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The development of highly automated driving functions (AD) recently rises the demand for so called Fail-Operational systems for native driving functions like steering and braking of vehicles. Fail-Operational systems shall guarantee the availability of driving functions even in presence of failures. This can also mean a degradation of system performance or limiting a system’s remaining operating period. In either case, the goal is independency from a human driver as a permanently situation-aware safety fallback solution to provide a certain level of autonomy. In parallel, the connectivity of modern vehicles is increasing rapidly and especially in vehicles with highly automated functions, there is a high demand for connected functions, Infotainment (web conference, Internet, Shopping) and Entertainment (Streaming, Gaming) to entertain the passengers, who should no longer occupied with driving tasks.

Classic vehicle production had limitations in bringing the driving commands to the actuators for vehicle motion (engine, steering and braking). Steering columns, hydraulic tubes or steel cables needed to be placed between the driver and actuator. Change began with the introduction of e-gas systems. Mechanical cables were replaced by thin, electric signal wires. The technical solutions and legal standardizations for addressing the steering and braking systems, were not defined at this time. Today, OEMs are starting E/E-Architecture transformations for manifold reasons and now have the chance to remove the long hydraulic tubes for braking and the solid metal columns used for steering. X-by-wire is the way forward and allows for higher Autonomous Driving (AD) levels for automated driving vehicles. This offers new opportunities to design the vehicle in-cabin space. This paper will start with the introduction of x-by-wire technologies.

Software complexity of vehicles is constantly growing especially with additional autonomous driving features being introduced. This increases the risk for bugs in the system, when the car is delivered. According to a car manufacturer, more than 90% of availability problems corresponding to Electronic Control Unit (ECU) functionality are either caused by software bugs or they can be resolved by applying software updates to overcome hardware issues. The main concern are sporadic errors which are not caught during the development phase since their trigger condition is too unlikely to occur or is not covered by the tests. For such systems, there is a need of safe and secure infield diagnosis. In this paper we present a tool software architecture with remote access, which facilitates standard read/write access, an efficient channel interface for communication and file I/O, and continuous trace.

The current automotive electronic and electrical (EE) architecture has reached a scalability limit and in order to adapt to the new and upcoming requirements, novel automotive EE architectures are currently being investigated to support: a) an Ethernet backbone, b) consolidation of hardware capabilities leading to a centralized architecture from an existing distributed architecture, c) optimization of wiring to reduce cost, and d) adaptation of service-oriented software architectures. These requirements lead to the development of Zonal EE architectures as a possible solution that require appropriate adaptation of used security mechanisms and the corresponding utilized hardware trust anchors. 1 The current architecture approaches (ECU internal and in-vehicle networking) are being pushed to their limits, simultaneously, the current embedded security solutions also seem to reveal their limitations due to an increase in connectivity.

Recently, vehicle networks have increased complexity due to the demand for autonomous driving or connected devices. This increasing complexity requires high bandwidth. As a result, vehicle manufacturers have begun using Ethernet-based communication for high-speed links. In order to deal with the heterogeneity of such networks where legacy automotive buses have to coexist with high-speed Ethernet links vehicle manufacturers introduced a vehicle gateway system. The system uses Ethernet as a backbone between domain controllers and CAN buses for communication between internal controllers. As a central point in the vehicle, the gateway is constantly exchanging vehicle data in a heterogeneous communication environment between the existing CAN and Ethernet networks. In an in-vehicle network context where the communications are strictly time-constrained, it is necessary to measure the delay for such routing task.

For highly automated driving, commercial vehicles require an Electric/Electronic (E/E) architecture, which - in addition to sensor fusion - ensures safety-critical processes such as steering and braking at all times. Among other things, a redundant 24 V supply with corresponding disconnection is required. The battery switch is a key component. Commercial, construction, and agricultural vehicles (CAV) need to operate at the highest possible availability and the lowest possible cost of ownership. This is why automated and autonomous driving has the potential to revolutionize the CAV sector. Driverless machines can be operated around the clock and almost non-stop. Platooning allows automated, interconnected trucks to drive in a convoy and very close to each other. Platooning saves fuel.

Autonomous driving systems and connected mobility are the next big developments for the car manufacturers and their suppliers during the next decade. To achieve the high computing power needs and fulfill new upcoming requirements due to functional safety and security, heterogeneous processor architectures with a mixture of different core architectures and hardware accelerators are necessary. To tackle this new type of hardware complexity and nevertheless stay within monetary constraints, high performance computers, inspired by state of the art data center hardware, could be adapted in order to fulfill automotive quality requirements. The European Processor Initiative (EPI) research project tries to come along with that challenge for next generation semiconductors. To be as close as possible to series development needs for the next upcoming car generations, we present a hybrid semiconductor system-on-chip architecture for automotive.

Advanced safety features and new services in connected cars depend on the security of the underlying vehicle functions. Due to the interconnection with the outside world and as a result of being an embedded system a modern vehicle is exposed to both, malicious activities as faced by traditional IT world systems as well as physical attacks. This introduces the need for utilizing hardware-assisted security measures to prevent both kinds of attacks. In this paper we present a survey of the different classes of hardware security devices and depict their different functional range and application. We demonstrate the feasibility of our approach by conducting a case study on an exemplary implementation of a function-on-demand use case. In particular, our example outlines how to apply the different hardware security approaches in practice to address real-world security topics. We conclude with an assessment of today’s hardware security devices.

A cooperation of several research partners supported by the German Federal Ministry of Research and Education proposes a new active matrix LED light source. A multi pixel flip chip LED array is directly mounted to an active driver IC. A total of 1024 pixel can be individually addressed through a serial data bus. Several of these units are integrated in a prototype headlamp to enable advanced light distribution patterns in an evaluation vehicle.

The trend towards even more sophisticated driver assistance systems and growing automation of driving sets new requirements for the robustness and availability of the involved automotive systems. In case of an error, today it is still sufficient that safety related systems just fail safe or silent to prevent safety related influence of the driving stability resulting in a functional deactivation. But the reliance on passive mechanical fallbacks in which the human driver taking over control, being inevitable in such a scenario, is expected to get more and more insufficient along with a rising degree of driving automation as the driver will be given longer reaction time. The advantage of highly or even fully automated driving is that the driver can focus on other tasks than controlling the car and monitoring it’s behavior and environment.

This paper presents a reliability study of a directly cooled IGBT module after a test drive of 85,000 Km in a fuel cell electric vehicle, as well as of an indirectly cooled IGBT module after a test drive of 200,000km in a hybrid car on public roads. At the end of the test drive, the inverter units were disassembled and analyzed with regard to the lifetime consumption. First, electrical measurements were carried out and the results were compared with the ones obtained directly after module production (End of Line test). After that, ultrasonic microscopy was performed in order to investigate any delamination in the solder layers. As a third step, an optical inspection was performed to monitor damages in the housing, formation of cracks or degradation of wire bonds. The results show none of the depicted failure modes could be found on the tested power modules after the field test. Obviously, no significant life time consumption could be observed.

The standard ISO 26262 stipulates a “top-down” approach based on the process “V” model, by conducting a hazard analysis and risk assessment to determine the safety goals, and subsequently derives the safety requirements down to the appropriate element level. The specification of safety goals is targeted towards identified hazardous events, whereas the classification of safety requirements does not always turn out non-ambiguous. While requirement formalization turns out to be advantageous, the translation from natural language to semi-formal requirements, especially in context of ISO 26262, poses a problem. In this publication, a new approach for the formalization of safety requirements is introduced, targeting the demands of safety standard ISO 26262. Its part 8, clause 6 (“Specification and management of safety requirements”) has no dedicated work product to accomplish this challenging task.

The newly released Distributed System Interface 3 (DSI3) Bus Standard specification defines three modulation levels form which 16 valid symbols are coded. This complex structure is best decoded with symbol pattern recognition. This paper proposes a simplification of the correlation score calculation that sharply reduces the required number of operations. Additionally, the paper describes how the pattern recognition is achieved using correlation scores and a decoding algorithm. The performance of this method is demonstrated by mean of simulations with different load models between the master and the sensors and varying noise injection on the channel. We prove than the pattern recognition can decode symbols without any error for up to 24dBm.

Integration scenarios for ECU software become more complicated, as more constraints with regards to timing, safety and security need to be considered. Multi-core microcontrollers offer even more hardware potential for integration scenarios. To tackle the complexity, more and more model based approaches are used. Understanding the interaction between the different software components, not only from a functional but also from a timing view, is a key success factor for high integration scenarios. In particular for multi-core systems, an amazing amount of timing data can be generated. Usually a multi-core system handles more software functionality than a single-core system. Furthermore, there may be timing interference on the multicore systems, due to the shared usage of buses, memory banks or other hardware resources.

The electrification of the powertrain is still one of the main challenges and innovation drivers for modern cars. With the introduction of the Toyota Prius, launched in Japan in 1997 the first commercially available hybrid car in mass production, the development continued towards the BMW i3 launched in July 2013. One main component for all kind of hybrid cars is still the power semiconductor, which is used for DC/DC converters and for the inverter to drive the electric motor for the traction control. What makes the selection of the right power semiconductor complex, is the variety of different voltage levels within the car (from standard 12V board net, the new 48V board net all the way up to 400V and above) plus different requirements in terms of switching and conduction performance, or accordingly power losses. The selection of device by application and voltage will be discussed in this paper.

Glare-free high beams are a consistent enhancement of adaptive headlight systems for vehicles with advanced driver assist systems. A prerequisite for these are camera-based systems with the ability to recognize and classify objects such as vehicles in front or oncoming vehicles when driving at night. These objects can then be dynamically masked out of the high beam of the specially designed headlights. Since we are talking about moving objects, it is essential for the high beam to be continuously and dynamically adapted. This paper describes a modular LED matrix system for dynamically adjusting a glare-free and continuously active high beam. The main focus was on the modularity of the system and the optimization of the thermal properties of an LED matrix in order to ensure that operation was reliable under the harsh environmental conditions inside a headlight. Specific control electronics and different interconnection methods were examined.

The three major challenges in the power electronics in hybrid and electric vehicles are: System cost, power density and reliability. High temperature power device and packaging technologies increases the power density and reliability while reducing system cost. Advanced Silicon devices with synthesized high-temperature packaging technologies can achieve junction temperature as high as 200C (compared to the present limitation of 150C) eliminating the need for a low-temperature radiator and therefore these devices reduces the system cost. The silicon area needed for a power inverter with high junction temperature capability can be reduced by more than 50 - 75% thereby significantly reducing the packaging space and power device and package cost. Smaller packaging space is highly desired since multiple vehicle platforms can share the same design and therefore reducing the cost further due to economies of scale.

This paper considers the verification of non-standard CAN network topologies of the physical layer at high speed transmission rate (500.0Kbps and 1.0Mbps). These network topologies including single star, multiple stars, and hybrid topologies (multiple stars in combination with linear bus or with ring topology) are simulated by using behavior modeling language (VHDL-AMS) in comparison to measurement. Throughout the verification process, CAN transceiver behavioral model together with other CAN physical layer simulation components have been proved to be very accurate. The modeling of measurement environment of the CAN network is discussed, showing how to get the measurement and simulation results well matched. This demonstrates that the simulation solution is reliable, which is highly desired and very important for the verification requirement in CAN physical layer design.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers with incredible levels of peripheral integration. As a result, performance can no longer be measured in MIPS (Millions of Instructions Per Second). A microcontroller's effectiveness is based on coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, the designer needs benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment.

This paper will give an overview of multicore in automotive applications, covering the trends, benefits, challenges, and implementation scenarios. The automotive silicon industry has been building multicore and multiprocessor systems for a long time. The reasons for this choice have been: increased performance, safety redundancy, increased I/O & peripheral, access to multiple architectures (performance type e.g. DSP) and technologies. In the past, multiprocessors have been mainly considered as multi-die, multi-package with simple interconnection such as serial or parallel busses with possible shared memories. The new challenge is to implement a multicore, micro-processor that combines two or more independent processors into a single package, often a single integrated circuit (IC). The multicores allow a computing device to exhibit some form of thread-level parallelism (TLP).