Refine Your Search

Search Results

Viewing 1 to 2 of 2
Technical Paper

An Enhanced Secondary Control Approach for Voltage Restoration in the DC Distribution System

2016-09-20
2016-01-1985
The paper will deal with the problem of establishing a desirable power sharing in multi-feed electric power system for future more-electric aircraft (MEA) platforms. The MEA is one of the major trends in modern aerospace engineering aiming for reduction of the overall aircraft weight, operation cost and environmental impact. Electrical systems are employed to replace existing hydraulic, pneumatic and mechanical loads. Hence the onboard installed electrical power increases significantly and this results in challenges in the design of electrical power systems (EPS). One of the key paradigms for future MEA EPS architectures assumes high-voltage dc distribution with multiple sources, possibly of different physical nature, feeding the same bus(es). In our study we investigate control approaches to guarantee that the total electric load is shared between the sources in a desirable manner. A novel communication channel based secondary control method is proposed in this paper.
Technical Paper

Transient Stability Analysis of DC Solid State Power Controller (SSPC) for More Electric Aircraft

2018-10-30
2018-01-1927
The solid state power controller (SSPC) is one of the most important power electronic components of the aircraft electrical power distribution (EPS) systems. This paper presents an architecture of the DC SSPC and provides the mitigation techniques for transient voltage overshoot during its turn-off. The high source side inductance carries breaking current (9xnominal current) just before turnoff and induces large voltage transient across the semiconductor devices. Therefore, the stored inductive energy needs to be dissipated in order to prevent semiconductor switches from over-voltage/thermal breakdown. Three different transient voltage suppression (TVS) devices to reduce voltage stress across switches are included in the paper for detail study. The comprehensive comparison of the TVS devices is presented. In addition, the thermal impact of the TVS devices on the semiconductor switches is also analyzed.
X