This specification establishes the acceptance criteria and inspection requirements for adhesive-bonded sandwich structures including the metal-to-metal bonding found in these structures.
This specification covers one type of epoxy-resin-impregnated boron filaments 0.004 in. (0.10 mm) in diameter in the form of continuous tape supported on a glass fabric carrier.
This specification covers one type of epoxy-resin-impregnated boron filaments 0.004 in. (0.100 mm) in diameter in the form of continuous tape supported on a glass cloth carrier.
This specification covers one type of epoxy-resin-impregnated boron filaments 0.004 in. (0.100 mm) in diameter in the form of continuous tape supported on a glass cloth carrier.
This specification covers one type of epoxy-resin-impregnated boron filaments 0.0056 in. (0.14 mm) in diameter in the form of continuous tape supported on a glass fabric carrier.
This specification covers one type of epoxy-resin-impregnated boron filaments 0.0056 in. (0.140 mm) in diameter in the form of continuous tape supported on a glass cloth carrier.
This specification covers one type of epoxy-resin-impregnated boron filaments 0.0056 in. (0.140 mm) in diameter in the form of continuous tape supported on a glass cloth carrier.
This specification covers one type of epoxy-resin-impregnated boron filaments 0.0008 in. (0.20 mm) in diameter in the form of continuous tape supported on a glass fabric carrier.
This specification covers one type of epoxy-resin-impregnated boron filaments 0.0008 in. (0.200 mm) in diameter in the form of continuous tape supported on a glass cloth carrier.
This specification covers one type of epoxy-resin-impregnated boron filaments 0.0080 in. (0.200 mm) in diameter in the form of continuous tape supported on a glass cloth carrier.