This specification covers an electrically-conductive adhesive supplied as two components, a silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
This specification covers an electrically-conductive adhesive supplied as two components, a silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
This specification covers an electrically-conductive adhesive supplied as two components, a silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
This specification covers an electrically-conductive adhesive supplied as two components, a silver-filled, epoxy-base adhesive and a separate curing agent which may be paste or liquid.
This specification covers honeycomb core made of polyamide paper sheets in a non-hexagonal, flexible cell configuration and supplied in the form of blocks, slices, and ordered shapes.
This specification covers honeycomb core made of polyamide paper sheets in a non-hexagonal, flexible cell configuration and supplied in the form of blocks, slices, and ordered shapes.
This specification covers filled, resinous, thermosetting compounds capable of being applied and cured in place between the surfaces of mechanically fastened (joined) structures.
This specification covers filled, resinous, thermosetting compounds capable of being applied and cured in place between the surfaces of mechanically fastened (joined) structures.
This specification covers filled, thermosetting resin compounds capable of being applied and cured in place between the surfaces of mechanically fastened (joined) structures.