This Aerospace Recommended Practice (ARP) describes the processing system and techniques for the surface preparation and priming of aluminum alloy parts for structural adhesive bonding to achieve optimum bondline durability, corrosion resistance, and manufacturing producibility. While this surface preparation has been developed and validated for two high strength aluminum alloys, 2024 and 7075, in the hardened condition it is expected to be applicable to other alloys and tempers. This surface preparation system has been validated for use with 180 degrees F (82 degrees C) and with 250 degrees F (121 degrees C) curing elastomer-modified epoxy adhesive and corrosion-inhibiting primer. The processes described herein are the result of laboratory evaluation of structural and durability performance.
This Aerospace Recommended Practice (ARP) describes the processing system and techniques for the surface preparation and priming of aluminum alloy parts for structural adhesive bonding to achieve optimum bondline durability, corrosion resistance, and manufacturing producibility.
This SAE Aerospace Recommended Practice describes the aluminum weldbonding process for fabrication of secondary aircraft structural assemblies possessing excellent strength, fatigue life, and environmental durability.
This specification covers continuous, multiple-strand, roving of Type "S-2" glass impregnated with a heat-curable epoxy resin matrix and processed to a "B" stage condition.
This specification covers a single-component, heat-reactive, thermosetting aromatic system which thermally cures to form a polyimide polymer structure.
This specification covers continuous, multiple-strand, roving of Type "S-2" glass impregnated with a heat-curable epoxy resin matrix and processed to a "B" stage condition.
This specification covers a heat-reactive, thermosetting, epoxy resin matrix in the form of a semi-solid. The resin matrix thermally cures to an epoxy polymer.
This document describes an inspection procedure for detecting, by use of a radiographic opaque tracer and fluoroscopy or radiography methods, flaws which have been produced as the result of cutting, machining, or drilling operations in composite or laminate structures.
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.
This specification and its supplementary detail specifications cover intermediate modulus para-aramid organic fibers in the form of continuous, multifilament yarn and roving.
This specification and its supplementary detail specifications cover intermediate modulus para-aramid organic fibers in the form of continuous, multifilament yarn and roving.
This specification and its supplementary detail specification cover various types of non-woven glass cloth in the form of tape and flat sheet impregnated with epoxy resin, the resin to be supplied in a “B” staged condition.