This specification covers the requirements for a film-forming liquid hold down fixant. The hold down fixant solution shall consist of compounds as required, to conform to the requirements specified herein.
This specification covers the requirements for a film-forming liquid hold down fixant. The hold down fixant solution shall consist of compounds as required, to conform to the requirements specified herein.
This specification covers class L, low dielectric constant (12 or under), ceramic, electrical, insulating compounds, for use in electronic, communications, and allied electrical equipments, and the grading thereof (see 6.1).
This specification covers class L, low dielectric constant (12 or under), ceramic, electrical, insulating compounds, for use in electronic, communications, and allied electrical equipments, and the grading thereof (see 6.1).