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Standard

Adhesive, Film Form Metallic Structural Sandwich Construction

2022-10-04
CURRENT
AMSA25463
This specification covers the requirements for adhesives in film form for bonding metal facings to metal cores and to metal components of sandwich panels which are intended for use in primary and secondary structural airframe parts that may be exposed to temperatures up to 500°F (260°C).
Standard

Application of Direct Pressure to Resin in Curing of Epoxy and Addition Type Polyimides

2022-06-07
CURRENT
ARP1927
This recommended practice describes the materials, related equipment, and particular processing techniques utilized in process science curing of composite hardware where pressure is imparted specifically to the resin of curing composites. Included as Appendix "A" to this ARP is a discussion of the particular techniques developed for a processing science philosophy which has consistently produced void and porosity-free, large area, thick composite structures.
Standard

Cure Monitor, Electrical Methods

2022-06-07
CURRENT
ARP1926
This document describes a standard method to collect and report dielectric data for the purpose of monitoring or studying the cure of composites.
Standard

Automated Manufacture of Continuous Multi-Ply Carbon Fiber/Epoxy Resin Impregnated Broadgoods

2022-06-05
CURRENT
ARP1674A
This document describes a manufacturing method for processing unidirectional carbon fiber/epoxy resin impregnated sheet and tape into multi-ply broadgoods and tape produced on an automated cross-plying machine. Broadgoods or tape of two or more ply configurations may be processed, where ply orientations of 0°, 45°, 90°, and 135° (as examples) may be automatically layed in a programmed sequence. In all configurations, the 0° ply direction is parallel to the length of the broadgoods roll or sheet, or tape.
Standard

Polyimide Printed Circuit Boards Fabrication of

2022-06-05
CURRENT
ARP1612A
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.
Standard

Physical-Chemical Characterization Techniques, Epoxy Adhesive and Prepreg Resin Systems

2022-06-05
CURRENT
ARP1610A
This recommended practice describes the physical and chemical characterization techniques for identification of epoxy adhesive and prepreg resin systems in order to verify the chemical formulation, resin B-staging (See 8.1), cure reaction rates, adhesive moisture content, and resin component mix ratios, as necessary to achieve manufacturing and quality producibility and engineering performance.
Standard

350 °F Autoclave Cure, Low Flow Toughened Epoxy Prepregs, Type 38, Class 2, Grade 193, Style 3K-70-PW, Fiber 1

2019-03-12
WIP
AMS3961/1A
The intent of this specification is for the procurement of the material listed on the QPL and, therefore, no qualification or equivalency threshold values are provided. Users that intend to conduct a new material qualification or equivalency program shall refer to the Quality Assurance section of the base specification, AMS3961. All material qualification and equivalency data has been archived and is available for review upon request. Contact the CMH-17 Secretariat (www.cmh17.org) for additional information.
Standard

350 °F Autoclave Cure, Low Flow Toughened Epoxy Prepregs, Type 35, Class 1, Grade 190, Fiber 2

2019-03-12
WIP
AMS3961/2A
The intent of this specification is for the procurement of the material listed on the QPL and, therefore, no qualification or equivalency threshold values are provided. Users that intend to conduct a new material qualification or equivalency program shall refer to the Quality Assurance section of the base specification, AMS3961. All material qualification and equivalency data has been archived and is available for review upon request. Contact the CMH-17 Secretariat (www.cmh17.org) for additional information.
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