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This paper presents a new method of reliability testing for C-MOS VLSI's evaluation, i.e. a means to verify the future reliability prediction. In this method, VLSI's under testing are stressed by soft x-ray irradiation and subsequently annealed at moderate temperature and then they are classified according to the time required to recover the computer action of VLSI's to the previous level. This method offers a new technology for future reliability testing in higher accuracy of C-MOS VLSI's used in automotive electronics system compared to the conventional technique so called burn-in.

A highly corrosion resistant drawn cup type evaporator was developed. During the development of this evaporator, the corrosion characteristics of evaporators in the field were examined in detail. Profound understanding of the corrosion mechanism led to the development of a new, unique, corrosion test method which simulates the actual evaporator field service environment. The main factors involved in increasing the corrosion resistance of the brazing sheet are (1) reduction of iron and silicon content in the core alloy and, (2) addition of titanium to the core alloy. In the present alloy, titanium content varies lamellarly through the thickness of the core alloy. Regions of high titanium content have a more cathodic potential, thus causing corrosion to proceed along the low titanium content lamellae. Consequently, the reduced iron and silicon contents, and the titanium addition, have the net effect of reducing the pitting corrosion rate.

Extensive work was conducted to develop a corrosion resistant brazing sheet alloy and to apply it to a drawn cup type evaporator in automotive air conditioning system. The items to be investigated included the influence of chemical composition of the core alloy on corrosion resistance, suppression of erosion during the brazing cycle, and enhancement of the brazing sheet formability. Additional investigation was conducted to develop a new corrosion test method on the basis of better understanding of the mechanism of corrosion in the field and to evaluate the corrosion resistance of a evaporator fabricated from the new alloy. This paper, as Part 1, describes the results of alloy development from the metallurgical and electrochemical point of view.

We have developed a highly corrosion-resistant serpentine type condenser which is characterized by its manufacturing process that zinc is coated on the surface of a multi-cavity extruded tubing at the rate of 5-20 g/m2 by arc spray, and then, thus prepared tubing and corrugated fin stocks are brazed by the conventional Nocolok brazing process (Herein after this is referred to as ZAS NB process). By this brazing process as well as conventional flux brazing (FB) process, a highly pitting corrosion-resistant zinc diffusion layer is formed on the surface of the tubing at the time when brazing is operating. This newly developed method achieved improvements in productivity and quality of product.

The conventional relay manufacturing line required several workers for manual assembly and adjustment operations. This problem was compounded by the fact that high precision quality of the product could not be easily achieved. To solve these problems, Nippondenso has made a breakthrough in developing new technologies which were incorporated in an automated relay manufacturing line, enabling an individual process cycle time of 0.9 seconds throughout all manufacturing processes. This includes component parts fabrication, assembly, inspection, adjustment and packaging, and does not require the direct intervention of any operators. Various models of relays can be run at the same time in this line because the set up time for different models is almost zero. This greatly improves production control.

As a part of a project to develop high performance, compact and lightweight vehicle radiators, a highly corrosion resistive fin has been developed, especially for use in the salt-laden environment. It is a thin plate with a mutual diffusion layer of Cu-Zn formed on either surface. Owing to this composite structure, not only the corrosion resistance is double that of Cu-Sn alloy fins that are currently in use with a thickness over 20% smaller than the latter (38 μm vs 50 μm), but the corrosion of the bonding solder has been reduced to one half because the Cu-Zn diffused layer has brought about substantial reduction in the fin's surface potential.