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Nowadays automobiles are getting smart and there is a growing need for the physical behavior to become part of its software. This behavior can be described in a compact form by differential equations obtained from modeling and simulation tools. In the offline simulation domain the Functional Mockup Interface (FMI) [3], a popular standard today supported by many tools, allows to integrate a model with solver (Co-Simulation FMU) into another simulation environment. These models cannot be directly integrated into embedded automotive software due to special restrictions with respect to hard real-time constraints and MISRA compliance. Another architectural restriction is organizing software components according to the AUTOSAR standard which is typically not supported by the physical modeling tools. On the other hand AUTOSAR generating tools do not have the required advanced symbolic and numerical features to process differential equations.

This paper will outline the results of a study performed to analyze the market introduction of x-by-wire applications in the context of weak global industry environment, technological and legislative challenges, standardization issues and end customer benefits. This paper attempts to provide a bird-view on influence factors and impacts for the x-by-wire market, including e.g. the end customer's acceptance and legal environment driving further development in specific areas. Further, major driving forces on semiconductor/component level will be outlined regarding e.g. pin-count, computation performance and heat dissipation, but also possible scenarios and solutions towards safe and efficient system design and partitioning.

Automotive powertrain and safety systems under design today are highly complex, incorporating more than one CPU core, running with more than 100 MHz and consisting of several 10 million transistors. Software complexity increases similarly making new methodologies and tools mandatory to manage the overall system. The use of accurate virtual prototypes improves the quality of systems with respect to system architecture design and software development. This approach is demonstrated with the example of the PCP/GPTA subsystem for Infineon's AUDO-NG powertrain controllers.

Software developers in the automotive sector must achieve high quality objectives. Many design and implementation errors are avoided by synthesizing code from model-based software specifications using automatic code generators such as ETAS' ASCET. To verify non-functional properties of the implementation, model-based design processes should be complemented with static program analysis tools like AbsInt's StackAnalyzer and timing analyzer aiT. ASCET, StackAnalyzer and aiT can be integrated in a way that the analysis results for code generated by ASCET are conveniently accessible from within the ASCET development environment. This gives ASCET users a direct feedback on the effects of their design decisions on resource usage, allowing to select more efficient designs and implementation methods. In the paper, we present the tools, the experimental integration, preliminary results and plans for further tool integration.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers whose performance can no longer be measured in MIPS. Instead, their effectiveness is based on a coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, what the designer needs are benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment. This presentation will explore the role of new benchmarks in the development of complex automotive applications.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers with incredible levels of peripheral integration. As a result, performance can no longer be measured in MIPS (Millions of Instructions Per Second). A microcontroller's effectiveness is based on coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, the designer needs benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment.

In defining innovative and cost-effective chip sets for future automotive applications, system architects need high-level tools that allow them to rapidly determine the best silicon partitioning for a given application in terms of system performance as well as cost. The tool needs to be flexible, modular, and swift such that the system designer can perform abstract simulation iterations quickly for various functional partitioning scenarios, without requiring excessive computer resources. The tool must also be portable and adaptable to provide a simulation environment suitable to systems- or car-manufacturers for in-depth applications simulation and architecture assessment. The semiconductor component definition process using such a “mission-level” design tool for the automotive application electronic valve will be demonstrated. Methods for the analysis of electronic valve control system architectures using mission-level simulation will be developed.

Trans Tech recently debuted the all-electric eTrans school bus providing a total zero emission school bus. The presentation will demonstrate Smith Electric Vehicles and their history with electric vehicles. The presentation will help ensure that everybody has an idea of what the electric school bus will do and to dispel any rumors about the vehicle. Presenter Brian S. Barrington, Trans Tech. Bus

Driven by factors like consumption, power output per liter, comfort and more stringent exhaust gas standards the powertain control area, has developed rapidly in the last decades. This trend has also brought with it many innovations in the ignition application. Today we can see a trend to Pencil-coil or Plug-top-coil ignition systems. The next step in system partitioning is to remove the power driver from the ECU and place it directly in/on the coil body. The advantages of the new partitioning - e.g. no high voltage wires, reduced power dissipation on the ECU - are paid with different, mainly tougher requirements for the electronic components. By using specialized technologies for the different functions - IGBT for switching the power, SPT for protection, supply and diagnostics - in chip-on-chip technology all required functions for a decentralized ignition system can be realized in a TO220/ TO263 package.

Increasing fuel costs and emission regulations force the car manufacturers to develop powerful but efficient engines. The 3-liter car (3-liter/100 km fuel consumption → 80 miles/gallon) is one of the slogans. To fulfill these requirements a fully electronic controlled Engine Management is necessary. Carburetor systems are replaced by fuel injection systems. Direct injection for Diesel as well as for gasoline engines is the clear trend for the future. The mechanical throttle systems, used for a long time will not fit to the requirements of direct injection. A DC motor for electronic throttle control in conjunction with λ regulation and exhaust gas recirculation are the key elements for low emission cars. Also the automotive ignition system is in a process of change today.

Fuel efficiency and clean combustion engine versus high engine performance - which will increase up to factor 10 in the next 5 years - with less engine displacement are driving more complex engine control systems in today's and future vehicles. The challenge is not only to design a perfect engine, but also to incorporate the right semiconductors. Beside this demand on high sophisticated electronics the demand on cost reduction - especially for small cars - is one driving factor for a smart partitioning. Infineon offers sensors, microcontrollers and power semiconductors for today's engine management platforms and therefore owns the right technologies to manufacture those devices. This opens up the possibility to integrate more functionality in less devices as in today's partitioning or to define electronics to simplify complex control strategies and to optimize the performance of each device.

The number of safety critical automotive applications employing high current brushless motors continues to increase (Steering, Braking, and Transmission etc.). There are many benefits when moving from traditional solutions to electrically actuated solutions. Some of these benefits can include increased fuel economy, simplified vehicle installation and packaging, increased feature set, improved safety and/or convenience, simplified unit assembly and modular testability prior as well as during vehicle manufacturing. The trend to implement brushless motors in these applications (which require electronically controlled commutation) has also brought with it the need for powerful inverters, which primarily consist of Power MOSFETs and MOSFET Driver ICs. This paper reviews the challenges associated with the design of safety critical electronic systems which combine sensing, control and actuation.

ISO 26262 is the actual standard for Functional Safety of automotive E/E (Electric/Electronic) systems. One of the challenges in the application of the standard is the distribution of safety related activities among the participants in the supply chain. In this paper, the concept of a Safety Element out of Context (SEooC) development will be analyzed showing its current problematic aspects and difficulties in implementing such an approach in a concrete typical automotive development flow with different participants (e.g. from OEM, tier 1 to semiconductor supplier) in the supply chain. The discussed aspects focus on the functional safety requirements of generic hardware and software development across the supply chain where the final integration of the developed element is not known at design time and therefore an assumption based mechanism shall be used.

Recently, vehicle networks have increased complexity due to the demand for autonomous driving or connected devices. This increasing complexity requires high bandwidth. As a result, vehicle manufacturers have begun using Ethernet-based communication for high-speed links. In order to deal with the heterogeneity of such networks where legacy automotive buses have to coexist with high-speed Ethernet links vehicle manufacturers introduced a vehicle gateway system. The system uses Ethernet as a backbone between domain controllers and CAN buses for communication between internal controllers. As a central point in the vehicle, the gateway is constantly exchanging vehicle data in a heterogeneous communication environment between the existing CAN and Ethernet networks. In an in-vehicle network context where the communications are strictly time-constrained, it is necessary to measure the delay for such routing task.

Functional safe systems fulfilling the ISO 26262 standard are getting more important for automotive applications where additional redundant and diverse functionality is needed for higher rated ASIL levels. This can result in a very complex and expensive system setup. Here we present a sensor product developed according ISO 26262. This sensor product comprises a two channel redundant and also diverse implemented magnetic field sensor concept with linear digital outputs on one monolithically integrated silicon substrate. This sensor is used for ASIL D applications like power-steering torque measurement, where the torque is transferred into a magnetic field signal in a certain magnetic setup, but can also be used in other demanding sensor applications concerning safety. This proposed and also implemented solution is beneficial because of implementation on a single chip in one single chip-package but anyway fulfilling ASIL D requirements on system level.

Connecting mobile communication channels to vehicles’ networks is currently attracting engineers in a wide range. Herein the desire of vehicle manufacturers to remotely execute software updates over the air (SOTA) within electronic control units (ECU) is probably the field of highest attention at the moment. Today software updates are typically done at vehicle service stations and connection the vehicles electronic network via the onboard diagnosis (OBD) interface to a service computer. Herby the duration of the update is invisible to the user, as this happens during standard service appointments. With introduction of SOTA, these updates become very convenient to the customer and can lead to higher customer satisfaction levels. SOTA can be made transparent to the user however the method of implementation can affect the user experience.

This paper presents ETAS GmbH research and product development activities related to test automation for embedded systems in the automotive industry. We propose a structured approach to flexible, systematic and efficient test automation. This research is based on several years of experience with test automation processes, products and solutions. Current research and development activities are closely linked to a pilot customer, implementing unified and automated test processes across several divisions. Central aspects of our research include a precise definition of various tasks and roles in an overall test process, the flexible connection of test case development tools, and test bench independence. Our research helps create test solutions which offer improved reusability of test cases and better manageability of test processes.

With the growing number of electronic systems, broadening function range and ever increasing interaction complexity in modern vehicles, the validation and calibration of new software functions becomes more and more challenging. The expenditures associated with this rising complexity are further increased due to growing number of vehicle variants that are adapted to regional markets. This conflicts with the ever present cost pressure in the overall automotive industry to reduce both production and development costs. Performing the most costly tasks of the development earlier in the process, using simulation on the PC, CAD or validation in virtual environment is a promising approach in order to face these challenges.

This paper will give an overview of multicore in automotive applications, covering the trends, benefits, challenges, and implementation scenarios. The automotive silicon industry has been building multicore and multiprocessor systems for a long time. The reasons for this choice have been: increased performance, safety redundancy, increased I/O & peripheral, access to multiple architectures (performance type e.g. DSP) and technologies. In the past, multiprocessors have been mainly considered as multi-die, multi-package with simple interconnection such as serial or parallel busses with possible shared memories. The new challenge is to implement a multicore, micro-processor that combines two or more independent processors into a single package, often a single integrated circuit (IC). The multicores allow a computing device to exhibit some form of thread-level parallelism (TLP).

In modern vehicles, the number of small electrical drive systems is still increasing continuously for blowers, fans and pumps as well as for window lifts, sunroofs and doors. Requirements and operating conditions for such systems varies, hence there are many different solutions available for controlling such motors. In most applications, simple, low-cost DC motors are used. For higher requirements regarding operating time and in stop-start capable systems, the focus turns to highly efficient and durable brushless DC motors with electronic commutation. This paper compares various electronic control concepts from a semiconductor vendor point of view. These concepts include discrete control using relays or MOSFETs. Furthermore integrated motor drivers are discussed, including system-on-chip solutions for specific applications, e.g. specific ICs for window lift motors with LIN interface.