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Training / Education

Control Systems Simplified

This course introduces the highly mathematical field of control systems focusing on what the classical control system tools do and how they can be applied to automotive systems. Dynamic systems, time/frequency responses, and stability margins are presented in an easy to understand format. Utilizing Matlab and Simulink, participants will learn how simple computer models are generated. Other fundamental techniques in control design such as PID and lead-lag compensators will be presented as well as the basics of embedded control systems.
Training / Education

Fundamentals of Powertrain Design for Hybrid Electric Vehicles

This course is offered in China only and presented in Mandarin Chinese. The course materials are bilingual (English and Chinese). Driven by high fuel prices, environmental regulations, and consumer demand, the market for hybrid electric vehicles (HEV) has experienced rapid growth. Every major automotive company produces an HEV. There are approximately fifty different HEV models on the market and over eight million HEVs already sold. In order to meet current and future demands in the HEV and PHEV markets, success will depend on engineering personnel knowing how to develop and manufacture HEV powertrains.
Training / Education

The Principles and Applications of Powertrain Controls for the New Energy Vehicles

课程概述 Powertrain controls for NEVs are one of the most complex and highly confidential areas of NEV research and development.  This two-day course takes the seemingly complicated field of NEV powertrain controls and summarizes it into a few basic principles.  The latest and most popular NEV powertrains are also reviewed to illustrate these principles and the controls strategies used.  对于新能源汽车来说,动力总成控制一直以来都是最复杂的和高度机密的领域之一。在这两天的课程中,我们将把看似复杂的动力总成控制系统总结出几条基本规则,同时,通过对当今其他车型动力控制系统的案例分析,来把这些规则和原理进行融会贯通。
Training / Education

Emissions-Related OBD Systems A Design Overview

This course is designed to provide an overview of the fundamental design objectives and the features needed to achieve those objectives for generic on-board diagnostics. The basic structure of an on-board diagnostic will be described along with the system definitions needed for successful implementation.
Training / Education

Designing On-Board Diagnostics for Light and Medium Duty Emissions Control Systems

2024-09-24
On-board diagnosis of engine and transmission systems has been mandated by government regulation for light and medium vehicles since the 1996 model year. The regulations specify many of the detailed features that on-board diagnostics must exhibit. In addition, the penalties for not meeting the requirements or providing in-field remedies can be very expensive. This course is designed to provide a fundamental understanding of how and why OBD systems function and the technical features that a diagnostic should have in order to ensure compliant and successful implementation.
Training / Education

Introduction to Commercial and Off-Road Vehicle Cooling Airflow Systems

2024-09-12
Vehicle functional requirements, emission regulations, and thermal limits all have a direct impact on the design of a powertrain cooling airflow system. Given the expected increase in emission-related heat rejection, suppliers and vehicle manufacturers must work together as partners in the design, selection, and packaging of cooling system components. The goal of this two-day course is to introduce engineers and managers to the basic principles of cooling airflow systems for commercial and off-road vehicles.
Standard

TOLERANCES, METRIC Aluminum Alloy Drawn Tubing

1994-04-01
MAM2203A
This specification covers established metric manufacturing tolerances applicable to aluminum alloy drawn tubing ordered to metric dimensions. These tolerances apply to all conditions, unless otherwise noted. The term "excl" applies only to the higher figure of the specified range.
Standard

TOLERANCES, METRIC Aluminum Alloy Drawn Tubing

2002-07-23
MAM2203
This specification covers established metric manufacturing tolerances applicable to aluminum alloy drawn tubing ordered to metric dimensions. These tolerances apply to all conditions, unless otherwise noted. The term "excl" applies only to the higher figure of the specified range.
Standard

LOGICAL SOFTWARE PART PACKAGING FOR TRANSPORT

2020-11-16
CURRENT
ARINC641-1
The purpose of this standard is to provide a method for packaging aircraft software parts for distribution using contemporary media or by electronic distribution. This project intends to standardize and provide guidance for the storage of floppy based software, currently packaged in media set parts. This standard format can be then stored or distributed on a single physical media member (CD-ROM), or by electronic crate. The obsolescence of floppy disks drive an urgent need for this guidance.
Standard

Manufacturing Message Specification – Service Definition and Protocol

2016-06-28
CURRENT
EIA511
The Manufacturing Message Specification is an application layer Standard designed to support messaging communications to and from programmable devices in a Computer Integrated Manufacturing (CIM) environment. This environment is referred to in this Standard as the manufacturing environment. This Standard does not specify a complete set of services for remote programming of devices, although provision of such a set of services may be the subject of future standardization efforts.
Video

High Temperature Power Device and Packaging - The Technology Leap to Achieve Cost, Power Density and Reliability Target

2011-11-07
The three major challenges in the power electronics in hybrid and electric vehicles are: System cost, power density and reliability. High temperature power device and packaging technologies increases the power density and reliability while reducing system cost. Advanced Silicon devices with synthesized high-temperature packaging technologies can achieve junction temperature as high as 200C (compared to the present limitation of 150C) eliminating the need for a low-temperature radiator and therefore these devices reduces the system cost. The silicon area needed for a power inverter with high junction temperature capability can be reduced by more than 50 - 75% thereby significantly reducing the packaging space and power device and package cost. Smaller packaging space is highly desired since multiple vehicle platforms can share the same design and therefore reducing the cost further due to economies of scale.
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