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A unified approach has been developed and applied to solder joint life prediction in this paper, which indicates a breakthrough for solder joint reliability simulation. It includes the material characterization of solder alloys, the testing of solder joint specimens, a unified viscoplastic constitutive framework with damage evolution, numerical algorithm development and implementation, and experimental validation. The emphasis of this report focuses on the algorithm development and experimental verification of proposed viscoplasticity with damage evolution.

A new algorithm for carrier removal, a key step in the Fourier transform method of fringe pattern analysis, is presented in this paper. The accuracy of frequency estimations is critical to carrier removal to avoid potential significant errors in the recovered phase. A new algorithm on Fourier transform and curve fitting technique is developed. To avoid an ill-conditioned result in solving the least-square problem, an orthogonal polynomial curve fitting algorithm is developed. A new system that combines projected grating moiré (PM) with shadow moiré (SM), recently designed and built with large dynamic range for both component level and board level warpage measurement for the reliability study of electronic packaging materials and structures, is presented and demonstrated.