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A cooperation of several research partners supported by the German Federal Ministry of Research and Education proposes a new active matrix LED light source. A multi pixel flip chip LED array is directly mounted to an active driver IC. A total of 1024 pixel can be individually addressed through a serial data bus. Several of these units are integrated in a prototype headlamp to enable advanced light distribution patterns in an evaluation vehicle.

This paper will outline the results of a study performed to analyze the market introduction of x-by-wire applications in the context of weak global industry environment, technological and legislative challenges, standardization issues and end customer benefits. This paper attempts to provide a bird-view on influence factors and impacts for the x-by-wire market, including e.g. the end customer's acceptance and legal environment driving further development in specific areas. Further, major driving forces on semiconductor/component level will be outlined regarding e.g. pin-count, computation performance and heat dissipation, but also possible scenarios and solutions towards safe and efficient system design and partitioning.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers whose performance can no longer be measured in MIPS. Instead, their effectiveness is based on a coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, what the designer needs are benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment. This presentation will explore the role of new benchmarks in the development of complex automotive applications.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers with incredible levels of peripheral integration. As a result, performance can no longer be measured in MIPS (Millions of Instructions Per Second). A microcontroller's effectiveness is based on coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, the designer needs benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment.

This paper outlines the results of a study performed to analyze the mission of TTCAN from applications to products for automotive systems. As commonly acknowledged communication is one of the key elements for future and even present systems such as an automobile. A dramatically increasing number of busses and gateways even in low- to midrange vehicles is putting significant burden upon the validation scenario as well as the cost. Accordingly, numerous new initiatives have been started worldwide in order to find solutions to this; some of them by the definition of enhanced or new protocols. This paper shall have a look particular on the new standard of TTCAN (time-triggered communication on CAN). This protocol is based on the CAN data link layer as specified in ISO 11898-1 and may use standardized CAN physical layers such as specified in ISO 11898-2 (high-speed transceiver) or in ISO 11898-3 (fault-tolerant low-speed transceiver).

In defining innovative and cost-effective chip sets for future automotive applications, system architects need high-level tools that allow them to rapidly determine the best silicon partitioning for a given application in terms of system performance as well as cost. The tool needs to be flexible, modular, and swift such that the system designer can perform abstract simulation iterations quickly for various functional partitioning scenarios, without requiring excessive computer resources. The tool must also be portable and adaptable to provide a simulation environment suitable to systems- or car-manufacturers for in-depth applications simulation and architecture assessment. The semiconductor component definition process using such a “mission-level” design tool for the automotive application electronic valve will be demonstrated. Methods for the analysis of electronic valve control system architectures using mission-level simulation will be developed.

Trans Tech recently debuted the all-electric eTrans school bus providing a total zero emission school bus. The presentation will demonstrate Smith Electric Vehicles and their history with electric vehicles. The presentation will help ensure that everybody has an idea of what the electric school bus will do and to dispel any rumors about the vehicle. Presenter Brian S. Barrington, Trans Tech. Bus

In addition to basic switching functionality, smart power switches mainly provide diagnostic and protection functions, e.g. for short circuits to the load, which makes it all the more surprising that short circuit protected smart switches have been used for years in automotive applications without there being a precise definition of a short circuit. This article describes what Infineon has done to fill this gap. It was first necessary to define the kind of short circuits likely to occur in automotive applications and to specify the use and operating points of the smart switches. The next logical step was the standardization of the test circuit and application conditions in the AEC (Automotive Electronics Council) to allow an industry-wide comparison of the test results.

Single Edge Nibble Transmission (SENT) is a promising low-cost solution for communication between off-ECU sensors and a microcontroller. First, this paper analyses the advantages of digital sensors with a special focus on position sensors. The possible integration of SENT in other application fields (such as pressure sensors) is also discussed. Secondly, it describes possible solutions for handling SENT communication on microcontrollers and it gives practical examples based on Infineon's TriCore and XC2000 families. It discusses the constraints and limitations on software level and how they could be solved by dedicated hardware implementations. Finally, this paper presents the Short PWM Code (SPC) protocol, which is a further extension of the SENT protocol. SPC aims at increasing the performance of the communication link and reducing system costs at the same time. By allowing bidirectional communication, SPC opens the way to new system relevant functionalities.

The signal delivery and quality of sensor data is of growing importance for modern automotive control applications. Sensors tend to be calibrated subsystems that are designed to stay in a defined tolerance and thus can easily be modeled. Compared to this deterministic behavior the transmission channel is time variant due to EMC and aging of contacts for example. The use of analog signaling, which is the actual state of realization in many cases, is sensitive to the time variant effects mentioned before. This time variance is hard to consider for the control system development. In this paper we will analyze the role of the sensor in the signal supply chain and discuss approaches for digital sensor-ECU communication and their potential to establish a link, which allows neglecting low level effects of the channel.

The number of safety critical automotive applications employing high current brushless motors continues to increase (Steering, Braking, and Transmission etc.). There are many benefits when moving from traditional solutions to electrically actuated solutions. Some of these benefits can include increased fuel economy, simplified vehicle installation and packaging, increased feature set, improved safety and/or convenience, simplified unit assembly and modular testability prior as well as during vehicle manufacturing. The trend to implement brushless motors in these applications (which require electronically controlled commutation) has also brought with it the need for powerful inverters, which primarily consist of Power MOSFETs and MOSFET Driver ICs. This paper reviews the challenges associated with the design of safety critical electronic systems which combine sensing, control and actuation.

ISO 26262 is the actual standard for Functional Safety of automotive E/E (Electric/Electronic) systems. One of the challenges in the application of the standard is the distribution of safety related activities among the participants in the supply chain. In this paper, the concept of a Safety Element out of Context (SEooC) development will be analyzed showing its current problematic aspects and difficulties in implementing such an approach in a concrete typical automotive development flow with different participants (e.g. from OEM, tier 1 to semiconductor supplier) in the supply chain. The discussed aspects focus on the functional safety requirements of generic hardware and software development across the supply chain where the final integration of the developed element is not known at design time and therefore an assumption based mechanism shall be used.

This paper considers the verification of non-standard CAN network topologies of the physical layer at high speed transmission rate (500.0Kbps and 1.0Mbps). These network topologies including single star, multiple stars, and hybrid topologies (multiple stars in combination with linear bus or with ring topology) are simulated by using behavior modeling language (VHDL-AMS) in comparison to measurement. Throughout the verification process, CAN transceiver behavioral model together with other CAN physical layer simulation components have been proved to be very accurate. The modeling of measurement environment of the CAN network is discussed, showing how to get the measurement and simulation results well matched. This demonstrates that the simulation solution is reliable, which is highly desired and very important for the verification requirement in CAN physical layer design.

This paper will give an overview of multicore in automotive applications, covering the trends, benefits, challenges, and implementation scenarios. The automotive silicon industry has been building multicore and multiprocessor systems for a long time. The reasons for this choice have been: increased performance, safety redundancy, increased I/O & peripheral, access to multiple architectures (performance type e.g. DSP) and technologies. In the past, multiprocessors have been mainly considered as multi-die, multi-package with simple interconnection such as serial or parallel busses with possible shared memories. The new challenge is to implement a multicore, micro-processor that combines two or more independent processors into a single package, often a single integrated circuit (IC). The multicores allow a computing device to exhibit some form of thread-level parallelism (TLP).

In modern vehicles, the number of small electrical drive systems is still increasing continuously for blowers, fans and pumps as well as for window lifts, sunroofs and doors. Requirements and operating conditions for such systems varies, hence there are many different solutions available for controlling such motors. In most applications, simple, low-cost DC motors are used. For higher requirements regarding operating time and in stop-start capable systems, the focus turns to highly efficient and durable brushless DC motors with electronic commutation. This paper compares various electronic control concepts from a semiconductor vendor point of view. These concepts include discrete control using relays or MOSFETs. Furthermore integrated motor drivers are discussed, including system-on-chip solutions for specific applications, e.g. specific ICs for window lift motors with LIN interface.

For the past approximately 20 years, the Serial Peripheral Interface (SPI) has been the established standard for serial communication between a host or central microprocessor and peripheral devices. This standard has been used extensively in control modules covering the entire spectrum of automotive applications, as well as non-automotive applications. As the complexity of engine control modules grows, with the number of vehicle actuators being controlled and monitored increasing, the number of loads the central microprocessor has to manage is growing accordingly. These loads are typically controlled using discrete and pulse-width modulated (PWM) outputs from the microcontroller when real-time operation is essential or via SPI when real-time response is not critical. The increase of already high pin-count on microcontrollers, the associated routing effort and demand for connected power stages is a concern of cost and reliability for future ECU designs.

The number of vehicles in world has been steadily increasing over the years. Asia Pacific is blessed to have the fastest growth rate in the world, with China experiencing over 20% vehicle production growth in the recent and coming years. As India jumps on this explosive bandwagon which could see growth rates higher than China, there is a need to understand the environmental and cost aspects arising from the vast increase of automobiles. The need to protect the environment, combined with the limited resource of oil, has led to the need for more fuel-efficient vehicles with intelligent engine and transmission control systems. This paper/presentation will look into the tough emissions regulations, lower CO2 requirement, different fuels and their efficiency, alternative fuel and the infrastructure to support such a paradigm shift, cost to achieve the desired, and GEMS-K1 (Gasoline Engine Management System - Kit 1) as a solution to meet some of the issues mentioned.

Glare-free high beams are a consistent enhancement of adaptive headlight systems for vehicles with advanced driver assist systems. A prerequisite for these are camera-based systems with the ability to recognize and classify objects such as vehicles in front or oncoming vehicles when driving at night. These objects can then be dynamically masked out of the high beam of the specially designed headlights. Since we are talking about moving objects, it is essential for the high beam to be continuously and dynamically adapted. This paper describes a modular LED matrix system for dynamically adjusting a glare-free and continuously active high beam. The main focus was on the modularity of the system and the optimization of the thermal properties of an LED matrix in order to ensure that operation was reliable under the harsh environmental conditions inside a headlight. Specific control electronics and different interconnection methods were examined.

End of Line tests are brief set of tests intended to evaluate ECU's in order to ensure correct functioning of its intended functionality. As these tests are executed on the production line, available time to perform these tests is limited. On one hand, faster production demands require these tests and its framework to be designed in a time optimized manner. On the other hand, increase in ECU functionality translates to an increase in test's functional coverage, requiring more time. Therefore the time taken to execute the tests reaches a critical point in overall ECU production. Availability of multicore microcontrollers with increase in clock speed can increase the performance of end of line tests, but design challenges e.g. synchronization do not guarantee a linear performance increase. Therefore, design of test execution framework is absolutely critical to increase performance of test execution.

New generation microcontrollers for automotive applications require a huge number of I/Os, dealing with various sensor and actuator signals derived from the external world. In case of the first TriCore™ based 32-Bit microcontroller this leads to approximately 270 I/Os for signal processing. Adding the power supply lines and thermal balls, the overall number of required interconnects grows far over 300. To outperform standard microcontroller packages, e.g. QFPs, the limitations in terms of package size and maximum number of interconnects have to be improved. Main goal is to adapt the component quality to the high level reliability standard, which is the basis of an implementation into automotive parts. Current tests with a P-BGA standard package show interesting results for the board level reliability, when design and test parameters are changed only slightly.