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This paper describes the development of a distributed environment for spaceport simulation modeling. This distributed environment is the result of the applications of the High-Level Architecture (HLA) and integration frameworks based on software agents and XML. This distributed environment is called the Virtual Test Bed (VTB). A distributed environment is needed due to the nature of the different models needed to represent a spaceport. This paper provides two case studies: one related to the translation of a model from its native environment and the other one related to the integration of real-time weather.

The future of human exploration in the solar system is contingent on the ability to exploit resources in-situ to produce mission consumables. Specifically, it has become clear that the success of a manned mission to Mars will likely depend on fuel components created on the Martian surface. While several architectures for an unmanned fuel production surface facility on Mars exist in theory, a simulation of the performance and operation of these architectures has not been created. In this paper, the framework describing a simulation of one such architecture is defined. Within this architecture, each component of the base is implemented as a state machine, with the ability to communicate with other base elements as well as a supervisor. An environment supervisor is also created which governs low level aspects of the simulation such as movement and resource distribution, in addition to higher-level aspects such as location selection with respect to operations specific behavior.

In this paper, we address the thermal management issues which limit the lifespan, specific power and overall efficiency of an air-cooled rotary Wankel engine used in Unmanned Air Vehicles (UAVs). Our goal is to eliminate the hot spots and reduce the temperature gradients in the engine housing and side plates by aggressive heat spreading using heat pipes. We demonstrate by simulation that, for a specific power requirement, with heat spreading and more effective heat dissipation, thermal stress and distortion can be significantly reduced, even with air cooling. The maximum temperature drop was substantial, from 231°C to 129°C. The temperature difference (measure of temperature uniformity) decreased by 8.8 times (from 159°C to 18°C) for a typical UAV engine. Our heat spreaders would not change the frontal area of the engine and should have a negligible impact on the installed weight of the propulsion assembly.

A power electronics module was equipped with an evaporative spray cooling nozzle assembly that served to remove waste heat from the silicon devices. The spray cooling nozzle assembly took the place of the standard heat sink, which uses single phase convection. The purpose of this work was to test the ability of spray cooling to enable higher power density in power electronics with high temperature coolant, and to be an effective and lightweight system level solution to the thermal management needs of aerospace vehicles. The spray cooling work done here was with 95 °C water, and this data is compared to 100 °C water/ propylene glycol spray cooling data from a previous paper so as to compare the spray cooling performance of a single component liquid to that of a binary liquid such as WPG. The module used during this work was a COTS module manufactured by Semikron, Inc., with a maximum DC power input of 180 kW (450 VDC and 400 A).

This paper presents the concept of a dual latent heat sink for thermal management of pulse heat generating electronic systems. The focus of this work is to verify the effectiveness of the concept during charging through experimentation. Accordingly, custom components were built and a prototype version of the heat sink was fabricated. Experiments were performed to investigate the implementation feasibility and heat transfer performance. It is shown that this heat sink is practicable and helps in arresting the system temperature rise during charging (period of pulse heat load).

Aerospace projects live a long time. Around the turn of the century, NASA first began to discuss multi-decadal projects with respect to the tools, methods, infrastructure and culture necessary to successfully establish outposts and bases both on the Moon as well as in adjacent space. Pilot projects were completed, capabilities developed and solutions were shared across the Agency. A decade later the Mars discussion was multi-generational with planning milestones 50 years in the future. The 1970’s Requirements Document, or the 1990’s System Model are nowhere near suitable for planning, development, integration and operations of multi-national, highly complex, incredibly expensive development efforts planned to outlast not only the careers of the developers but that of their children as well. Simulation in the different forms has become very important for this multi-decadal projects. The challenge will be to device ways to create formats and views which can stand time.

In this paper, we introduce the use of ontologies to implement the information developed and organized by resource planning tools into standard project management documents covering integrated cost, resource modeling and analysis, and visualization. The basic upper ontology used for NASA Space Operations is explained and the results obtained are discussed. This ontology-centered approach is looking for tighter connections between software, hardware, and systems engineering.

Effective thermal management and removal of the waste heat generated at diode arrays is critical to the development of high-power solid-state lasers. Thermal design must be considered in the packaging of these arrays. Two different packages with heat dissipation through spray cooling are evaluated experimentally and numerically. Their overall performance is compared with other packaging configurations using different heat removal approaches. A novel packaging design is proposed that can fulfill the requirements of low thermal resistance, temperature uniformity among emitters in the diode array, low coolant flow rate, simplicity and low assembly cost. The effect of temperature uniformity on the pumping efficiency for gain media is examined for our novel packaging design. The thermal stress induced by temperature variation within an emitter is also considered.

The term “productivity” all too often has becomes a buzz-word, ultimately diminishing its perceived importance. However, productivity is the major concern of any team, and therefore must be defined to gain an appropriate understanding of how a system is actually working. Here, productivity means the level of contribution to the throughput of a system such as defined in the Theory of Constraints. In the field of space exploration, the throughput is the number of milestones of the mission accomplished as well as the potential survival during extreme events (due to failures or other unplanned events). For a time tasks were accomplished by expert individuals (e.g., an astronaut), but recently team structures have become the norm. It is clear that with increased mission complexity, “no single entity can have complete knowledge of or the abilities to handle all matters” [10].