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Abstract Threat identification and security analysis have become mandatory steps in the engineering design process of high-assurance systems, where successful cyberattacks can lead to hazardous property damage or loss of lives. This article describes a novel approach to perform security analysis on embedded systems modeled at the architectural level. The tool, called Security Threat Evaluation and Mitigation (STEM), associates threats from the Common Attack Pattern Enumeration and Classification (CAPEC) library with components and connections and suggests potential defense patterns from the National Institute of Standards and Technology (NIST) Special Publication (SP) 800-53 security standard. This article also provides an illustrative example based on a drone package delivery system modeled in AADL.

Abstract Fighter pilots must study models of aircraft dynamics before learning complex maneuvers and tactics. Similarly, autonomous fighter aircraft applications may benefit from a model-based learning approach. Instead of using a preexisting physics model of a given aircraft, a machine learning system can learn a predictive model of the aircraft physics from training data. Furthermore, it can model interactions between multiple friendly aircraft, enemy aircraft, and the environment. Such a system can also learn to represent state variables that are not directly observable, as well as dynamics that are not hard coded. Existing model-based methods use a deep neural network that takes observable state information and agent actions as input and provides predictions of future observations as output. The proposed method builds upon this approach by adding a residual feedforward skip connection from some of the inputs to all of the outputs of the deep neural network.

Abstract Letter from the Guest Editors

Abstract The demand for contactless, rapid manufacturing has increased over the years, especially during the COVID-19 pandemic. Additive manufacturing (AM), a type of rapid manufacturing, is a computer-based system that precisely manufactures products. It proves to be a faster, cheaper, and more efficient production system when integrated with cloud-based manufacturing (CBM). Similarly, the need for semiconductors has grown exponentially over the last five years. Several companies could not keep up with the increasing demand for many reasons. One of the main reasons is the lack of a workforce due to the COVID-19 protocols. This article proposes a novel technique to manufacture semiconductor chips in a fast-paced manner. An algorithm is integrated with cloud, machine vision, sensors, and email access to monitor with live feedback and correct the manufacturing in case of an anomaly.