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Honda’s new e-motor magnet aims to mitigate China rare-earth monopoly

2016-07-17
The material—hot deformed neodymium—is being used first in a new permanent-magnet traction motor powering Honda’s 2017 Freed Sport Hybrid compact minivan. Significantly, the material is not a “heavy” rare-earth metal, one that requires “doping” with dysprosium or terium rare earths to achieve high heat-resistance characteristics.
Article

Engineering, simulation, test tools help Bombardier Global 7500 business jet achieve milestones, exceed expectations

2018-06-22
The Global 7500 business jet from Bombardier Inc. in Montreal appears to be on the fast track to entering service, thanks in large part to high-tech engineering design, simulation, and test tools. Bombardier engineers and officials are crediting the program’s extensive use of proven engineering tools, digital simulation, innovative ground testing systems for helping to ensure: a mature aircraft at the start of flight testing, an efficient flight validation program, test aircraft that exceed original performance goals, and completion of one lifetime of simulated flights, which exceeds the requirements at time of certification.
Article

OTA updating brings benefits, challenges

2016-08-14
The race to build up an infrastructure for over-the-air (OTA) updating is heating up as suppliers go all-out to gain a spot in a field that’s expected to see momentous growth.
Article

Molded current sense resistors

2016-08-11
The new SLN5 molded current sense resistor line from KOA Speer Electronics features a 7-watt power rating in 4527 size.
Article

Polymer range for electronics

2016-08-11
Solvay Engineering Plastics, a global specialist in polyamide-based engineering plastics, has developed a new Technyl range for the demanding environment of automotive electronic applications.
Article

Nano Dimension creates the first printed circuit boards with side-mounted features

2019-04-02
Nano Dimension Ltd., an additive electronics provider based in Ness Ziona, Israel, has developed the world’s first side-mounting technology for printed circuit boards (PCBs) produced through additive manufacturing (AM) or “3D-printing.” The side mounted designs allow for more functionality on circuit boards, which will impact Internet of Things (IoT) and Industry 4.0 applications where customized designs and shapes are a growing demand.
Article

Miniature pressure sensor

2016-09-06
Model ASUH miniature hybrid high-integrity pressure transducer from KA Sensors is designed for use in rugged environments from -65 to +300ºF (-54 to +149ºC) and vibration levels of more than 20 g.
Article

Vin dc/dc controller

2016-07-01
Texas Instruments’ 2.2-MHz, dual-channel synchronous buck converter offers a unique set of features designed to significantly reduce electromagnetic interference and high-frequency noise in high-voltage dc/dc step-down applications such as automotive infotainment and high-end cluster power-supply systems.
Article

Thumbs up for gesturing with time-of-flight cameras?

2016-09-01
Time of flight (ToF) cameras are ready to let drivers control some of the many options of today’s infotainment systems with a mere wave of their hand. ToF-based systems can also monitor drivers to see if they’re drowsy or not watching roadways.
Article

Software needs security, and security needs software: a scientific overview

2019-04-22
Software needs security. That's a consequence of using software to control critical systems. It's difficult because software is inherently a complex artifact, even when the code just consists of a single sequential program in a single programming language, with well-defined inputs and outputs. Of course, actual software rarely if ever has such a simple structure. Security needs software. That's a consequence of the complexity just mentioned. No process can ensure security at scale unless it is automated by using software itself: programming languages, verification tools, software platforms.
Article

OneWeb ramps up satellite production with new round of funding

2019-03-21
OneWeb has secured $1.25 billion in its latest funding round. The company, which seeks to deploy a satellite communication network by 2021 that will enable global high-speed, low-latency Internet access, has now raised a total of $3.4 billion to fund its mission. Tokyo-based Softbank Group Corp., Mexico’s Grupos Salinas, San Deigo-based Qualcomm Technologies Inc., and the Government of Rwanda led the last round of funding.
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