This specification covers the requirements for adhesives in film form for bonding metal facings to metal cores and to metal components of sandwich panels which are intended for use in primary and secondary structural airframe parts that may be exposed to temperatures up to 500°F (260°C).
This recommended practice describes the materials, related equipment, and particular processing techniques utilized in process science curing of composite hardware where pressure is imparted specifically to the resin of curing composites. Included as Appendix "A" to this ARP is a discussion of the particular techniques developed for a processing science philosophy which has consistently produced void and porosity-free, large area, thick composite structures.
This document describes a manufacturing method for processing unidirectional carbon fiber/epoxy resin impregnated sheet and tape into multi-ply broadgoods and tape produced on an automated cross-plying machine. Broadgoods or tape of two or more ply configurations may be processed, where ply orientations of 0°, 45°, 90°, and 135° (as examples) may be automatically layed in a programmed sequence. In all configurations, the 0° ply direction is parallel to the length of the broadgoods roll or sheet, or tape.
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.
This recommended practice describes the physical and chemical characterization techniques for identification of epoxy adhesive and prepreg resin systems in order to verify the chemical formulation, resin B-staging (See 8.1), cure reaction rates, adhesive moisture content, and resin component mix ratios, as necessary to achieve manufacturing and quality producibility and engineering performance.
This specification covers an adhesive compounded from modified epoxy resins in ready-to-use film supplied in rolls or sheets, either supported by mat or by woven monofilaments or unsupported.
This specification and its supplementary detail specifications cover film adhesives compounded from modified epoxy resins in the form of ready-to-use sheet, supplied in rolls, either supported by mat or by woven monofilaments or unsupported.
This specification covers an adhesive compounded from modified epoxy resins in ready-to-use film supplied in rolls or sheets, either supported by mat or by woven monofilaments or unsupported.
This specification covers an adhesive compounded from modified epoxy resins in ready-to-use film supplied in rolls or sheets, either supported by mat or by woven monofilaments or unsupported.
This specification covers an adhesive compounded from modified epoxy resins in ready-to-use film, supplied in rolls or sheets, either supported by mat or by woven monofilaments or unsupported.
This specification establishes the requirements for a nominal 250 °F cure epoxy preimpregnated carbon fiber plain weave fabric product. The prepreg is a plain weave fabric with 12K tows, a nominal fiber areal weight of 193 gsm, and nominal resin content of 42%.
This specification covers one type of glass cloth impregnated with a heat-reactive, thermosetting, solution-addition-type PMR-15 polyimide resin system, supplied in the form of continuous rolls of full width cloth or slit tape.
This specification establishes the requirements for a nominal 250 °F cure epoxy preimpregnated carbon fiber plain weave fabric product. The prepreg is a plain weave fabric with 12K tows, a nominal fiber areal weight of 193 gsm, and nominal resin content of 42%.