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A cooperation of several research partners supported by the German Federal Ministry of Research and Education proposes a new active matrix LED light source. A multi pixel flip chip LED array is directly mounted to an active driver IC. A total of 1024 pixel can be individually addressed through a serial data bus. Several of these units are integrated in a prototype headlamp to enable advanced light distribution patterns in an evaluation vehicle.

This paper will outline the results of a study performed to analyze the market introduction of x-by-wire applications in the context of weak global industry environment, technological and legislative challenges, standardization issues and end customer benefits. This paper attempts to provide a bird-view on influence factors and impacts for the x-by-wire market, including e.g. the end customer's acceptance and legal environment driving further development in specific areas. Further, major driving forces on semiconductor/component level will be outlined regarding e.g. pin-count, computation performance and heat dissipation, but also possible scenarios and solutions towards safe and efficient system design and partitioning.

Automotive powertrain and safety systems under design today are highly complex, incorporating more than one CPU core, running with more than 100 MHz and consisting of several 10 million transistors. Software complexity increases similarly making new methodologies and tools mandatory to manage the overall system. The use of accurate virtual prototypes improves the quality of systems with respect to system architecture design and software development. This approach is demonstrated with the example of the PCP/GPTA subsystem for Infineon's AUDO-NG powertrain controllers.

Integration scenarios for ECU software become more complicated, as more constraints with regards to timing, safety and security need to be considered. Multi-core microcontrollers offer even more hardware potential for integration scenarios. To tackle the complexity, more and more model based approaches are used. Understanding the interaction between the different software components, not only from a functional but also from a timing view, is a key success factor for high integration scenarios. In particular for multi-core systems, an amazing amount of timing data can be generated. Usually a multi-core system handles more software functionality than a single-core system. Furthermore, there may be timing interference on the multicore systems, due to the shared usage of buses, memory banks or other hardware resources.

In Engine Management System, more accurate control is required to improve engine performance. Especially generating the precise ignition signal has a direct effect on better engine performance. In the beginning of this paper, a basic software structure to synchronize the engine crank signal and generate ignition signals will be explained. Several cases which can generate dwell timing error will be introduced based on this software structure. In addition, each impact level for each error case will be described. For cases of major error, compensation ways will be proposed in order to obtain more accurate dwell timing. The compensation ways by both microcontroller hardware and user software will be explained in detail. In conclusion, this paper will show the accuracy of ignition signal which implements proposed compensation ways that can be improved as compared to conventional ignition signal.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers whose performance can no longer be measured in MIPS. Instead, their effectiveness is based on a coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, what the designer needs are benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment. This presentation will explore the role of new benchmarks in the development of complex automotive applications.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers with incredible levels of peripheral integration. As a result, performance can no longer be measured in MIPS (Millions of Instructions Per Second). A microcontroller's effectiveness is based on coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, the designer needs benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment.

This paper outlines the results of a study performed to analyze the mission of TTCAN from applications to products for automotive systems. As commonly acknowledged communication is one of the key elements for future and even present systems such as an automobile. A dramatically increasing number of busses and gateways even in low- to midrange vehicles is putting significant burden upon the validation scenario as well as the cost. Accordingly, numerous new initiatives have been started worldwide in order to find solutions to this; some of them by the definition of enhanced or new protocols. This paper shall have a look particular on the new standard of TTCAN (time-triggered communication on CAN). This protocol is based on the CAN data link layer as specified in ISO 11898-1 and may use standardized CAN physical layers such as specified in ISO 11898-2 (high-speed transceiver) or in ISO 11898-3 (fault-tolerant low-speed transceiver).

Trans Tech recently debuted the all-electric eTrans school bus providing a total zero emission school bus. The presentation will demonstrate Smith Electric Vehicles and their history with electric vehicles. The presentation will help ensure that everybody has an idea of what the electric school bus will do and to dispel any rumors about the vehicle. Presenter Brian S. Barrington, Trans Tech. Bus

Driven by factors like consumption, power output per liter, comfort and more stringent exhaust gas standards the powertain control area, has developed rapidly in the last decades. This trend has also brought with it many innovations in the ignition application. Today we can see a trend to Pencil-coil or Plug-top-coil ignition systems. The next step in system partitioning is to remove the power driver from the ECU and place it directly in/on the coil body. The advantages of the new partitioning - e.g. no high voltage wires, reduced power dissipation on the ECU - are paid with different, mainly tougher requirements for the electronic components. By using specialized technologies for the different functions - IGBT for switching the power, SPT for protection, supply and diagnostics - in chip-on-chip technology all required functions for a decentralized ignition system can be realized in a TO220/ TO263 package.

The number of safety critical automotive applications employing high current brushless motors continues to increase (Steering, Braking, and Transmission etc.). There are many benefits when moving from traditional solutions to electrically actuated solutions. Some of these benefits can include increased fuel economy, simplified vehicle installation and packaging, increased feature set, improved safety and/or convenience, simplified unit assembly and modular testability prior as well as during vehicle manufacturing. The trend to implement brushless motors in these applications (which require electronically controlled commutation) has also brought with it the need for powerful inverters, which primarily consist of Power MOSFETs and MOSFET Driver ICs. This paper reviews the challenges associated with the design of safety critical electronic systems which combine sensing, control and actuation.

ISO 26262 is the actual standard for Functional Safety of automotive E/E (Electric/Electronic) systems. One of the challenges in the application of the standard is the distribution of safety related activities among the participants in the supply chain. In this paper, the concept of a Safety Element out of Context (SEooC) development will be analyzed showing its current problematic aspects and difficulties in implementing such an approach in a concrete typical automotive development flow with different participants (e.g. from OEM, tier 1 to semiconductor supplier) in the supply chain. The discussed aspects focus on the functional safety requirements of generic hardware and software development across the supply chain where the final integration of the developed element is not known at design time and therefore an assumption based mechanism shall be used.

Functional safe systems fulfilling the ISO 26262 standard are getting more important for automotive applications where additional redundant and diverse functionality is needed for higher rated ASIL levels. This can result in a very complex and expensive system setup. Here we present a sensor product developed according ISO 26262. This sensor product comprises a two channel redundant and also diverse implemented magnetic field sensor concept with linear digital outputs on one monolithically integrated silicon substrate. This sensor is used for ASIL D applications like power-steering torque measurement, where the torque is transferred into a magnetic field signal in a certain magnetic setup, but can also be used in other demanding sensor applications concerning safety. This proposed and also implemented solution is beneficial because of implementation on a single chip in one single chip-package but anyway fulfilling ASIL D requirements on system level.

This paper considers the verification of non-standard CAN network topologies of the physical layer at high speed transmission rate (500.0Kbps and 1.0Mbps). These network topologies including single star, multiple stars, and hybrid topologies (multiple stars in combination with linear bus or with ring topology) are simulated by using behavior modeling language (VHDL-AMS) in comparison to measurement. Throughout the verification process, CAN transceiver behavioral model together with other CAN physical layer simulation components have been proved to be very accurate. The modeling of measurement environment of the CAN network is discussed, showing how to get the measurement and simulation results well matched. This demonstrates that the simulation solution is reliable, which is highly desired and very important for the verification requirement in CAN physical layer design.

This paper will give an overview of multicore in automotive applications, covering the trends, benefits, challenges, and implementation scenarios. The automotive silicon industry has been building multicore and multiprocessor systems for a long time. The reasons for this choice have been: increased performance, safety redundancy, increased I/O & peripheral, access to multiple architectures (performance type e.g. DSP) and technologies. In the past, multiprocessors have been mainly considered as multi-die, multi-package with simple interconnection such as serial or parallel busses with possible shared memories. The new challenge is to implement a multicore, micro-processor that combines two or more independent processors into a single package, often a single integrated circuit (IC). The multicores allow a computing device to exhibit some form of thread-level parallelism (TLP).

In modern vehicles, the number of small electrical drive systems is still increasing continuously for blowers, fans and pumps as well as for window lifts, sunroofs and doors. Requirements and operating conditions for such systems varies, hence there are many different solutions available for controlling such motors. In most applications, simple, low-cost DC motors are used. For higher requirements regarding operating time and in stop-start capable systems, the focus turns to highly efficient and durable brushless DC motors with electronic commutation. This paper compares various electronic control concepts from a semiconductor vendor point of view. These concepts include discrete control using relays or MOSFETs. Furthermore integrated motor drivers are discussed, including system-on-chip solutions for specific applications, e.g. specific ICs for window lift motors with LIN interface.

For the past approximately 20 years, the Serial Peripheral Interface (SPI) has been the established standard for serial communication between a host or central microprocessor and peripheral devices. This standard has been used extensively in control modules covering the entire spectrum of automotive applications, as well as non-automotive applications. As the complexity of engine control modules grows, with the number of vehicle actuators being controlled and monitored increasing, the number of loads the central microprocessor has to manage is growing accordingly. These loads are typically controlled using discrete and pulse-width modulated (PWM) outputs from the microcontroller when real-time operation is essential or via SPI when real-time response is not critical. The increase of already high pin-count on microcontrollers, the associated routing effort and demand for connected power stages is a concern of cost and reliability for future ECU designs.

The concept of “Simulatable Specifications” is applied to a Smart Bridge-Driver-IC in order to support an integrated development process of a Direct Injection System. It is demonstrated that the impact of the IC concept on system performance can be investigated long before first Silicon is available. Thus, considerable time in systems development can be saved and, in addition, the feedback loop for conceptual redesigns of the chip is reduced by up to 60 percent.

Based on the example of a door soft close automatic the potential of integrated system simulation in the automotive systems development is demonstrated. The modeling approach is covering several physical domains like mechanics, electromagnetics and semiconductor physics. With adequate simplifying methods a time efficient model is generated, which allows system optimization in the concept phase. Time consuming redesigns can thus be minimized.

The electrification of the powertrain is still one of the main challenges and innovation drivers for modern cars. With the introduction of the Toyota Prius, launched in Japan in 1997 the first commercially available hybrid car in mass production, the development continued towards the BMW i3 launched in July 2013. One main component for all kind of hybrid cars is still the power semiconductor, which is used for DC/DC converters and for the inverter to drive the electric motor for the traction control. What makes the selection of the right power semiconductor complex, is the variety of different voltage levels within the car (from standard 12V board net, the new 48V board net all the way up to 400V and above) plus different requirements in terms of switching and conduction performance, or accordingly power losses. The selection of device by application and voltage will be discussed in this paper.