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Terminus, Fiber Optic, Harsh Environment, General Specification
2021-11-23
CURRENT
AS8438
This document provides details of test methods that should be taken into consideration when qualifying fiber optic termini to the product specifications (slash sheets). The product specifications (slash sheets) provide pass/fail criteria, optical and physical intermatability, and interoperability requirements for fiber optic termini in circular, rectangular, and modular type aerospace connectors.
Standard

Splicer, Fusion, Fiber Optic, Aerospace, Explosion-Proof (Type I)
2020-01-30
CURRENT
AS6479/1
This detail specification defines fiber optic fusion splicers acceptable for the installation and repair of a wide range of optical fibers and cables with virtually no insertion loss in hazardous environments (potentially flammable or explosive atmospheres, Type I), particularly aerospace applications. The requirements for acquiring the splicer described herein shall consist of this specification and the latest issue of AS6479.
Standard

Splicer, Fusion, Fiber Optic, Aerospace Non-Explosion-Proof (Type II)
2020-01-30
CURRENT
AS6479/2
This detail specification defines fiber optic fusion splicers acceptable for the installation and repair of a wide range of optical fibers and cables with virtually no insertion loss, particularly in aerospace applications, but not in flammable or explosive atmospheres (Type II). The requirements for acquiring the splicer described herein shall consist of this specification and the latest issue of AS6479.
Standard

Reliability Assurance of Photonic Integrated Circuit (PIC) Based Devices Used in Aerospace Applications
2019-10-24
WIP
ARP6676
This document is intended to provide reliability assurance recommended practices for the deployment of individual photonic devices and PIC-based devices into aerospace platforms, focusing on reliability requirements to reach Technology Readiness Level (TRL) 7, 8 and 9. It will cover reliability assurance tests for single element and PIC chips, packaged single element and PIC chips and some single element and PIC based higher functionality modules, such as fiber-optic transmitters and receivers, free space optical transmitters and receivers, illuminators and sources for optical sensors. The document will provide the reasons and methods for aerospace reliability assurance of PIC chips, PIC based packages and PIC based devices. It will be as inclusive as possible, including PIC chips fabricated in the main material systems: semiconductors (Group IV, III-V, II-VI), electro-optic crystals (lithium niobate) and polymers.
Standard

High Performance Epoxies for Aerospace Applications
2018-10-18
WIP
AS8449
The goal of this document would be to control specific configurations of epoxies approved for aerospace. Providing a structured standard for configuration control of epoxies and appropriate applications and areas of use for multiple grades and environmental performance considerations.
Standard

Guidelines for Testing and Support of Aerospace, Fiber Optic, Inter-Connect Systems
2018-08-16
CURRENT
ARP5061A
ARP5061A provides guidelines for optical performance testing of short haul fiber optic inter-connection systems used in aerospace vehicles. The focus of this document is to introduce the proper testing tools and establish common pre- and post-installation test methods and troubleshooting methodologies.
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