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Technical Paper

Microsensor Fusion Technology for Space Vehicle Reliability Enhancement

1994-04-01
941203
In this work, the goal of enhanced reliability through redundancy is explored. Two levels of fusion have been defined: the first is a fusion of sensors, redundant in both number and type, and the second is a statistical fusion of the resulting data at a software level. An intermediate preprocessing level is required to connect both fusions. The various types of sensors which are included are bulk micromachined flow, pressure and hydrogen sensors and a thin film poly-crystalline silicon temperature sensor. Individual sensors have been fabricated and packaged in arrays. Associated preprocessing has been designed to be able to handle all of the signals coming from each sensor and prepare them for statistical analysis. Data fusion algorithms have been written and tested.
Technical Paper

SSME Parameter Modeling with Neural Networks

1994-04-01
941221
The High Pressure Oxidizer Turbine (HPOT) discharge temperature of the Space Shuttle Main Engine (SSME) was estimated using Radial Basis Function Neural Networks (RBFNN) during the startup transient. Estimation was performed for both nominal engine operation and during simulated input sensor failures. The K-means clustering algorithm was used on the data to determine the location of the basis function centers. The performance of the RBFNN is compared with that of a feedforward neural network trained with the Quickprop learning algorithm.
Technical Paper

Generalization of an Automated Visual Inspection System (AVIS)

1994-04-01
941219
Efforts have been made to utilize Al constructs to identify flaws in the Space Shuttle Main Engine (SSME) faceplate regions. In order to expand the applicability of these algorithms to a larger problem domain, the automatic visual inspection system(AVIS) has been modified to enable a user with little or no image processing background to define a system capable of identifying flaws on a given set of imagery. This system requires the user to simply identify flawed regions and the selection of processing and feature descriptors is performed automatically. This paper explicates the motivations, definitions, and performance issues associated with the AVIS paradigm.
Technical Paper

SiC Devices for Space Electronics: Phase I - High Voltage, Temperature Hard Contacts

1994-04-01
941227
High voltage Schottky diodes have been fabricated on 3C-SiC films grown on Si substrates. A Ni metallization process has been developed to fabricate both rectifying and ohmic contacts to SiC by controlling the post-annealing temperature. A high voltage (>150V) breakdown has been obtained at room temperature from the SiC Schottky diode. The Ni-SiC Schottky junction shows a thermal resistance for temperatures as high as 600°C. This technology has good potential for monolithic integration of SiC high power devices and Si integrated circuits.
Technical Paper

Optical Fiber Coupled Sensors Integrating Optical Waveguides and Micromechanical Structures on Silicon

1994-04-01
941205
Electrically passive optical sensors have been formed using optical waveguides and micromachined-micromechanical structures on silicon substrates. We present recent results on an interferometric pressure sensor where pressure-induced strain in a micromachined diaphragm alters the path length of an optical channel waveguide ring resonator. Pressure is detected as a change in the resonant condition of the ring and found to vary linearly over a range of -100 to 400 kPa with a sensitivity of 0.0094 rad/kPa. Problems with attaching this sensor for testing will be discussed. Our second device is an intensity-type accelerometer utilizing a micromachined cantilever beam. Light transmission across a gap between two channel waveguides, one located on a beam bent by acceleration and another which remains fixed, is measured optically. We show preliminary measurements of the coupling between two closely spaced waveguide sections which agree with overlap integral calculations.
Technical Paper

Integrated Aircraft Thermal Management & Power Generation: Reconfiguration of a Closed Loop Air Cycle System as a Brayton Cycle Gas Generator to Support Auxiliary Electric Power Generation

2014-09-16
2014-01-2192
The optimal integration of vehicle subsystems is of critical importance in the design of future energy efficient fighter aircraft. The INVENT (INtegrated Vehicle ENergy Technology) program has been dedicated to this endeavor through modeling/simulation of thermal management, power generation & distribution, & actuation subsystems. Achieving dual cooling & power generation capability from a single subsystem would be consistent with current efforts in system integration optimization. In this paper, we present a reconfiguration of an archetypal closed-loop air cycle system for a modern fighter as an open-loop gas generator cycle operating interchangeably between refrigeration and auxiliary power modes. A numerical model was developed within NPSS to assess maximum power extraction capabilities of a system originally designed for cooling purposes under different operating conditions.
Technical Paper

Joining of a PdCr Resistance Strain Gauge to Inconel 718 Using an Infrared Process

1994-04-01
941201
Joining of a PdCr Strain Gage with a Hastelloy X carrier shim to Inconel by a rapid infrared processing technique has been investigated at 1150 °C using a nickel based brazing alloy AMS 4777, Ni-7Cr-3Fe-3.2B-4.5Si-.06C in wt%. The effects of the infrared joining parameters on the joint and base material microstructure, joint shear strength, and delamination tendency of the PdCr gage was investigated. Results show that the joint shear strength is as high as 503 MPa when processed at approximately 1150 °C for 120 seconds. Microstructural examinations of the joint with both an optical microscope and a scanning electron microscope indicate that good wetting exists between the brazing alloy with both the Hastelloy X and Inconel 718. And, the Hastelloy X and Inconel 718 exhibits no noticeable change in microstructure due to the rapid processing cycle of the infrared heating process while the stabilized PdCr wire gage shows little change in resistance.
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