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Magazine

Tech Briefs: September 2018

2018-09-01
Enhanced SATCOMs for Unmanned Aerial Systems The Bus Too Tough to Die Combating Infrared Threats on the Battlefield Optical Interconnect Design Challenges in Space High-Performance Computing for the Next-Generation Combat Vehicle Merging Antenna and Electronics Boosts Energy and Spectrum Efficiency Integrated Magneto-Optical Devices for On-Chip Photonic Systems Development of magneto-optical (MO) materials could lead to a range of nonreciprocal optical devices for emerging standardized photonic integrated circuit (PIC) fabrication processes. Low Power Optical Phase Array Using Graphene on Silicon Photonics Electrostatic doping of 2D materials embedded in waveguides could enable ultrafast devices with unprecedented power. Spatial Resolution and Contrast of a Focused Diffractive Plenoptic Camera New technology captures spectral and spatial information of a scene in one snapshot while raising pixel counts and improving image quality.
Magazine

Tech Briefs: May 2018

2018-05-01
New Technologies Tackle UAV Challenges Robotic Applique Kits Leverage Existing Assets Educating UGVs Implementing AI Advancements in Thermal Image Training Data Sets Protecting Critical Data on Unmanned Underwater Platforms Advancements Made to the Wingman Software-in-the-Loop (SIL) Simulation: How to Operate the SIL New features include the creation of virtual environments that match real-world gunnery test courses. Soldier-Robot Team Communication: An Investigation of Exogenous Orienting Visual Display Cues and Robot Reporting Preferences The effective use of robots to conduct dangerous missions depends on accurate man-machine communications. Soft Robotic Fish Swims Alongside Real Ones in Coral Reefs GPS Enabled Semi-Autonomous Robot Combining GPS signals with acoustic and encoder data gives a robot the ability to determine its location and orientation within a reference frame.
Magazine

Tech Briefs: June 2018

2018-06-01
Beyond VMEbus - A New Concept Taming the Thermal Behavior of Solid-State Military Lasers Solving the Challenge of Thermal Design in Aerospace Electronics Improving Component Life in Abrasive, Corrosive Aerospace Environments New Pulse Analysis Techniques for Radar and EW Validation of Ubiquitous 2D Radar Converting Existing Copper Wire Firing System to a Fiber-Optically Controlled Firing System for Electromagnetic Pulsed Power Experiments Technological improvements make pulsed-power experiments with gunpowder- or air-driven guns safer. Low-Cost Ground Sensor Network for Intrusion Detection COTS-based system could provide increased level of security with less manpower. In-Network Processing on Low-Cost IoT Nodes for Maritime Surveillance Commercially available system of distributed wireless sensors could increase the Navy's intelligence collection footprint.
Article

SAE International extends call for abstracts, seeks submissions for AeroTech conference

2022-08-11
Engineering Events staff at SAE International in Warrendale, Pennsylvania, have extended the call for abstracts through September 21 for the organization’s AeroTech aerospace and defense technology conference, which will take place at the Fort Worth Convention Center in Fort Worth, Texas, March 14-16, 2023. Visit the AeroTech call for abstracts page for more information and to get started.
Article

Quality management experts provide guidance on AS9100 standard

2021-11-04
Quality management professionals across the global aerospace and defense community are convening for one hour – Wednesday, October 27th, starting at 10 am Pacific Daylight Time (PDT) – to discuss the AS9100 international standard. Register to take part in the free AeroTech webinar, hosted by SAE International and Tektronix, designed to help manufacturers, contractors, and subcontractors throughout the global aviation, space, and defense supply chain keep pace with and meet the requirements of AS9100 international quality management system standard.
Research Report

Process Control for Defect Mitigation in Laser Powder Bed Fusion Additive Manufacturing

2023-05-15
EPR2023011
Success in metal additive manufacturing (AM) relies on the optimization of a large set of process parameters to achieve materials whose properties and performance meet design and safety requirements. Despite continuous improvements in the process over the years, the quality of AM parts remains a major concern for manufacturers. Today, researchers are starting to move from discrete geometry-dependent build parameters to continuously variable or dynamically changing parameters that are geometry- and scan-path aware. This approach has become known as “feedforward control.” Process Control for Defect Mitigation in Laser Powder Bed Fusion Additive Manufacturing discusses the origins of feedforward control, its early implementations in AM, the current state of the art, and a path forward to its broader adoption. Click here to access the full SAE EDGETM Research Report portfolio.
Standard

Perspectives on Integrating Structural Health Monitoring Systems into Fixed-Wing Military Aircraft

2019-09-18
CURRENT
AIR6245
This SAE Aerospace Information Report (AIR) is prepared for stakeholders seeking information about the evolution, integration, and approval of SHM technologies for military aircraft systems. The report provides this information in the form of (a) two military organizations’ perspectives on requirements, and (b) general SHM challenges and industry perspectives. The report only provides information to generate awarness of prespectives for military aircraft and, hence, assists those who are involved in developing SHM systems understanding the broad range of regulations, requirements, and standards published by military organizations that are available in the public domain from the military organizations.
Standard

NATIONAL AEROSPACE AND DEFENSE CONTRACTORS ACCREDITATION PROGRAM REQUIREMENTS FOR NONCONVENTIONAL MACHINING

2002-02-01
HISTORICAL
AS7116
This Aerospace Standard (AS) establishes the requirements for suppliers of Nonconventional Machining Services to be accredited by the National Aerospace and Defense Contractors Accreditation Program (NADCAP). NADCAP accreditation is granted in accordance with SAE AS7003 after demonstration of compliance with the requirements herein. The requirements may be supplemented by additional requirements specified by the NADCAP Nonconventional Machining and Surface Enhancement (NMSE) Task Group. Using the corresponding Audit Criteria (PRI AC7116) will ensure that accredited Nonconventional Machining suppliers meet all of the requirements in this standard and all applicable supplementary standards. The purpose of this audit program is to assess a supplier's ability to consistently provide a product or service that conforms to the technical specifications and customer requirements.
Standard

JAUS Mobility Service Set

2023-10-06
CURRENT
AS6009A
This document defines a set of standard application layer interfaces called JAUS Mobility Services. JAUS Services provide the means for software entities in an unmanned system or system of unmanned systems to communicate and coordinate their activities. The Mobility Services represent the vehicle platform-independent capabilities commonly found across all domains and types of unmanned systems (referred to as UxVs). At present, over 15 services are defined in this document many of which were updated in this revision to support Unmanned Underwater Vehicles (UUVs).
Standard

IEEE-1394b for Military and Aerospace Vehicles - Applications Handbook

2019-08-12
CURRENT
AIR5654A
This Handbook is intended to accompany or incorporate AS5643, AS5643/1, AS5657, AS5706, and ARD5708. In addition, full understanding of this Handbook also requires knowledge of IEEE-1394-1995, IEEE-1394a, and IEEE-1394b standards. This Handbook contains detailed explanations and architecture analysis on AS5643, bus timing and scheduling considerations, system redundancy design considerations, suggestions on AS5643-based system configurations, cable selection guidance, and lessons learned on failure modes.
Technical Paper

Built-In-Test for Fiber Optic Links

2023-03-07
2023-01-1019
This work covers the historical development of Built-In-Test (BIT) for fiber optic interconnect links for aerospace applications using Optical Time Domain Reflectometry (OTDR) equipped transceivers. The original failure modes found that installed fiber optic links must be disconnected before diagnosis could begin, often resulting in “no fault found” (NFF) designation. In fact, the observed root cause was that most (85%) of the fiber optic link defects were produced by contamination of the connector end faces. In March of 2006, a fiber optics workshop was held with roughly sixty experts from system and component manufacturers to discuss the difficulties of fiber optic test in aerospace platforms. During this meeting it was hypothesized that Optical Time Domain Reflectometry (OTDR) was feasible using an optical transceiver transmit pulse as a stimulus. The time delay and amplitude of received reflections would correlate with the position and severity of link defects, respectively.
Article

Advanced simulation using the digital twin to achieve electromagnetic compatibility and electrification management in a modern UAS

2022-01-13
The aerospace industry is facing immense challenges due to increased design complexity and higher levels of integration, particularly in the electrification of aircraft. These challenges can easily impact program cost and product time to market. System electrification and electromagnetic compatibility (EMC) have become critical issues today. In the context of 3D electromagnetics, EMC electromagnetic compatibility ensures the original equipment manufacturer (OEM) that radiated emissions from various electronic devices, such as avionics or the entire aircraft for that matter, do not interfere with other electronic products onboard the aircraft.
Journal Article

A Novel Cloud-Based Additive Manufacturing Technique for Semiconductor Chip Casings

2022-08-02
Abstract The demand for contactless, rapid manufacturing has increased over the years, especially during the COVID-19 pandemic. Additive manufacturing (AM), a type of rapid manufacturing, is a computer-based system that precisely manufactures products. It proves to be a faster, cheaper, and more efficient production system when integrated with cloud-based manufacturing (CBM). Similarly, the need for semiconductors has grown exponentially over the last five years. Several companies could not keep up with the increasing demand for many reasons. One of the main reasons is the lack of a workforce due to the COVID-19 protocols. This article proposes a novel technique to manufacture semiconductor chips in a fast-paced manner. An algorithm is integrated with cloud, machine vision, sensors, and email access to monitor with live feedback and correct the manufacturing in case of an anomaly.
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