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TPO is getting wider acceptance for automotive applications. An exterior application like a fascia is a very good example. Interiors are still a challenge due to many reasons including overall system cost. For interior applications, “all-olefin” means it mainly consists of three materials: TPO skin, cross-linked olefinic-based foam and PP substrate. The driving force for TPO in Europe is mainly recyclability while in the USA, it is long-term durability. This paper describes the key limitations of the current TPO systems which are: poor grain retention of TPO skin, shrinkage in-consistency of the skin, high cost of priming (or other treatments) and painting of the skin, lower process window of the semi-crystalline TPO material during thermoforming or In-mold lamination / Low pressure molding, high cost of the foam, low tear strength of the foam for deep draw ratio etc.

One of the most evident trends in automotive sector is miniaturization. It is related to considerable benefits due to the potential of mass reduction, cost reduction and efficiency improvement. It involves many different automobile components and most of them are facing challenges to achieve the targets defined by car makers and final consumers. Specifically for wiring harness, it seems to be many manufacturing and process challenges to be surpassed in order to fully perceive the benefits expected with miniaturization, internally and externally. So this article aims to present an overview of literature as well as reporting of experts on this issue mentioning some of the challenges that global automotive wiring harness manufacturers are facing. Subjects as assembly automation, terminal connection and small gauge cables are discussed in the article and also a general overview of how those problems are being addressed in order to meet customer requirements.

Balancing the fill sequence of multiple cavities in a rubber injection mold is desirable for efficient cure rates, optimized cure times, and consistent quality of all molded parts. The reality is that most rubber injection molds do not provide a consistent uniform balanced fill sequence for all the cavities in the mold - even if the runner and cavity layout is geometrically balanced. A new runner design technique, named “The Vanturi Effect”, is disclosed to help address the inherent deficiencies of traditional runner and cavity layouts in order to achieve a more balanced fill sequence. Comparative analysis of molded runner samples reveals a significant and positive improvement in runner and cavity fill balancing when the Vanturi Effect is integrated into the runner design.

The development of an analytical model for multilayer stack subjected to temperature change is demonstrated here. Thin continuous layers of materials bonded together deform as a plate due to their differing coefficients of thermal expansion upon subjecting the bonded materials to the change in temperature. Applications of such structures can be found in the electronics industry (the study of warpage issues in printed circuit boards) or in the aerospace industry as (the study of laminated thin sheets used as skin structures for load bearing members such as wings and fuselage). In automotive electronics, critical high-power packages (IGBT, Power FETs) include several layers of widely differing materials (aluminum, solder, copper, ceramics) subjected to wide temperature cyclic ranges. Modeling of such structures by using three-dimensional finite element methods is usually time consuming and may not exactly predict the inter-laminar strains.

Legal requirements and responsibility for the environment require improved recyclability of car components. This can be achieved by a reduction in the variety of materials used, which can be separated after use. This is being demonstrated for wiring harnesses using a new hook and loop based fastening system. Easier assembly and disassembly, elimination of fixation holes in the car body, and improved serviceability can lead to considerable cost reductions. Field experience on test cars will be available at a later date.

The fundamental relationship between semi-solid processing and microstructure and their effect on the flow characteristics of semi-solid metals have been studied for several years. However, how the process related microstructure influences fatigue properties has not been given the same attention. This study examines the influence of process-related microstructure on the fatigue properties of semi-solid formed A357 alloys. High-solid-fraction (62% solid) and low-solid-fraction (31% and 36% solid) semi-solid formed A357 was tested in axial fatigue with a stress ratio (R) equal to -1. The high solid fraction (HSF) material had better fatigue properties than the low solid fraction (LSF) material. This is attributed to the fatigue crack initiation mechanisms, as related to the fatigue crack initiation features and the strengths of the materials.

Automotive wiring assembly design and manufacturing has evolved from a locally based business to a global business. It is common today to engineer the design of a wiring assembly in one region of the world, to manufacture it in a second region, and to assemble it into the vehicle in a third region. This creates a need for global collaboration, training and communications. Design for Manufacturability (DFM) is a tool that can aid in this, in developing common processes globally, and reducing the cost and design complexity of the product in the early design stages. To develop a global DFM process, an organization must develop and implement a strategy. This paper will review the approach that an automotive wiring assembly supplier adopted. It will enumerate the benefits of developing a global Design for Manufacturability process, selecting a champion, and using a twelve-step plan to integrate DFM into each region.

Lead-free solders for electronics have been actively pursued since the early 1990's here and abroad for environmental, legislative, and competitive reasons. The National Center for Manufacturing Sciences (NCMS-US)1, the International Tin Research Institute (ITRI-UK)2, Swedish Institute of Production Engineering Research (IVF-Sweden)3, Japan Institute of Electronics Packaging (JIEP Japan)4, Improved Design Life and Environmentally Aware Manufacture of Electronics Assemblies by Lead-free Soldering (IDEALS-Europe)5, and, more recently, the National Electronics Manufacturing Initiative (NEMI-US)6 have been aggressively seeking lead-free solutions The automotive industry has some unique requirements that demand extensive testing of new materials and processes prior to implementation. The specific steps taken at Delphi Automotive Systems with lead-free solder will be described along with the lessons learned along the way.

Desiring to push thermoplastic poly-olefin (TPO) technology to its fullest limits and to confirm our position as the leader in the manufacturing of environmentally friendly TPO instrument panels, we have designed a process to manufacture 100% recycled instrument panel skins. This closed-loop process begins with extruding 100% recycled TPO flake into sheet stock to be painted and vacuum formed. The painted sheet is vacuum formed and the offal is ground into regrind flake, ready to be extruded again, thus completing the closed-loop process. This paper will describe a 100% closed loop recycling process for TPO instrument panels, discuss the intense validation process for recycled material and prove the robustness and durability of this interior solution.

The increasing features and complexity of today's automotive architectures are becoming increasingly difficult to manage. Each new innovation typically requires additional mechanical actuators and associated electrical controllers. The sheer number of black boxes and wiring are being limited not by features or cost but by the inability to physically assemble them into a vehicle. A new architecture is required which will support the ability to add new features but also enable the Vehicle Assembly Plants to easily assemble and test each subsystem. One such architecture is a distributed multiplex arrangement that reduces the number of wires while enabling flexibility and expandability. Previous versions have had to deal with issues such as noise immunity at high switching currents. The LIN Bus with its low cost and rail-to-rail capability may be the key enabling technology to make the multiplexed architecture a reality.

The utilization of Laser welding process has increased during last years in several areas of industry, due to many benefits that can be achieved with this technology, such as: flexibility, productivity and quality. Thus, the optimization of Laser welding processes has been considered as a “green field” to be explored by Laser manufacturers, automation companies and process/project engineers. Nowadays there are few researches that provide a roadmap for Laser welding processes improvement that approaches both the aspects and characteristics applied to evaluate the Laser weld application performance. Therefore, this paper has per its main purpose through an exploratory study to provide parameters toward continuous improvement of Laser welding process considering both types of Lasers: Laser spot weld and Laser seam weld of stainless steel joints, thus this work may be considered as theoretical and practical reference to be applied by people involved with Laser welding applications.

In recent years, a number of key influences are contributing to accelerate technological innovation in the automotive industrial sector. Concerns about renewable energy resource, fossil-fuels crises and higher gasoline prices, global warming awareness and environmental impacts, scarcity of minerals/metals and electronics demands rising are some of the major challenges for vehicle automakers and their suppliers. The interest in alternative fuel vehicles, especially hybrid-electrical vehicles (HEV) or renewable energy power concepts for road vehicles has become intensified and represents a significant area of research and development in order to meet nowadays global demands. However because of Hybrid Vehicles unique Power Supply System the electrical/electronic architecture (E/E) is sophisticated, requesting more robust sealing and a particular wiring harness components, such as connector, terminals and cables.

Legal requirements, especially in the European Union, rising concern about our environment and economic reasons force us to look at End of Life Vehicles (ELV's) more critically. This paper describes some projects where recycling technologies have been developed showing clearly that recycling can be profitable. The projects demonstrate the recycling of Polyvinyl Chloride (PVC) insulation in automotive wiring, a separation technology for different plastic materials by melting point, the treatment of laminated materials like flexible printed circuits, some ideas of fastening systems, suited for disassembly and several basic rules for making recycling easier and profitable.

Miniaturization is an important trend in many technology segments, once it can enable innovative applications generating new markets. This trend was begun in electronics industry after World War II and has spawned changes into automotive sector also. For Automotive Wiring Harness, miniaturization is clearly presented in most of the components, mainly because of its benefits like the potential of mass reduction, cost reduction and efficiency improvement. Furthermore the main voice of customer points to cable gauge reduction that represents a considerable challenge for connection manufacturing process due to quality control limitations presented by conventional crimp process for 0,35 [mm₂] cables and smaller. According to that, the scope of this article is to present, in details, a manufacturing process optimization for an alternative and more robust technology of joining copper stranded cables to tin brass terminals used on automotive wiring harness, Resistance Welding.

The most popular aluminum alloys for semi-solid automotive components are A356 and A357. The density of rheocast semi-solid A357 is higher than die cast A357 and allows for both T5 and T6 heat treatment. The mechanical properties of rheocast semi-solid A357 was found to be more dependent upon the heat treat schedule and casting soundness than by the solid content of the semi-solid slurry or the globule shape.

Current generation automobiles are controlled by electronic modules for performing various functions. These electronic modules have numerous semiconductor devices mounted on printed circuit boards. Solders are generally used as thermal interface material between surface mount devices and printed circuit boards (PCB) for efficient heat transfer. In the manufacturing stage, voids are formed in solders during reflow process due to outgassing phenomenon. The presence of these voids in solder for power packages with exposed pads impedes heat flow and can increase the device temperature. Therefore it is imperative to understand the effect of solder voids on thermal characteristics of semiconductor devices. But the solder void pattern will vary drastically during mass manufacturing. Replicating the exact solder void pattern and doing detail simulation to predict the device temperature for each manufactured module is not practical.

Delphi's Zero Resistance Technology (ZRT) is a revolutionary new product/process that enables the reduction of mass and volume from a traditional wiring assembly. ZRT is defined as a minimal (zero) resistance change over time. The ZRT product is an electrical/electronic connection system which provides a viable solution for high density and limited space wiring applications. The ZRT process is a semi-automated wiring harness manufacturing system with flexibility to produce harnesses to the customer demand.