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Trans Tech recently debuted the all-electric eTrans school bus providing a total zero emission school bus. The presentation will demonstrate Smith Electric Vehicles and their history with electric vehicles. The presentation will help ensure that everybody has an idea of what the electric school bus will do and to dispel any rumors about the vehicle. Presenter Brian S. Barrington, Trans Tech. Bus

This paper discusses the RDC method utilizing delta-sigma analog-to-digital converter hardware module (DSADC) integrated in the Infineon's microcontroller family. With its higher resolution capability when compared to the regularly used ADC with successive-approximation (SAR), DSADC seems to have more potential. On the other hand, DSADC's inherent properties, such as asynchronous sampling rate and group delay, which when not handled properly, would have negative effects to the rotor positioning system. The solution to overcome those side-effects involves utilization of other internal microcontroller's resources such as timers and capture units, as well as additional software processing run inside CPU. The rotor positioning system is first modeled and simulated in high-level simulation language environment (Matlab and Simulink) in order to predict the transient- and steady state behaviors. The group delay itself is obtained by simulating the model of DSADC module implementation.

In-vehicle communication faces increasing bandwidth demands, which can no longer be met by today's MOST150, FlexRay or CAN networks. In recent years, Fast Ethernet has gained a lot of momentum in the automotive world, because it promises to bridge the bandwidth gap. A first step in this direction is the introduction of Ethernet as an On Board Diagnostic (OBD) interface for production vehicles. The next potential use cases include the use of Ethernet in Driver Assistance Systems and in the infotainment domain. However, for many of these use cases, the Fast Ethernet solution is too slow to move the huge amount of data between the Domain Controllers, ADAS Systems, Safety Computer and Chassis Controller in an adequate way. The result is the urgent need for a network technology beyond the Fast Ethernet solution. The question is: which innovation will provide enough bandwidth for domain controllers, fast flashing routines, video data, MOST-replacement and internal ECU buses?

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers with incredible levels of peripheral integration. As a result, performance can no longer be measured in MIPS (Millions of Instructions Per Second). A microcontroller's effectiveness is based on coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, the designer needs benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment.

Today the majority of power electronics is developed based on the requirements set by the main fields of application e.g. power generation, power supply, industrial drive and traction. With introduction to automotive applications new requirements have to be taken into account. This paper discusses how interconnection technologies for power semiconductors can be improved to meet the demand for higher temperature capability in HEV applications.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers whose performance can no longer be measured in MIPS. Instead, their effectiveness is based on a coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, what the designer needs are benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment. This presentation will explore the role of new benchmarks in the development of complex automotive applications.

The increasingly stringent requirements in relation to emission reduction and onboard diagnostics are pushing the Chinese automotive industry toward more innovative solutions and a rapid increase in electronic control performance. To manage the system complexity the architecture will require being well structure on hardware and software level. The paper introduces GEMS-K1 (Gasoline Engine Management System - Kit 1). GEMS-K1 is a platform being compliant with Euro IV emission regulation for gasoline engines. The application software is developed using modeling language, the code is automatically generated from the model. The driver software has a well defined structure including microcontroller abstraction layer and ECU abstraction layer. The hardware is following design rules to be robust, 100% testable and easy to manufacture. The electronic components use the latest innovation in terms of architecture and technologies.

This paper considers the verification of non-standard CAN network topologies of the physical layer at high speed transmission rate (500.0Kbps and 1.0Mbps). These network topologies including single star, multiple stars, and hybrid topologies (multiple stars in combination with linear bus or with ring topology) are simulated by using behavior modeling language (VHDL-AMS) in comparison to measurement. Throughout the verification process, CAN transceiver behavioral model together with other CAN physical layer simulation components have been proved to be very accurate. The modeling of measurement environment of the CAN network is discussed, showing how to get the measurement and simulation results well matched. This demonstrates that the simulation solution is reliable, which is highly desired and very important for the verification requirement in CAN physical layer design.

Infineon's latest high-end automotive microcontrollers like TC1796 are complex Systems On Chip (SoC) with two processor cores and up to two internal multi-master buses. The complex interaction between cores, peripherals and environment provides a big challenge for debugging. For mission critical control like engine management the debugging approach must not be intrusive. The provided solution are dedicated Emulation Devices which are able to deal with several 10 Gbit/s of raw internal trace data with nearly no cost adder for mass production and system design. Calibration, which is used later in the development cycle, has different requirements, but is covered by the Emulation Devices as well. The architecture of TC1796ED comprises the unchanged TC1796 silicon layout, extended by a full In-Circuit Emulator (ICE) and calibration overlay memory on the same die. In most cases, the only debug/calibration tool hardware needed is a USB cable.

The increasing legal requirements for safety, emission reduction, fuel economy and onboard diagnosis systems push the market for more innovative solutions with rapidly increasing complexity. Hence, the embedded systems that will have to control the automobiles have been developed at such an extent that they are now equivalent in scale and complexity to the most sophisticated avionics systems. This paper will demonstrate the key elements to provide a powerful, scalable and configurable solution that offers a migration pass to evolution and even revolution of automotive Sensors and Sensor interfaces. The document will explore different architectures and partitioning. Sensor technologies such as magnetic field sensors based on the hall effect as well as bulk and surface silicon micro machined sensors will be mapped to automotive applications by examples. Functions such as self-test, self-calibration and self-repair will be developed.

As the demand for enhanced comfort, safety and differentiation with new features continues to grow and as electronics and software enable most of these, the number of electronic units or components within automobiles will continue to increase. This will increase the overall system complexity, specifically with respect to the number of controller actuators such as e-motors. However, hard constraints on cost and on physical boundaries such as maximum power dissipation per unit and pin-count per unit/connector require new solutions to alternative system partitioning. Vehicle manufacturers, as well as system and semiconductor suppliers are striving for increased scalability and modularity to allow for most cost optimal high volume configurations while featuring platform reuse and feature differentiation. This paper presents new semiconductor based approaches with respect to technologies, technology mapping and assembly technologies.

This paper will outline the results of a study performed to analyze the market introduction of x-by-wire applications in the context of weak global industry environment, technological and legislative challenges, standardization issues and end customer benefits. This paper attempts to provide a bird-view on influence factors and impacts for the x-by-wire market, including e.g. the end customer's acceptance and legal environment driving further development in specific areas. Further, major driving forces on semiconductor/component level will be outlined regarding e.g. pin-count, computation performance and heat dissipation, but also possible scenarios and solutions towards safe and efficient system design and partitioning.

Based on the example of a door soft close automatic the potential of integrated system simulation in the automotive systems development is demonstrated. The modeling approach is covering several physical domains like mechanics, electromagnetics and semiconductor physics. With adequate simplifying methods a time efficient model is generated, which allows system optimization in the concept phase. Time consuming redesigns can thus be minimized.

In defining innovative and cost-effective chip sets for future automotive applications, system architects need high-level tools that allow them to rapidly determine the best silicon partitioning for a given application in terms of system performance as well as cost. The tool needs to be flexible, modular, and swift such that the system designer can perform abstract simulation iterations quickly for various functional partitioning scenarios, without requiring excessive computer resources. The tool must also be portable and adaptable to provide a simulation environment suitable to systems- or car-manufacturers for in-depth applications simulation and architecture assessment. The semiconductor component definition process using such a “mission-level” design tool for the automotive application electronic valve will be demonstrated. Methods for the analysis of electronic valve control system architectures using mission-level simulation will be developed.

Functional safe systems fulfilling the ISO 26262 standard are getting more important for automotive applications where additional redundant and diverse functionality is needed for higher rated ASIL levels. This can result in a very complex and expensive system setup. Here we present a sensor product developed according ISO 26262. This sensor product comprises a two channel redundant and also diverse implemented magnetic field sensor concept with linear digital outputs on one monolithically integrated silicon substrate. This sensor is used for ASIL D applications like power-steering torque measurement, where the torque is transferred into a magnetic field signal in a certain magnetic setup, but can also be used in other demanding sensor applications concerning safety. This proposed and also implemented solution is beneficial because of implementation on a single chip in one single chip-package but anyway fulfilling ASIL D requirements on system level.

Driven by the growing internet and remote connectivity of automobiles, combined with the emerging trend to automated driving, the importance of security for automotive systems is massively increasing. Although cyber security is a common part of daily routines in the traditional IT domain, necessary security mechanisms are not yet widely applied in the vehicles. At first glance, this may not appear to be a problem as there are lots of solutions from other domains, which potentially could be re-used. But substantial differences compared to an automotive environment have to be taken into account, drastically reducing the possibilities for simple reuse. Our contribution is to address automotive electronics engineers who are confronted with security requirements. Therefore, it will firstly provide some basic knowledge about IT security and subsequently present a selection of automotive specific security use cases.

The automotive industry experiences a major change as vehicles are gradually becoming a part of the Internet. Security concepts based on the closed-world assumption cannot be deployed anymore due to a constantly changing adversary model. Automotive Ethernet as future in-vehicle network and a new E/E Architecture have different security requirements than Ethernet known from traditional IT and legacy systems. In order to achieve a high level of security, a new multi-layer approach in the vehicle which responds to special automotive requirements has to be introduced. One essential layer of this holistic security concept is to restrict non-authorized access by the deployment of embedded firewalls. This paper addresses the introduction of automotive firewalls into the next-generation domain architecture with a focus on partitioning of its features in hardware and software.

Advanced safety features and new services in connected cars depend on the security of the underlying vehicle functions. Due to the interconnection with the outside world and as a result of being an embedded system a modern vehicle is exposed to both, malicious activities as faced by traditional IT world systems as well as physical attacks. This introduces the need for utilizing hardware-assisted security measures to prevent both kinds of attacks. In this paper we present a survey of the different classes of hardware security devices and depict their different functional range and application. We demonstrate the feasibility of our approach by conducting a case study on an exemplary implementation of a function-on-demand use case. In particular, our example outlines how to apply the different hardware security approaches in practice to address real-world security topics. We conclude with an assessment of today’s hardware security devices.

Integration scenarios for ECU software become more complicated, as more constraints with regards to timing, safety and security need to be considered. Multi-core microcontrollers offer even more hardware potential for integration scenarios. To tackle the complexity, more and more model based approaches are used. Understanding the interaction between the different software components, not only from a functional but also from a timing view, is a key success factor for high integration scenarios. In particular for multi-core systems, an amazing amount of timing data can be generated. Usually a multi-core system handles more software functionality than a single-core system. Furthermore, there may be timing interference on the multicore systems, due to the shared usage of buses, memory banks or other hardware resources.

In modern vehicles, the number of small electrical drive systems is still increasing continuously for blowers, fans and pumps as well as for window lifts, sunroofs and doors. Requirements and operating conditions for such systems varies, hence there are many different solutions available for controlling such motors. In most applications, simple, low-cost DC motors are used. For higher requirements regarding operating time and in stop-start capable systems, the focus turns to highly efficient and durable brushless DC motors with electronic commutation. This paper compares various electronic control concepts from a semiconductor vendor point of view. These concepts include discrete control using relays or MOSFETs. Furthermore integrated motor drivers are discussed, including system-on-chip solutions for specific applications, e.g. specific ICs for window lift motors with LIN interface.