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A CIG-FIP (Chip In Glass Fluorescent Indicator Panel) with a 128 x 32 dot matrix having a dot size of 0.55 x 0.55 mm2 and a dot pitch of 0.85 mm in the x and y directions was developed. CIG technology is one of the solutions to the problem of a large number of external connections In conventional graphic display panels. 286 external connections for a conventional panel having a 128 x 32 dot matrix are reduced to 22 ones for this device. And the device also offers the advantages of low total system cost, easy assembly, and high reliability.

This paper describes the latest Fluorescent Indicator Panel (FIP) technology, featuring integrated circuits mounted within the vacuum envelope on the glass substrate. This is called Chip-in-Glass FIP, or CIG FIP. The discussion includes basic technologies, design flexibility, reliability, and driver ICs.

The Smart Radiation Device (SRD) which is made from a ceramic material is a thin and light tile. The material undergoes a metal-insulator transition at around 290K and this allows the infrared emissivity of the device to change from low to high as the temperature is increased from 175K to 375K. This is beneficial for thermal control applications on spacecraft. For example, bonded only to the external surface of the spacecraft's instruments, SRD controls the heat radiated to deep space without electrical instruments or mechanical parts used for changing emissivity. It reduces the energy consumption of the electrical heater for thermal control, and decreases the weight and the cost of the thermal control system. In this paper, the design of the new material for SRD and the ground test results such as the radiation tests of electrons and UV will be described.

The Smart Radiation Device (SRD) is a thin and light tile whose infrared emissivity is varied proportionally by the temperature of the radiator. Bonded only to the external surface of the spacecraft’s instruments, it controls the heat radiated to deep space without electrical or mechanical instruments used for changing emissivity. Its function is similar to the thermal louver which has been used for a lot of spacecraft, but the SRD is lighter than it. Thus, by using this new device, we can control the temperature of the instruments on the spacecraft more easily. The materials of the SRD are La0.825Sr0.175MnO3 and La0.7Ca0.3MnO3. In this paper, design and preliminary test results of the SRD will be presented. The optical properties for the materials of the SRD, such as the total hemispherical emittance and the solar absorptance, have been measured. In addition the degradation by protons has been investigated.

The continuously increasing integration level and resultant “system-on-silicon” and customization trends in VLSI technology will have a significant impact on future automotive electronics. The microcomputer, which is the kernel semiconductor device in automotive electronics, reflects the tremds decribed above. As the VLSI integration level increases, reliability or quality issues will become more and more important, because of the increased impact of a possible device failure. This is particularly so in VLSIs for automotive electronics. In this paper, VLSI technology trends and ways for meeting reliability or quality goals will be reviewed. Also it outlines a future look at automotive electronics in the 21st century, based on a system-on-silicon microcomputer chip, in which several processor units with different functions are integrated together by ULSI technology, where more than ten million device elements are integrated within a single silicon chip with low submicron feature size.

The Fluorescent Indicator Panel (FIP™) is now widely used in many applications due to its bright, eye pleasing color and readability while driving. Due to its construction, the surface light emitting FIP, gives a wider viewing angle. The multi-colored surface light emitting FIP was developed to offer a better looking and more versatile display. The principle, approach, characteristics, and reliability of multi-colored surface light emitting FIPs, specifically for automotive use, will be discussed.