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The EMI coupling mechanisms of a DC-DC converter in electrified vehicles are investigated for both conducted and radiated EMI. The noise sources and propagation paths are identified and quantified. The results show that the magnetic coupling between noise sources to some sensitive locations, including HV/LV terminals and CAN connector, can cause excessive emissions. The coupling between different components of the EMI filters may also lead to the degradation of the filter performances. Strategies are proposed to reduce the coupling, improve the filter performance and mitigate the emissions. The performances are verified in experiment.

SiC devices have inherent fast switching capabilities due to their superior material properties, and are considered potential candidates to replace Si devices for traction inverters in electrified vehicles in future. However, due to the comparatively low gate threshold voltage, SiC devices may encounter oscillatory false triggering especially during fast switching. This paper analyzed the causes of false triggering, and also studied the impact of a critical parasitic parameter - common source inductance. It is shown that crosstalk is the main cause for the false triggering in the case and some positive common source inductance help to mitigate the crosstalk issue. A packaging layout method is proposed to create the positive common source inductance through layout of control terminals / busbars, and/or the use of control terminal bonded wires at different height.

In this paper, the high-temperature capability of the traction inverter was investigated by applying coolant with temperature much higher than the typical allowed value until the system fails. The purpose of this study is to identify the weakest link of the traction inverter system in terms of temperature. This study was divided into two stages. In the first stage, a series of nondestructive tests were carried out to investigate temperature rise (ΔT) of the key component above coolant temperature as a function of the outside controllable parameters-i.e., dc link voltage, phase current, and switching frequency. The key components include power modules, gate driver board, gate driver power supply, current sensors and dc link capacitor. Their temperatures were monitored by thermocouples or on-die temperature sensors.