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Software complexity of vehicles is constantly growing especially with additional autonomous driving features being introduced. This increases the risk for bugs in the system, when the car is delivered. According to a car manufacturer, more than 90% of availability problems corresponding to Electronic Control Unit (ECU) functionality are either caused by software bugs or they can be resolved by applying software updates to overcome hardware issues. The main concern are sporadic errors which are not caught during the development phase since their trigger condition is too unlikely to occur or is not covered by the tests. For such systems, there is a need of safe and secure infield diagnosis. In this paper we present a tool software architecture with remote access, which facilitates standard read/write access, an efficient channel interface for communication and file I/O, and continuous trace.

The increasingly stringent requirements in relation to emission reduction and onboard diagnostics are pushing the Chinese automotive industry toward more innovative solutions and a rapid increase in electronic control performance. To manage the system complexity the architecture will require being well structure on hardware and software level. The paper introduces GEMS-K1 (Gasoline Engine Management System - Kit 1). GEMS-K1 is a platform being compliant with Euro IV emission regulation for gasoline engines. The application software is developed using modeling language, the code is automatically generated from the model. The driver software has a well defined structure including microcontroller abstraction layer and ECU abstraction layer. The hardware is following design rules to be robust, 100% testable and easy to manufacture. The electronic components use the latest innovation in terms of architecture and technologies.

This paper presents a reliability study of a directly cooled IGBT module after a test drive of 85,000 Km in a fuel cell electric vehicle, as well as of an indirectly cooled IGBT module after a test drive of 200,000km in a hybrid car on public roads. At the end of the test drive, the inverter units were disassembled and analyzed with regard to the lifetime consumption. First, electrical measurements were carried out and the results were compared with the ones obtained directly after module production (End of Line test). After that, ultrasonic microscopy was performed in order to investigate any delamination in the solder layers. As a third step, an optical inspection was performed to monitor damages in the housing, formation of cracks or degradation of wire bonds. The results show none of the depicted failure modes could be found on the tested power modules after the field test. Obviously, no significant life time consumption could be observed.

The trend towards even more sophisticated driver assistance systems and growing automation of driving sets new requirements for the robustness and availability of the involved automotive systems. In case of an error, today it is still sufficient that safety related systems just fail safe or silent to prevent safety related influence of the driving stability resulting in a functional deactivation. But the reliance on passive mechanical fallbacks in which the human driver taking over control, being inevitable in such a scenario, is expected to get more and more insufficient along with a rising degree of driving automation as the driver will be given longer reaction time. The advantage of highly or even fully automated driving is that the driver can focus on other tasks than controlling the car and monitoring it’s behavior and environment.

It has become an important trend to implement safety-related requirements in the road vehicles. Recent studies have shown that accidents, which occurred when drivers are not focused due to fatigue or distractions, can be predicted in advance when using safety features. Advanced Driver Assistance Systems (ADAS) are used to prevent this kind of situation. Currently, many major tiers are using a DSP chip for ADAS applications. This paper suggests the migration from a DSP configuration to a Microcontroller configuration for ADAS application, for example, using a 32bit Multi-core Microcontroller. In this paper, the following topics will be discussed. Firstly, this paper proposes and describes the system block diagram for ADAS configuration followed by the requirements of the ADAS system. Secondly, the paper discusses the current solutions using a DSP. Thirdly, the paper presents a system that is migrated to a Multi-core microcontroller.

The modern day power MOSFET is constructed using the latest technology in order to minimize the drain source resistance. The latest MOSFET technologies are capable of achieving the same drain to source resistance with a smaller MOSFET die than previous generations which will directly lead to increased thermal resistance and limited energy handling capability. This paper will discuss the Safe Operating Area of power MOSFETs and how to assess new MOSFET technology.

Classic vehicle production had limitations in bringing the driving commands to the actuators for vehicle motion (engine, steering and braking). Steering columns, hydraulic tubes or steel cables needed to be placed between the driver and actuator. Change began with the introduction of e-gas systems. Mechanical cables were replaced by thin, electric signal wires. The technical solutions and legal standardizations for addressing the steering and braking systems, were not defined at this time. Today, OEMs are starting E/E-Architecture transformations for manifold reasons and now have the chance to remove the long hydraulic tubes for braking and the solid metal columns used for steering. X-by-wire is the way forward and allows for higher Autonomous Driving (AD) levels for automated driving vehicles. This offers new opportunities to design the vehicle in-cabin space. This paper will start with the introduction of x-by-wire technologies.

As the demand for enhanced comfort, safety and differentiation with new features continues to grow and as electronics and software enable most of these, the number of electronic units or components within automobiles will continue to increase. This will increase the overall system complexity, specifically with respect to the number of controller actuators such as e-motors. However, hard constraints on cost and on physical boundaries such as maximum power dissipation per unit and pin-count per unit/connector require new solutions to alternative system partitioning. Vehicle manufacturers, as well as system and semiconductor suppliers are striving for increased scalability and modularity to allow for most cost optimal high volume configurations while featuring platform reuse and feature differentiation. This paper presents new semiconductor based approaches with respect to technologies, technology mapping and assembly technologies.

This paper shall present advancements in electronic transmission control circuits addressing new challenges in the gearbox striving for improved vehicle efficiency and comfort of driving. Efficient chipset design, requires finding the optimal partitioning, that is the mapping of functionality to hardware or software and analog or digital circuit technology. The efficiency will be judged by minimal cost whilst achieving improved functionality and required scalability for a platform approach. Specific examples demonstrated are smart sensor architecture and new mapping of control strategies, realized with a novice integrated current control IC concept. Comparisons on system level are used to evaluate different function mappings as well as component partitioning. Details of the most optimized mapping and partitioning will be elaborated and first results of implementation in silicon components will be shown.

In the case of a side impact the decision to deploy an airbag has to be taken much faster as it would be required for a front impact. Furthermore, there is a significant spread of the measurable acceleration depending on which pillars of the cars side are hit. Measuring the pressure inside the door as a direct result of an impact, the deformation of the door becomes observable. Based on pressure measurements side impacts can be detected much faster and more reliable. Therefore side airbag pressure sensors are established as add-on or replacement for side airbag acceleration sensors. This paper will present a Side Airbag Chip Set comprising of a side airbag pressure sensor and a satellite receiver. The system architecture and the partitioning between a single chip solution for the side airbag pressure sensor module plus the compatible satellite receiver will be described.

The development of highly automated driving functions (AD) recently rises the demand for so called Fail-Operational systems for native driving functions like steering and braking of vehicles. Fail-Operational systems shall guarantee the availability of driving functions even in presence of failures. This can also mean a degradation of system performance or limiting a system’s remaining operating period. In either case, the goal is independency from a human driver as a permanently situation-aware safety fallback solution to provide a certain level of autonomy. In parallel, the connectivity of modern vehicles is increasing rapidly and especially in vehicles with highly automated functions, there is a high demand for connected functions, Infotainment (web conference, Internet, Shopping) and Entertainment (Streaming, Gaming) to entertain the passengers, who should no longer occupied with driving tasks.

The newly released Distributed System Interface 3 (DSI3) Bus Standard specification defines three modulation levels form which 16 valid symbols are coded. This complex structure is best decoded with symbol pattern recognition. This paper proposes a simplification of the correlation score calculation that sharply reduces the required number of operations. Additionally, the paper describes how the pattern recognition is achieved using correlation scores and a decoding algorithm. The performance of this method is demonstrated by mean of simulations with different load models between the master and the sensors and varying noise injection on the channel. We prove than the pattern recognition can decode symbols without any error for up to 24dBm.

Today the majority of power electronics is developed based on the requirements set by the main fields of application e.g. power generation, power supply, industrial drive and traction. With introduction to automotive applications new requirements have to be taken into account. This paper discusses how interconnection technologies for power semiconductors can be improved to meet the demand for higher temperature capability in HEV applications.

This paper will address the electronic development in the wireless industry and compare it to the electronic development in the automotive industry. The wireless industry is characterized by rapid, dramatic high tech changes with a less than two-year cycle time and an equivalent life cycle. The automotive electronics industry is working toward reducing the typical 2 to 3 year development cycle down 1 to 2 years but with a life cycle of 10 years or more. In addition to realizing the electronic development benefits seen in the wireless industry, the automotive industry places significantly more emphasis on the quality and reliability aspects of their designs as many of them are targeted toward, or interface with, safety critical applications. One of the lessons learned from the wireless industry is the development process; where the hardware selection process can be accomplished in a virtual environment in conjunction with concurrent software development.

In terms of modern technical systems, the automotive sector is characterized by escalating complexity and functionality requirements. The development of embedded control systems has to meet highest demands regarding process-, time- and cost-optimization. Hence, the efficiency of software development becomes a crucial competitive advantage. Systems design engineers need effective tools and methods to achieve exemplary speed and productivity within the development phase. To obtain such tools and methods, semiconductor manufacturers and tool manufacturers must work closely together. Within the joint efforts of ETAS and Infineon, the software tool suite ASCET-SD was enhanced to generate efficient C code for Infineon's TriCore architecture mapped on ETAS's real-time operating system ERCOSEK. The processor interface to application & calibration tools was realized using the ETK probe based on a JTAG/Nexus link at very high bandwidth.

Infineon's latest high-end automotive microcontrollers like TC1796 are complex Systems On Chip (SoC) with two processor cores and up to two internal multi-master buses. The complex interaction between cores, peripherals and environment provides a big challenge for debugging. For mission critical control like engine management the debugging approach must not be intrusive. The provided solution are dedicated Emulation Devices which are able to deal with several 10 Gbit/s of raw internal trace data with nearly no cost adder for mass production and system design. Calibration, which is used later in the development cycle, has different requirements, but is covered by the Emulation Devices as well. The architecture of TC1796ED comprises the unchanged TC1796 silicon layout, extended by a full In-Circuit Emulator (ICE) and calibration overlay memory on the same die. In most cases, the only debug/calibration tool hardware needed is a USB cable.

The constant motivation for lower fuel consumption and emission levels has always been in the minds of most auto makers. Therefore, it is important to have precise control of the fuel being delivered into the engine. Gasoline Port fuel injection has been a matured system for many years and cars sold in emerging markets still favor such system due to its less system complexity and cost. This paper will explain injection control strategy of today during development, and especially the injector dead-time compensation strategy in detail and how further improvements could still be made. The injector current profile behavior will be discussed, and with the use of minimum hardware electronics, this paper will show the way for a new compensation strategy to be adopted.

This paper focuses on the requirements of electronic systems in automotive applications in terms of reliability and quality. As one of the most common devices in such applications for switching electronic loads, the power MOSFET, is investigated in detail. Today's qualification procedure for discrete devices according to AEC Q101 [1] will be explained and how this correlates to the stress of the device in the application. It will be pointed out what additional tests for “extended qualification” should be made to deal with critical failure modes reducing overly conservative safety margins and preventing excessive costs on the component side. The tests will be explained and the results presented.

Vehicle manufacturers are challenged by rising costs for vehicle recalls. A major part of the costs are caused by software updates. This paper describes a feasibility study on how to implement software update over the air (SOTA) in light vehicles. The differences and special challenges in the automotive environment in comparison to the cellular industry will be explained. Three key requirements focus on the drivers’ acceptance and thus are crucial for the vehicle manufacturers: SOTA must be protected against malicious attacks. SOTA shall interfere as little as possible with the availability of a vehicle. Long update processes with long vehicle downtimes or even complete fails must be avoided. The functional safety of the vehicle during operation may not be limited in any way The study gives options how those objectives can be achieved. It considers the necessary security measures and describes the required adaptations of the board-net architectures both on software and hardware level.

The automotive industry experiences a major change as vehicles are gradually becoming a part of the Internet. Security concepts based on the closed-world assumption cannot be deployed anymore due to a constantly changing adversary model. Automotive Ethernet as future in-vehicle network and a new E/E Architecture have different security requirements than Ethernet known from traditional IT and legacy systems. In order to achieve a high level of security, a new multi-layer approach in the vehicle which responds to special automotive requirements has to be introduced. One essential layer of this holistic security concept is to restrict non-authorized access by the deployment of embedded firewalls. This paper addresses the introduction of automotive firewalls into the next-generation domain architecture with a focus on partitioning of its features in hardware and software.