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The Intelligent Ground Vehicle Competition (IGVC) is a multidisciplinary exercise in product realization for college engineering students. They design, build, and compete with autonomous vehicles in events ranging from lane following, obstacle avoidance, platooning, to Global Positioning System (GPS) navigation. Technologies involved include electronic controls, computer-based vision systems, object detection, rangefinding, and global positioning. The real world applications are in intelligent transportation systems, the military, and manufacturing automation. Students have been creative and have learned a great deal. Industry recruiters have been highly supportive.

Voltage and current surges are a major concern when it comes to ensuring the functional integrity of electrical and electronic components and modules in an automobile system. This paper presents a computer simulation study for analyzing the effect of high voltage spikes and current load dump on a new Integrated Driver/Receiver (IDR) IC, currently being developed for a J1850 Data Communication Bus in an automobile. It describes the modeling and simulation of the protection structure proposed for the device. The simulation study yields a prediction of current and voltage capability of the protection circuit based on thermal breakdown and transient responses of the circuit. Two levels of modeling, namely, the behavioral level model and the component level model, are used to generate the simulation results. Experimental data will be acquired and used to validate the simulation model when the actual device becomes available.