and efficiency benefits of HCCI combustion are well known, realizing the potentials on a production intent engine presents numerous challenges. In this study we focus on identifying challenges and opportunities associated with a production intent cam-based variable valve actuation (VVA) system on a multi-cylinder engine in comparison to a fully flexible, naturally aspirated, hydraulic valve actuation (HVA) system on a single-cylinder engine, with both platforms sharing the same GDI fueling system and engine geometry. The multi-cylinder production intent VVA system uses a 2-step cam technology with wide authority cam phasing, allowing adjustments to be made to the negative valve overlap (NVO) duration but not the valve opening durations. On the single-cylinder HVA engine, the valve opening duration and lift are variable in addition to the NVO duration. The content of this paper is limited to the low-medium operating load region at 2000 rpm.
Technical Paper

Globalization of the Design for Manufacturability/Assembly Process within the Automotive Wiring Assembly Business

1999-03-01
1999-01-0052
Automotive wiring assembly design and manufacturing has evolved from a locally based business to a global business. It is common today to engineer the design of a wiring assembly in one region of the world, to manufacture it in a second region, and to assemble it into the vehicle in a third region. This creates a need for global collaboration, training and communications. Design for Manufacturability (DFM) is a tool that can aid in this, in developing common processes globally, and reducing the cost and design complexity of the product in the early design stages. To develop a global DFM process, an organization must develop and implement a strategy. This paper will review the approach that an automotive wiring assembly supplier adopted. It will enumerate the benefits of developing a global Design for Manufacturability process, selecting a champion, and using a twelve-step plan to integrate DFM into each region.
Technical Paper

Flow Simulation of a Direct-Injection Gasoline Diaphragm Fuel Pump with Structural Interactions

2000-03-06
2000-01-1047
The fluid flow in a direct-injection gasoline diaphragm fuel pump is analyzed using a multi-physics simulation program. The analysis accounts for fully coupled fluid-structure interactions (FSI), the effects of the diaphragm movement and its deformation, the FSI between the diaphragm and the fluid, the FSI between the inlet/outlet valves and the fluid, and the solid-solid contact between the inlet/outlet valves and the valve seats. The flow rate of the fuel pump under various cam speeds is examined. The accuracy of the predictions for the flow rate of the fuel pump is assessed through comparisons with the experimental data, and moderately good agreement is obtained. In addition, some conclusions based on this study are summarized for reference.
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