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Technical Paper

Thermal Design in Diode Array Packaging

2002-10-29
2002-01-3261
Effective thermal management and removal of the waste heat generated at diode arrays is critical to the development of high-power solid-state lasers. Thermal design must be considered in the packaging of these arrays. Two different packages with heat dissipation through spray cooling are evaluated experimentally and numerically. Their overall performance is compared with other packaging configurations using different heat removal approaches. A novel packaging design is proposed that can fulfill the requirements of low thermal resistance, temperature uniformity among emitters in the diode array, low coolant flow rate, simplicity and low assembly cost. The effect of temperature uniformity on the pumping efficiency for gain media is examined for our novel packaging design. The thermal stress induced by temperature variation within an emitter is also considered.
Technical Paper

Stitching The Digital Thread, Creating The Product Digital Quilt

2023-03-07
2023-01-1016
The making of a quilt is an interesting process. Historically, a quilt is a canvas of work made from old pieces of cloth cut into squares or whatever shape that make a nice connected pattern and then stitched together. The quilt could be random pieces that is not related to each other. In most recent years and more common cases, a quilt is made of different pieces of patches that are connected and laid out in a special way to tell a story. Not only does it portray a story that is put together in a certain sequence, but it also stiches the pieces of the quilt into a nice and complete narrative. A story that one can understand just by looking at the quilt spread and unfolded. Much like the making of a quilt that has a story to tell, a Product Digital Quilt will tell the story of a product. The Digital Product Quilt replaces the conventional way of telling a product story. The traditional product story is a method that is serially connecting multiple product life cycle silos together.
Technical Paper

Performance Characteristics of MOSFETs Operating at High Power

2000-10-31
2000-01-3622
This paper demonstrates that the on-resistance of a power MOSFET decreases significantly when the operating temperature decreases. The decrease in on-resistance under cryogenic temperature allows the device to operate at a much higher power and current condition. Also, it is demonstrated that the MOSFET device can be effectively kept at cryogenic temperature by spray cooling with liquid nitrogen. Over 80 W of heat generated can be removed continuously with spray cooling.
Technical Paper

Nonlinear Neural Network Modeling of Aircraft Synchronous Generator with High Power Density

2012-10-22
2012-01-2158
Preliminary investigations of nonlinear modeling of aircraft synchronous generators using neural networks are presented. Aircraft synchronous generators with high power density tend operate at current-levels proportional to the magnetic saturation region of the machine's material. The nonlinear model accounts for magnetic saturation of the generator, which causes the winding flux linkages and inductances to vary as a function of current. Finite element method software is used to perform a parametric sweep of direct, quadrature, and field currents to extract the respective flux linkages. This data is used to train a neural network which yields current as a function of flux linkage. The neural network is implemented in a Simulink synchronous generator model and simulation results are compared with a previously developed linear model. Results show that the nonlinear neural network model can more accurately describe the responsiveness and performance of the synchronous generator.
Technical Paper

Enabling Much Higher Power Densities in Aerospace Power Electronics with High Temperature Evaporative Spray Cooling

2008-11-11
2008-01-2919
A power electronics module was equipped with an evaporative spray cooling nozzle assembly that served to remove waste heat from the silicon devices. The spray cooling nozzle assembly took the place of the standard heat sink, which uses single phase convection. The purpose of this work was to test the ability of spray cooling to enable higher power density in power electronics with high temperature coolant, and to be an effective and lightweight system level solution to the thermal management needs of aerospace vehicles. The spray cooling work done here was with 95 °C water, and this data is compared to 100 °C water/ propylene glycol spray cooling data from a previous paper so as to compare the spray cooling performance of a single component liquid to that of a binary liquid such as WPG. The module used during this work was a COTS module manufactured by Semikron, Inc., with a maximum DC power input of 180 kW (450 VDC and 400 A).
Technical Paper

A Heat Pipe Assisted Air-Cooled Rotary Wankel Engine for Improved Durability, Power and Efficiency

2014-09-16
2014-01-2160
In this paper, we address the thermal management issues which limit the lifespan, specific power and overall efficiency of an air-cooled rotary Wankel engine used in Unmanned Air Vehicles (UAVs). Our goal is to eliminate the hot spots and reduce the temperature gradients in the engine housing and side plates by aggressive heat spreading using heat pipes. We demonstrate by simulation that, for a specific power requirement, with heat spreading and more effective heat dissipation, thermal stress and distortion can be significantly reduced, even with air cooling. The maximum temperature drop was substantial, from 231°C to 129°C. The temperature difference (measure of temperature uniformity) decreased by 8.8 times (from 159°C to 18°C) for a typical UAV engine. Our heat spreaders would not change the frontal area of the engine and should have a negligible impact on the installed weight of the propulsion assembly.
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