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Although the plastic ball-grid-array (PBGA) is accepted in the commercial and industrial community as a viable packaging technology, their acceptance in an environmentally harsh aerospace application has been limited. The limitation is due to a perceived reliability and durability risk most aerospace industries are unwilling to accept. However, with the abundant availability of PBGA packages, and a limited source of comparable substitutes, the aerospace industry is faced with a dilemma. The aerospace industry does not drive the semiconductor market, since the volumes for semiconductor devices are low in comparison with other high-volume semiconductor consumer industry. Therefore, the aerospace industry is faced with validating the viability of PBGA packaging technology for harsh environmental aerospace applications. This paper will discuss a formal method for validating PBGA packaging technology for environmentally harsh aerospace applications.