Refine Your Search

Search Results

Viewing 1 to 3 of 3
Technical Paper

Electronic Unit Advanced Thermal Management with Miniature Heat Pipe for Space Applications

2004-07-19
2004-01-2359
In the short term, traditional thermal control techniques, currently reaching their potential limit, will no longer meet the challenge imposed by the natural evolution in electronic packaging, characterized by an ever-increasing level of integration and power. In this context, new architectures must be developed, with thermal control based on high performance heat transfer devices. The Integration of Miniature Heat Pipe (MHP) seems to be one of the most effective and promising solutions for the future. This paper summarizes the work, performed within the frame of a partnership with the CNES, aiming at contributing to develop and evaluate this technology. Beyond theoretical and technological studies, we have manufactured or supplied several miniature heat pipe devices (MHPD) to constitute the elementary thermal control blocks, corresponding to the main packaging hierarchical levels (components, boards, equipment) of future generation of space vocation electronic units.
Technical Paper

INTEGRAL Spectrometer Thermal Balance Test

2000-07-10
2000-01-2498
This paper describes the thermal balance test which has been performed on the spectrometer SPI Structural and Thermal Model (INTEGRAL project) from August 27th to September 17th 1999. Main SPI modes have been simulated in order to qualify the instrument thermal control. MLI efficiency has been measured, as well as thermal conductance to the payload module (PLM). For this, a specific thermal adaptator (a mechanical frame and two aluminum plates regulated by two cryostats) has been developed and will also be used for thermal vacuum tests of the SPI Flight Model. This thermal adaptator and its behavior during thermal balance test are described.
Technical Paper

The Thermal Control Concept of the Mars Netlander Surface Module

2001-07-09
2001-01-2282
The Netlander mission aims to deploying on the surface of Mars a network of 4 landers, which will perform simultaneously measurements in order to study the internal structure of Mars, its sub-surface and its atmosphere. This paper describes the phase B thermal control concept of the Netlander Surface Module, taking into account various thermal environments from the cruise to Mars phase until the landing and the one Martian year phase on the Mars surface. The paper focuses on two specific thermal tests. The first one is a thermal conductivity measurement of three pre-selected insulation materials in a 6 - 10 hPa CO2 environment, and the second one is a performance test of a Loop Heat Pipe designed to comply the Netlander Surface Module needs. This paper is mainly derived from the report referenced ref. 1.
X