This specification covers the requirements for adhesives in film form for bonding metal facings to metal cores and to metal components of sandwich panels which are intended for use in primary and secondary structural airframe parts that may be exposed to temperatures up to 500°F (260°C).
This specification covers expanded honeycomb core made from glass fabric impregnated with phenolic resin and oriented so the fabric weave is on the 45-degree bias with the ribbon direction and supplied in the form of blocks, slices, and ordered shapes.
This specification covers honeycomb core made of glass fabric impregnated with phenolic resin and supplied in the form of blocks, slices, and ordered shapes.
This specification and its supplementary detail specifications cover corrosion-inhibiting, modified epoxy primers in the form of ready-to-use sprayable liquids.
This specification covers expanded honeycomb core made of glass cloth impregnated with polyimide resin and supplied in the form of blocks, slices, and ordered shapes.
This recommended practice describes the materials, related equipment, and particular processing techniques utilized in process science curing of composite hardware where pressure is imparted specifically to the resin of curing composites. Included as Appendix "A" to this ARP is a discussion of the particular techniques developed for a processing science philosophy which has consistently produced void and porosity-free, large area, thick composite structures.
This document describes a manufacturing method for processing unidirectional carbon fiber/epoxy resin impregnated sheet and tape into multi-ply broadgoods and tape produced on an automated cross-plying machine. Broadgoods or tape of two or more ply configurations may be processed, where ply orientations of 0°, 45°, 90°, and 135° (as examples) may be automatically layed in a programmed sequence. In all configurations, the 0° ply direction is parallel to the length of the broadgoods roll or sheet, or tape.
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.
This recommended practice describes the physical and chemical characterization techniques for identification of epoxy adhesive and prepreg resin systems in order to verify the chemical formulation, resin B-staging (See 8.1), cure reaction rates, adhesive moisture content, and resin component mix ratios, as necessary to achieve manufacturing and quality producibility and engineering performance.
This specification covers an adhesive compounded from modified epoxy resins in ready-to-use film supplied in rolls or sheets, either supported by mat or by woven monofilaments or unsupported.
This specification and its supplementary detail specifications cover film adhesives compounded from modified epoxy resins in the form of ready-to-use sheet, supplied in rolls, either supported by mat or by woven monofilaments or unsupported.
This specification covers an adhesive compounded from modified epoxy resins in ready-to-use film supplied in rolls or sheets, either supported by mat or by woven monofilaments or unsupported.
This specification covers an adhesive compounded from modified epoxy resins in ready-to-use film supplied in rolls or sheets, either supported by mat or by woven monofilaments or unsupported.
This specification covers an adhesive compounded from modified epoxy resins in ready-to-use film, supplied in rolls or sheets, either supported by mat or by woven monofilaments or unsupported.